IEEE Transactions on Components, Packaging and Manufacturing Technology

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• 3-D Printed Metal-Pipe Rectangular Waveguides

Publication Year: 2015, Page(s):1339 - 1349
Cited by:  Papers (81)
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This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost ... View full abstract»

• A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Publication Year: 2018, Page(s):1281 - 1291
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A broadband, low-cost, high-gain, multilayer differential antenna without air cavity is proposed for the 60-GHz phased array system. By using the standard low-cost printed circuit board process, a 60-GHz phased array antenna element and a 16-element phased array antenna prototype are implemented. To improve the bandwidth and antenna gain, a superstrate and a float rectangular ring are designed. Th... View full abstract»

• Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Publication Year: 2017, Page(s):1891 - 1898
Cited by:  Papers (1)
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The use of additive manufacturing (AM) techniques for the fabrication of 3-D fractal monopole antennas is presented. The 3-D printing (3-D P) of 3-D designs based on the Sierpinski fractal concept is studied, and the performance discussed. The AM allows the fabrication of the complex features of these antennas. The specific structures, on the other hand, provide a reduction of the material used in... View full abstract»

• A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Publication Year: 2017, Page(s):964 - 973
Cited by:  Papers (8)
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A 2×2 dual-polarized antenna subarray with filtering responses is proposed in this paper. This antenna subarray is a multilayered 3-D geometry, including a dual-path 1× 4 feeding network and four cavity-backed slot antennas. The isolation performance between two input ports is greatly improved by a novel method, which only needs to modify several vias in a square resonator. Cavities in the feeding... View full abstract»

• Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Publication Year: 2018, Page(s):1 - 7
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This paper presents a bandwidth-enhanced, low-cost, compact, inkjet-printed multilayer microstrip fractal patch antenna for integration into flexible and conformal devices. The antenna consists of two layers of patches, with the first layer inkjet-printed directly on a 0.125-mm (only 0.005 of the operating wavelength) Kapton polyimide substrate. On top of it, a 0.12-mm-thick SU-8 polymer is covere... View full abstract»

• Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Publication Year: 2018, Page(s):991 - 1002
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The design, materials, process, fabrication, and reliability of fan-out wafer-level packaging (FOWLP) with chip-first and die face-up method are investigated in this paper. Emphasis is placed on the issues and their solutions (such as reconstituted carrier, die-attach film placement, pitch compensation, die shift, epoxy molding compound dispensing, compression molding, warpage, and Cu revealing) d... View full abstract»

• Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Publication Year: 2018, Page(s):73 - 81
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In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a ... View full abstract»

• Mode-Selective Transmission Line for Chip-to-Chip Terabit-per-Second Data Transmission

Publication Year: 2018, Page(s):1272 - 1280
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The recently developed mode-selective transmission line (MSTL) is proposed and exploited as an alternative approach to accommodate the growing and future ultrafast interconnects requirements of ultralarge-scale integration for high density, speed, performance, and bandwidth (BW). A parametric study is performed to optimize the MSTL structure for high-speed global interconnects and to provide high-... View full abstract»

• Wideband and Ultrawideband Phase Shifter Designs Based on Low-Pass/Bandpass/High-Pass Networks

Publication Year: 2018, Page(s):1056 - 1065
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This paper presents the design of wideband and ultrawideband 90° phase shifters using coupled-line sections and low-pass/bandpass/high-pass networks with inductors and capacitors. By relaxing the tight-coupling requirement, the proposed phase shifters are realized with much easier fabrication process. It is demonstrated how the embedded low-pass/bandpass/high-pass networks make the phase shifters ... View full abstract»

• Signal Integrity Design and Analysis of Differential High-Speed Serial Links in Silicon Interposer With Through-Silicon Via

Publication Year: 2018, Page(s):1 - 15
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In this paper, we, for the first time, designed and analyzed differential high-speed serial links of the silicon interposer including differential through-silicon-via (TSV) channels for a high-bandwidth memory (HBM) graphic module. The meshed ground plane and various parameters were considered in designing the silicon interposer. In addition, superior designs were proposed to improve signal integr... View full abstract»

• Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities

Publication Year: 2017, Page(s):956 - 963
Cited by:  Papers (10)
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The contribution of this paper is to propose novel balanced and dual-band bandpass filters (BPFs), using quarter-mode (QM) and eighth-mode (EM) substrate integrated waveguide (SIW) cavities, for the size reduction of the overall circuit. Two balanced BPFs, which separately demonstrate a third-order Chebyshev response and a fourth-order quasi-elliptic response, are realized by properly choosing, fe... View full abstract»

• Expected Failures in 3-D Technology and Related Failure Analysis Challenges

Publication Year: 2018, Page(s):711 - 718
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After an introduction to 3-D technology, and through silicon via (TSV)- and stacking options, this paper provides an overview of failures that can be expected in 3-D technology and lists the potential failure analysis (FA) techniques that can be applied to find these failures and the related challenges. Various failure mechanisms and effects that can be expected in TSVs, such as Cu pumping, voids,... View full abstract»

• Die Attach Materials for High Temperature Applications: A Review

Publication Year: 2011, Page(s):457 - 478
Cited by:  Papers (139)
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The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching s... View full abstract»

• High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Publication Year: 2011, Page(s):181 - 195
Cited by:  Papers (213)  |  Patents (2)
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We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic <i>RLGC</i> equations derived from the physical configuration. Each ... View full abstract»

• Printing Green Nanomaterials for Organic Electronics

Publication Year: 2018, Page(s):1307 - 1315
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Organic electronics have attracted increasing attention in recent years because of their large-scale production potential. In this context, inkjet printing as a scalable manufacturing process is well positioned for supporting the fabrication of organic electronics. In this paper, we propose a green substrate and functional inks based on bionanomaterials for fabricating dielectric and conductive la... View full abstract»

• Package Inductors for Intel Fully Integrated Voltage Regulators

Publication Year: 2016, Page(s):3 - 11
Cited by:  Papers (15)
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Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the construction of these inductors including representative results from production pack... View full abstract»

• Plasma-Generated Etchback to Improve the Via-Reliability in High-Tg Substrates Used in Multilayer PWBs for Space Electronic Packaging

Publication Year: 2016, Page(s):926 - 932
Cited by:  Papers (1)
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High-Tg (glass transition temperature, 210°C) woven fiber-glass reinforced multifunctional-epoxy FR-4 laminates are now becoming main trend in the fabrication of multilayer printed wiring boards (PWBs) for space application due to their inherent properties of better dimensional stability, low coefficient of thermal expansion, and the capability to withstand multiple soldering operations. In PWBs, ... View full abstract»

• Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

Publication Year: 2018, Page(s):1231 - 1240
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High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles... View full abstract»

• Integrated Sensor System for DNA Amplification and Separation Based on Thin Film Technology

Publication Year: 2018, Page(s):1141 - 1148
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This paper presents the development of a lab-on-chip, based on thin-film sensors, suitable for DNA treatments. In particular, the system performs on-chip DNA amplification and separation of double-strand DNA into single-strand DNA, combining a polydimethylsiloxane microfluidic network, thin-film electronic devices, and surface chemistry. Both the analytical procedures rely on the integration on th... View full abstract»

• Thermal Management of Electronic Devices Using Combined Effects of Nanoparticle Coating and Graphene–Water Nanofluid in a Miniature Loop Heat Pipe

Publication Year: 2018, Page(s):1241 - 1253
| | PDF (3463 KB) | HTML

The thermal management of electronic devices such as high-end central processing units, graphic processing units, insulated gate bipolar transistor, and circuit breaker in low-voltage switchboard operating between 20 and 380 W is investigated using a miniature loop heat pipe (mLHP) having nanoparticle-coated evaporator with graphene-water nanofluid. The thermal evaporation method is used to deposi... View full abstract»

• Integration of Wireless Coil and Bluetooth Antenna for High Charging and Radiation Efficiencies

Publication Year: 2018, Page(s):1292 - 1299
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In this paper, a wireless charging coil integrated with a Bluetooth antenna is proposed. The equivalent circuit model is developed to analyze this multifunctional coil. The outermost turn of the coil is appropriately designed in order to improve the radiation efficiency of the antenna. In this way, the radiation frequency of the coil is determined by the length of the outermost coil. Meanwhile, th... View full abstract»

• High-Frequency 3-D Model for the Study of Antennas in Cochlear Implants

Publication Year: 2018, Page(s):1135 - 1140
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This paper is devoted to the modeling and analysis of the antennas in the cochlear implants. In order to accurately characterize the antenna, a 3-D model working at high frequencies has been developed, where precise dimensions of the loop antenna are given. In order to have a complete overview, the tissues (skin and mastoid bone) surrounding the implanted antenna have been defined and included in ... View full abstract»

• An sEMG-Based Human–Robot Interface for Robotic Hands Using Machine Learning and Synergies

Publication Year: 2018, Page(s):1149 - 1158
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Developing natural control strategies represents an intriguing challenge in the design of human-robot interface (HRI) systems. The teleoperation of robotic grasping devices, especially in industrial, rescue, and aerospace applications, is mostly based on nonintuitive approaches, such as remote controllers. On the other hand, recent research efforts target solutions that mimic the human ability to ... View full abstract»

• Substrate-Integrated Waveguide Dual-Band Filters With Closely Spaced Passbands and Flexibly Allocated Bandwidths

Publication Year: 2018, Page(s):465 - 472
Cited by:  Papers (1)
| | PDF (3608 KB) | HTML

Substrate-integrated waveguide (SIW) dual-band bandpass filters (BPFs) with closely spaced passbands and flexibly allocated bandwidths are presented based on TE<sub>102</sub> and TE<sub>201</sub> modes in substrate-integrated rectangular cavities (SIRCs). The constraint relationship among the first four mode resonances in an SIRC with its aspect ratio is theoretically analy... View full abstract»

• Improving Data Center Energy Efficiency With Advanced Thermal Management

Publication Year: 2017, Page(s):1228 - 1239
Cited by:  Papers (3)
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Experimental investigation of data center cooling and computational energy efficiency improvement through advanced thermal management was performed. A chiller-less data center liquid cooling system was developed that transfers the heat generated from computer systems to the outdoor ambient environment while eliminating the need for energy-intensive vapor-compression refrigeration. This liquid cool... View full abstract»

• Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC

Publication Year: 2018, Page(s):699 - 706
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A through-silicon via (TSV) is a conducting copper nail, which provides an electrical connection through a substrate, and is expected to be used extensively to provide high-speed interconnects between the top and bottom of an active die. However, some TSV structural defects such as pinholes and voids are difficult to capture as they commonly affect TSV performance parameters rather than TSV logica... View full abstract»

• Modeling and Analysis of Drift-Cancellation Techniques for Time-Based Integrated Resistive Sensor Interfaces

Publication Year: 2018, Page(s):1203 - 1212
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This paper presents the drift error analysis of the integrated resistive sensor interfaces and its improvement using the drift-cancellation techniques. This paper focuses on the highly digital time-domain bang-bang phase-locked loop-based architectures that-when ideal-are intrinsically resilient to the drift generated by environmental and circuit degradation effects. Nevertheless, for applications... View full abstract»

• Design of a Compact Wideband Butler Matrix Using Vertically Installed Planar Structure

Publication Year: 2018, Page(s):1420 - 1430
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In this paper, a novel$4 \times 4$Butler matrix with wide bandwidth and compact size is presented. The existing coupled-line-based quadrature coupler cannot be used to construct a Butler matrix due to the location of output ports. To solve this problem, a swap is introduced in a vertically installed planar structure to implemen... View full abstract»

Publication Year: 2018, Page(s): 1
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Serial link receivers with high-speed analog-todigital converters (ADCs) can utilize powerful digital-domain equalizers and support multi-level modulation schemes. This paper presents a hybrid statistical modeling framework for ADC-based serial link receivers. The framework builds upon existing statistical modeling techniques for mixed-signal receivers and adds the support of ADC quantization nois... View full abstract»

• Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Publication Year: 2018, Page(s):635 - 642
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This paper presents a bandwidth enhanced, compact, multiple-input-multiple-output (MIMO) antenna with high isolation for modern wireless ultrawideband (UWB) applications. The proposed antenna consists of two simple eye-shaped slot radiators, and in order to enhance isolation, the proposed antenna uses a rectangular-shaped ground plane with an extruded T-shaped stub. The antenna characteristics suc... View full abstract»

• Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip With Millimeter-Wave Planar Antenna

Publication Year: 2018, Page(s):177 - 185
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This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeterwave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance a... View full abstract»

Publication Year: 2016, Page(s):1162 - 1173
Cited by:  Papers (3)
| | PDF (4252 KB) | HTML

A phased-array receiver module operating at 77 GHz is designed and manufactured to obtain beam-steering capability. The module has four patch antennas integrated with three active phase shifter (APS) chips on a single-layer Rogers 3003 printed circuit board PCB board. The W-band 1.65-mm2novel APS chip is fabricated using 0.13-μm SiGe Heterojunction Bipolar Transistor (HBT) technology. T... View full abstract»

• Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect

Publication Year: 2015, Page(s):641 - 649
Cited by:  Papers (2)
| | PDF (2663 KB) | HTML

In view of the characteristics of high-power light-emitting diodes (LEDs), such as strict junction temperature (Ti) control, the enhanced cooling models based on the thermoelectric cooler (TEC) were presented to meet the thermal demand of high-power LED headlight. The cooling performance of different devices (air cooling and TEC, and liquid cooling and TEC) was evaluated and compared by measuring ... View full abstract»

• Thermally Conductive MgO-Filled Epoxy Molding Compounds

Publication Year: 2013, Page(s):1994 - 2005
Cited by:  Papers (4)  |  Patents (1)
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The use of magnesium oxide (MgO) as a filler in an epoxy molding compound (EMC) was considered to identify the maximum thermal conductivity that could be achieved without compromising rheological or processing control and processing flexibility. MgO is an attractive candidate filler for EMCs used in automotive and other applications because MgO is inexpensive, electrically insulative, has relative... View full abstract»

• Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Publication Year: 2017, Page(s):1729 - 1738
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In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold... View full abstract»

• Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency

Publication Year: 2018, Page(s):867 - 874
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Full characterization of transmission lines fabricated on printed circuit boards is presented in this paper. For this purpose, the frequency at which the attenuation curves associated with the conductor and dielectric losses cross over is first determined to exactly separate the corresponding contribution to the total attenuation. Afterward, permittivity, loss tangent, effective geometry, and rms ... View full abstract»

• Heterogeneous Integration for Performance and Scaling

Publication Year: 2016, Page(s):973 - 982
Cited by:  Papers (15)
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Moore's law has so far relied on the aggressive scaling of CMOS silicon minimum features of over 1000× for over four decades, and recently, on the adoption of innovative features, such as Cu interconnects, low-k dielectrics for interconnects, strained channels, and high-k materials for gate dielectrics, resulting in a better power performance, cost per function, and density every generation. This ... View full abstract»

• Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Publication Year: 2018, Page(s):1254 - 1262
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High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on s... View full abstract»

• Broadband Microwave Frequency Characterization of 3-D Printed Materials

Publication Year: 2013, Page(s):2147 - 2155
Cited by:  Papers (64)
| | PDF (3082 KB) | HTML

3-D printing allows increased design flexibility in the fabrication of microwave circuits and devices and is reaching a level of maturity that allows for functional parts. Little is known about the RF and microwave properties of the standard materials that have been developed for 3-D printing. This paper measures a wide variety of materials over a broad spectrum of frequencies from 1 MHz to 10 GHz... View full abstract»

• Monolithic IPD-MEMS Technology and Its Applications to High-$Q$Switched Capacitor Banks and Variable True-Time-Delay Networks

Publication Year: 2018, Page(s):1327 - 1335
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A low-loss monolithic integrated passive device-microelectromechanical systems (IPD-MEMS) technology process on an alumina substrate is proposed. Two applications are investigated both theoretically and experimentally using the proposed IPD-MEMS process: 1) a high-quality-factor switched capacitor bank, and 2) a variable true-time-delay (TTD) network with a fine resolution. The measured IPD-MEMS c... View full abstract»

• High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Publication Year: 2018, Page(s): 1
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In this paper, high-frequency electrothermal characteristics of the power delivery network (PDN) are investigated for through-silicon via (TSV)-based 3-D ICs by utilizing a self-developed electrothermal co-simulation solver. The solver circularly solves the full-wave electromagnetic equation and the steady heat conduction equation using finite-element method (FEM). The preconditioned biconjugate g... View full abstract»

• Theory of Thermal Time Constants in GaN High-Electron-Mobility Transistors

Publication Year: 2018, Page(s):606 - 620
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Due to the high dissipated power densities present in GaN high-electron-mobility transistors (HEMTs) in high-power radio frequency applications, thermal analysis and thermal management of these devices are important in achieving their full potential. In this paper, we present a fundamental study of the transient thermal behavior of GaN HEMTs to aid in understanding the complex contributions of mul... View full abstract»

• Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization

Publication Year: 2017, Page(s):463 - 471
Cited by:  Papers (11)
| | PDF (3604 KB) | HTML

The ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductive layers on complex or nonplanar printed structures, two novel self-aligning patterning processes ar... View full abstract»

• Compact and Broadband CB-CPW-to-SIW Transition Using Stepped-Impedance Resonator With 90$^{\circ}$-Bent Slot

Publication Year: 2013, Page(s):247 - 252
Cited by:  Papers (10)
| | PDF (1237 KB) | HTML

In this paper, a compact and broadband conductor-backed coplanar waveguide (CB-CPW) to substrate integrated waveguide (SIW) transition using a stepped-impedance resonator (SIR) with a 90°-bent slot is proposed. The proposed transition can achieve a 36.8% 15-dB fractional bandwidth, which almost covers the S-band (2.6-3.95 GHz). Compared to the CB-CPW-to-SIW transition using the single-section quar... View full abstract»

• FPGA-Based Embedded Cyber-Physical Platform to Assess Gait and Postural Stability in Parkinson’s Disease

Publication Year: 2018, Page(s):1167 - 1179
Cited by:  Papers (1)
| | PDF (4486 KB) | HTML

Abnormal gait and postural instability are common disorders in people affected by Parkinson's disease (PD). This paper proposes an embedded cyber-physical system for the identification and the real-time extraction of highly selective diagnostic indexes for PD patients. A noninvasive wearable and wireless architecture for both gait analysis and postural instability detection has been proposed and i... View full abstract»

• A Wideband Reconfigurable Impedance Matching Network for Complex Loads

Publication Year: 2018, Page(s):1073 - 1081
| | PDF (2642 KB) | HTML

A novel wideband reconfigurable impedance matching network is presented, which consists of a main transmission line and several switchable branch lines. The proposed network can match different complex loads at different frequency bands. A novel optimization method is proposed to calculate the circuit parameters efficiently. The calculation results indicate that the proposed impedance matching net... View full abstract»

• Theoretical Design of Broadband Multisection Wilkinson Power Dividers With Arbitrary Power Split Ratio

Publication Year: 2016, Page(s):605 - 612
Cited by:  Papers (8)
| | PDF (2884 KB) | HTML

This paper describes a new approach for the theoretical design of unequal multisection Wilkinson power dividers, using single-layer microstrip lines. Similar to most multisection structures, the presented unequal divider can provide a broadband performance. To provide the design guideline, closed-form formulas are derived for the divider with odd or even number of sections. In each case, various s... View full abstract»

• Design and Modeling of Membrane-Based Evaporative Cooling Devices for Thermal Management of High Heat Fluxes

Publication Year: 2016, Page(s):1056 - 1065
Cited by:  Papers (15)
| | PDF (1821 KB) | HTML

We present a high-heat-flux cooling device for advanced thermal management of electronics. The device incorporates nanoporous membranes supported on microchannels to enable thin-film evaporation. The underlying concept takes advantage of the capillary pressure generated by small pores in the membrane, and minimizes the viscous loss by reducing the membrane thickness. The heat transfer and fluid fl... View full abstract»

• Integration of a 140 GHz Packaged LTCC Grid Array Antenna With an InP Detector

Publication Year: 2015, Page(s):1060 - 1068
Cited by:  Papers (13)
| | PDF (2758 KB) | HTML

Integration of a 140-GHz packaged low-temperature cofired ceramic (LTCC) antenna with a power detector is demonstrated under the concept of antenna-in-package. The detector is designed on an indium phosphide (InP) process. A grid array antenna in LTCC is designed to provide package for the detector. Coplanar ground-signal-ground (GSG) bond wires are used to connect the detector and the antenna. Pa... View full abstract»

• An I/O Coupling Multiplier Circuit and Its Application to Wideband Filters and Diplexers

Publication Year: 2018, Page(s):858 - 866
| | PDF (2349 KB) | HTML

In this paper, a novel input/output (I/O) coupling multiplier circuit for conveniently increasing I/O coupling of a wideband coupled-resonator filter/diplexer is proposed. The multiplier circuit consists of a shunt capacitor and a negative phase shift. By appropriately shunt connecting a capacitor in the vicinity of an I/O port, the I/O coupling can be effectively increased. Compared to convention... View full abstract»

Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel