# IEEE Transactions on Components, Packaging and Manufacturing Technology

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• ### Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Publication Year: 2017, Page(s):1891 - 1898
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The use of additive manufacturing (AM) techniques for the fabrication of 3-D fractal monopole antennas is presented. The 3-D printing (3-D P) of 3-D designs based on the Sierpinski fractal concept is studied, and the performance discussed. The AM allows the fabrication of the complex features of these antennas. The specific structures, on the other hand, provide a reduction of the material used in... View full abstract»

• ### 3-D Printed Metal-Pipe Rectangular Waveguides

Publication Year: 2015, Page(s):1339 - 1349
Cited by:  Papers (51)
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This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost ... View full abstract»

• ### Expected Failures in 3-D Technology and Related Failure Analysis Challenges

Publication Year: 2018, Page(s):711 - 718
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After an introduction to 3-D technology, and through silicon via (TSV)- and stacking options, this paper provides an overview of failures that can be expected in 3-D technology and lists the potential failure analysis (FA) techniques that can be applied to find these failures and the related challenges. Various failure mechanisms and effects that can be expected in TSVs, such as Cu pumping, voids,... View full abstract»

• ### Managing Electronics Part Changes in the Supply Chain

Publication Year: 2018, Page(s):883 - 895
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This paper presents the reasons behind part changes, the methods used internally by good part manufacturers to manage changes, the current industry standards that are focused on change management, and how change notices are propagated through the supply chain. This paper discusses contractual agreements, purchases through contract manufacturers and distributors, and the tracking of purchased parts... View full abstract»

• ### A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Publication Year: 2017, Page(s):964 - 973
Cited by:  Papers (1)
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A 2×2 dual-polarized antenna subarray with filtering responses is proposed in this paper. This antenna subarray is a multilayered 3-D geometry, including a dual-path 1× 4 feeding network and four cavity-backed slot antennas. The isolation performance between two input ports is greatly improved by a novel method, which only needs to modify several vias in a square resonator. Cavities ... View full abstract»

• ### Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Publication Year: 2018, Page(s):73 - 81
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In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a ... View full abstract»

• ### 3-D X-Ray Imaging With Nanometer Resolution for Advanced Semiconductor Packaging FA

Publication Year: 2018, Page(s):745 - 749
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As the complexity and interconnect density of advanced semiconductor packages increase, failure analysis and root cause determination are also facing new challenges and higher requirements. The 3-D X-ray microscopy, enabling nondestructive defect imaging and enhanced navigation for failure analysis, is considered a key method to fulfill these requirements. This technique results in a short time to... View full abstract»

• ### Characterization of Transmission Lines on PCB from S-Parameters by Determining the Dielectric and Conductor Losses at the Crossover Frequency

Publication Year: 2018, Page(s):867 - 874
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Full characterization of transmission lines fabricated on printed circuit boards is presented in this paper. For this purpose, the frequency at which the attenuation curves associated with the conductor and dielectric losses cross over is first determined to exactly separate the corresponding contribution to the total attenuation. Afterward, permittivity, loss tangent, effective geometry, and rms ... View full abstract»

• ### Substrate-Integrated Waveguide Dual-Band Filters With Closely Spaced Passbands and Flexibly Allocated Bandwidths

Publication Year: 2018, Page(s):465 - 472
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Substrate-integrated waveguide (SIW) dual-band bandpass filters (BPFs) with closely spaced passbands and flexibly allocated bandwidths are presented based on TE102 and TE201 modes in substrate-integrated rectangular cavities (SIRCs). The constraint relationship among the first four mode resonances in an SIRC with its aspect ratio is theoretically analyzed first to explore the... View full abstract»

• ### High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Publication Year: 2011, Page(s):181 - 195
Cited by:  Papers (191)  |  Patents (2)
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We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equ... View full abstract»

• ### Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Publication Year: 2018, Page(s):991 - 1002
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The design, materials, process, fabrication, and reliability of fan-out wafer-level packaging (FOWLP) with chip-first and die face-up method are investigated in this paper. Emphasis is placed on the issues and their solutions (such as reconstituted carrier, die-attach film placement, pitch compensation, die shift, epoxy molding compound dispensing, compression molding, warpage, and Cu revealing) d... View full abstract»

• ### Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC

Publication Year: 2018, Page(s):699 - 706
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A through-silicon via (TSV) is a conducting copper nail, which provides an electrical connection through a substrate, and is expected to be used extensively to provide high-speed interconnects between the top and bottom of an active die. However, some TSV structural defects such as pinholes and voids are difficult to capture as they commonly affect TSV performance parameters rather than TSV logica... View full abstract»

• ### Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

Publication Year: 2017, Page(s):1721 - 1728
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Nowadays, fan-out package is regarded as one of the latest and most potential technologies because it possesses lower cost, thinner profile, and better electrical performance and thermal performance. However, thermally induced warpage in the molding process is a critical issue due to the larger wafer or panel size, the shrinkage of epoxy mold compound (EMC) during the curing stage, and the mismatc... View full abstract»

• ### Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities

Publication Year: 2017, Page(s):956 - 963
Cited by:  Papers (1)
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The contribution of this paper is to propose novel balanced and dual-band bandpass filters (BPFs), using quarter-mode (QM) and eighth-mode (EM) substrate integrated waveguide (SIW) cavities, for the size reduction of the overall circuit. Two balanced BPFs, which separately demonstrate a third-order Chebyshev response and a fourth-order quasi-elliptic response, are realized by properly choosing, fe... View full abstract»

• ### Hotspot Thermal Management via Thin-Film Evaporation—Part I: Experimental Characterization

Publication Year: 2018, Page(s):88 - 98
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The presence of hotspots with extreme heat fluxes and temperatures in high-performance electronics has led to severe thermal management challenges in the semiconductor industry. Our work experimentally investigates the potential of capillary-fed thin-film evaporation as a thermal management solution for devices where hotspots are superposed with mild background heating. The front side of our test ... View full abstract»

• ### Design of $V$ -Band Wide-Beamwidth Circularly Polarized Wire-Bond Antenna

Publication Year: 2018, Page(s):261 - 268
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A V-band wide-beamwidth left-handed circularly polarized wire-bond antenna is presented in this paper. The proposed design, which is implemented by using integrated passive device process, consists of a 1:4 series-type ring-shaped microstrip power divider and four bond-wire radiators. The design of bond-wire radiator with wide-beamwidth characteristic is described. The design method of power divid... View full abstract»

• ### Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Publication Year: 2017, Page(s):1191 - 1205
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This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication S... View full abstract»

• ### Die Attach Materials for High Temperature Applications: A Review

Publication Year: 2011, Page(s):457 - 478
Cited by:  Papers (123)
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The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching s... View full abstract»

• ### Investigation of Multiple Heat Source Effects in Lock-In Thermography Applications in Semiconductor Packages

Publication Year: 2018, Page(s):725 - 734
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Three-dimensional (3-D) packages have become a technology integrator for multiple functional devices into one component as a cost-effective way to enable Moore's law for continuous scale-down. There are new challenges arising from the 3-D packages for fault isolation because of continued miniaturization and added complexity in the z-direction of advanced IC devices, which require the development o... View full abstract»

• ### Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Publication Year: 2018, Page(s):635 - 642
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This paper presents a bandwidth enhanced, compact, multiple-input-multiple-output (MIMO) antenna with high isolation for modern wireless ultrawideband (UWB) applications. The proposed antenna consists of two simple eye-shaped slot radiators, and in order to enhance isolation, the proposed antenna uses a rectangular-shaped ground plane with an extruded T-shaped stub. The antenna characteristics suc... View full abstract»

• ### An I/O Coupling Multiplier Circuit and Its Application to Wideband Filters and Diplexers

Publication Year: 2018, Page(s):858 - 866
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In this paper, a novel input/output (I/O) coupling multiplier circuit for conveniently increasing I/O coupling of a wideband coupled-resonator filter/diplexer is proposed. The multiplier circuit consists of a shunt capacitor and a negative phase shift. By appropriately shunt connecting a capacitor in the vicinity of an I/O port, the I/O coupling can be effectively increased. Compared to convention... View full abstract»

• ### Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior

Publication Year: 2017, Page(s):734 - 744
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Insulated gate bipolar transistor (IGBT) modules, which can fail to stable short-circuit mode, have major applications in electricity network-related fields. Sn-3.5Ag solder joints and sintered Ag joints for the die attachment and Mo, Cu, Sn-3.5Ag, Al, and Ag foils for the top side insert (TSI) material in press pack like single IGBT samples have been investigated using overcurrent and current pas... View full abstract»

• ### Hotspot Thermal Management via Thin-Film Evaporation—Part II: Modeling

Publication Year: 2018, Page(s):99 - 112
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We developed a unified semianalytical thermal- fluidic model for hotspot (HS) thermal management via thin-film evaporation from well-defined silicon micropillar wicks. The capillary pressure generated at a receding liquid meniscus is matched with the flow resistance of the micropillar wick to estimate the dryout heat flux. In addition to modeling the fluidic transport within the porous wick struct... View full abstract»

• ### Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Publication Year: 2017, Page(s):1729 - 1738
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In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold... View full abstract»

• ### Thermomechanical Behavior of Conduction-Cooled High-Power Diode Laser Arrays

Publication Year: 2018, Page(s):818 - 829
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Thermomechanical behavior has an important effect on reliability and lifetime of high-power diode lasers (HPDLs). Finite-element analysis (FEA) model and analytical solution model of the conduction-cooled package (CS) HPDL are established to analyze the thermomechanical behavior including normal stress, shearing stress, and displacement in reflowing process and working process. Moreover, in order ... View full abstract»

• ### A Novel Multifunctional EBG-Based Coupled-Line-Defect Directional Coupler Based on Layered Dielectric Substrates

Publication Year: 2018, Page(s):1 - 12
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In this paper, a novel multifunctional coupler based on line-defect layered electromagnetic bandgap (EBG) waveguides is proposed and studied. Extensive full-wave simulations are used to establish the critical nature of the coupling region for the realization of different functionalities of the coupler. Changing the separation between the rings or orientation of the rings in the coupling and/or cha... View full abstract»

• ### Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip With Millimeter-Wave Planar Antenna

Publication Year: 2018, Page(s):177 - 185
| | PDF (3551 KB)

This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeterwave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance a... View full abstract»

• ### Plasma-Generated Etchback to Improve the Via-Reliability in High-Tg Substrates Used in Multilayer PWBs for Space Electronic Packaging

Publication Year: 2016, Page(s):926 - 932
Cited by:  Papers (1)
| | PDF (2982 KB) | HTML

High-Tg (glass transition temperature, 210°C) woven fiber-glass reinforced multifunctional-epoxy FR-4 laminates are now becoming main trend in the fabrication of multilayer printed wiring boards (PWBs) for space application due to their inherent properties of better dimensional stability, low coefficient of thermal expansion, and the capability to withstand multiple soldering operations. In... View full abstract»

• ### Design of Compact Coaxial-Like Bandpass Filters Using Dielectric-Loaded Strip Resonator

Publication Year: 2018, Page(s):456 - 464
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This paper presents a novel dielectric-loaded strip resonator (DLSR) with coaxial-like characteristic, comprising a metal strip attached on the surface of a high-permittivity dielectric rod. The strip of traditional strip-loaded dielectric resonator only functions as the perturbation for tuning the dielectric resonator mode. In particular, the dominant mode of the proposed DLSR stems from the stri... View full abstract»

• ### Wideband Electromagnetic Model and Analysis of Shielded-Pair Through-Silicon Vias

Publication Year: 2018, Page(s):473 - 481
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The 3-D multistrata integration puts forward high requirements for signal integrity. The shielded-pair through-silicon vias (SPTSVs) proposed in this paper feature superior transmission properties and high jamming immunity suitable for differential-mode and common-mode transmission. Based on the quasi-static field theory, a wideband impedance model of SPTSVs considering the proximity effect, the l... View full abstract»

• ### 3-D Printed Structures by Microdispensing Materials Loaded With Dielectric and Magnetic Powders

Publication Year: 2018, Page(s):492 - 498
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In this paper, we develop processes for printing 3-D structures by microdispensing materials loaded with dielectric and magnetic powders. Manufacturing with these materials is demonstrated by 3-D printing simple tower and bridge structures. The dielectric and magnetic properties are adjusted by loading different amounts of powder into a host silicone material. The long-term goal of the research is... View full abstract»

• ### 77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Publication Year: 2014, Page(s):352 - 359
Cited by:  Papers (7)
| | PDF (1449 KB) | HTML

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire bonding, which not only introduces significant radio frequency loss, but also occupies large footprint for high-pin count die. The transceiver bare die is embedded in a reconfigured molded wafer with compression molding process. ... View full abstract»

• ### Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC for Frequencies up to 67 GHz

Publication Year: 2011, Page(s):595 - 601
Cited by:  Papers (21)
| | PDF (811 KB) | HTML

A wide-band microstrip-to-microstrip via transition proposed for connecting an integrated circuit chip and an antenna array on the opposite sides of a multilayered low-temperature co-fired ceramic substrate is investigated in this paper. To facilitate the design, it is decomposed into external and internal segments, which consist of two microstrip-to-via transitions and a multilayered through-hole... View full abstract»

• ### Liquid Crystal Leaky-Wave Antennas With Dispersion Sensitivity Enhancement

Publication Year: 2017, Page(s):792 - 801
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A novel design, fabrication, and packaging technology is proposed for liquid crystal (LC)-based beam-scanning leaky-wave antennas (LWAs). Different from conventional ones, extra dispersion sensitivity enhancement (DSE) components are introduced to increase the slope of effective phase constant versus frequency of LWAs and, hence, the beam scanning range. CST MW Studio software package is used to v... View full abstract»

• ### Near-Field Radiation Estimation and Its Reduction Using a Novel EBG for PCB

Publication Year: 2018, Page(s):1 - 7
| | PDF (1705 KB)

To investigate and quantify the radiation emission of an electronic package model, the partial element equivalent circuit method combined with the field equivalence principle is developed in this paper and used for the near-field radiation prediction. Furthermore, this paper presents a novel electromagnetic bandgap (EBG) design to suppress the electromagnetic radiation. The simulation results obta... View full abstract»

• ### Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs

Publication Year: 2013, Page(s):1891 - 1906
Cited by:  Papers (14)
| | PDF (2511 KB) | HTML

In this paper, we propose models for large-sized silicon interposer power distribution networks (PDNs) and through silicon via (TSV)-based stacked grid-type PDNs using a segmentation method. We model the PDNs as distributed scalable resistance (R), inductance (L), conductance (G), and capacitance (C)-lumped models for an accurate estimation of the PDN impedance, including PDN inductance and wave p... View full abstract»

• ### Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package

Publication Year: 2018, Page(s):764 - 772
| | PDF (3186 KB) | HTML

The mechanical/optical configuration of moiré interferometry for real-time observation of thermal deformations is advanced to quantify the thermomechanical behavior of fan-out wafer level packages (FO-WLPs). Two most notable advancements are on the: 1) mechanical front: conduction-based thermal chamber for a wide range of ramp rates with accurate temperature control, and 2) optical front: ... View full abstract»

• ### Metallic Nanowires and Their Application

Publication Year: 2016, Page(s):1733 - 1751
Cited by:  Papers (3)
| | PDF (4204 KB) | HTML

Metallic nanowire films, especially silver nano-wires (AgNWs) and copper nanowires (CuNWs), with a random mesh structure have attracted considerable attention as high-performance flexible transparent films to replace the traditional, expensive, and brittle indium tin oxide films. These films have been widely used in displays, touchscreens, and solar cells to achieve next-generation electronics tha... View full abstract»

• ### Thermally Conductive MgO-Filled Epoxy Molding Compounds

Publication Year: 2013, Page(s):1994 - 2005
Cited by:  Papers (4)  |  Patents (1)
| | PDF (3264 KB) | HTML

The use of magnesium oxide (MgO) as a filler in an epoxy molding compound (EMC) was considered to identify the maximum thermal conductivity that could be achieved without compromising rheological or processing control and processing flexibility. MgO is an attractive candidate filler for EMCs used in automotive and other applications because MgO is inexpensive, electrically insulative, has relative... View full abstract»

• ### An 8-1 Single-Stage 10-kW Planar Gysel Power Combiner at 352 MHz

Publication Year: 2018, Page(s):851 - 857
| | PDF (1381 KB) | HTML

A compact single-stage 8-1 Gysel Combiner in planar technology for operation with 352-MHz pulses with peak output power of 10 kW has been designed, manufactured, and tested. The module has 0.2-dB insertion loss when operated at nominal power, and the return loss of all ports is 20 dB or better. The module was operated using 3.3-ms pulses at 14-Hz repetition rate without any signs of degradation, t... View full abstract»

• ### Organic Damascene Process for 1.5- $mu$ m Panel-Scale Redistribution Layer Technology Using 5- $mu$ m-Thick Dry Film Photosensitive Dielectrics

Publication Year: 2018, Page(s):792 - 801
| | PDF (2643 KB) | HTML

This paper presents a novel organic embedded trace damascene redistribution layer (RDL) process for panel-scale 2.5-D interposers and high-density fan-out package (HDFO) substrates. A minimum feature size of 1.5-μm line and space using ultrathin polymer dielectrics on glass, silicon, and as well as on organic laminate was demonstrated. This is the first demonstration of a complete set of ma... View full abstract»

• ### Evaluation of Thick-Film Materials for High-Temperature Packaging

Publication Year: 2018, Page(s):773 - 783
| | PDF (8192 KB) | HTML

High-temperature electronics are required for applications such as automotive, down-hole drilling for oil and geothermal energy, aircraft, and space exploration. SiC and GaN devices are capable of operating in these high-temperature environments and challenging the packaging materials and technology to be compatible with these environments. Thick-film materials and technology have the potential of... View full abstract»

• ### Design and Analysis of the DC–DC Converter With a Frequency Hopping Technique for EMI Reduction

Publication Year: 2018, Page(s):546 - 553
| | PDF (3331 KB) | HTML

As more circuit functions are integrated within a single die or small integrated package, the number of electromagnetic interference (EMI) problems caused by dc-dc converters is growing. In this paper, the dominant electromagnetic emission source on the dc-dc converter is identified by analyzing the power spectrum of the nodes. The noise scanner method is applied to a packaged single-chip prototyp... View full abstract»

• ### Planar In-Phase Filtering Power Divider With Tunable Power Division and Controllable Band for Wireless Communication Systems

Publication Year: 2018, Page(s):1 - 11
| | PDF (2354 KB)

A wideband in-phase power divider with tunable power division ratio (PDR) and filtering response is presented. The proposed design is quite compact and consists of a three-line coupled structure and loaded with a pair of varactor-loaded short-ended stubs at two output terminations. A variable power division is realized by tuning the coupling factors between the centerline and sidelines of the thre... View full abstract»

• ### Design of Miniaturized Dual-Band Low-Pass–Bandpass and Bandpass Filters

Publication Year: 2018, Page(s):132 - 139
| | PDF (2859 KB) | HTML

In this paper, a lumped-element structure with four potential transmission zeros (TZs), one zero-value transmission pole (TP), and three nonzero TPs is first proposed to design dual-band low-pass-bandpass filter (DB-LBF). Then, a pair of capacitors to block zero-value TP and an inductor to generate another nonzero TP are introduced in the DB-LBF structure to transform the low-pass passband into ba... View full abstract»

• ### Arcless Commutation of a Hybrid DC Breaker by Contact Voltage of Molten Metal Bridge

Publication Year: 2018, Page(s):350 - 355
| | PDF (2047 KB) | HTML

DC circuit breakers (DCCBs) have been intensively studied because of increasing demand for dc power transmission. A hybrid dc circuit breaker that consists of mechanical switches, semiconductor devices, and metal-oxide varistor elements is a promising device to provide low contact resistance and fast interruption. Semiconductor devices are turned on by the sustaining voltage of arc discharge gener... View full abstract»

• ### Integration Design of Filtering Antenna With Load-Insensitive Multilayer Balun Filter

Publication Year: 2016, Page(s):1408 - 1416
Cited by:  Papers (1)
| | PDF (3161 KB) | HTML

Integration design of a filtering antenna fed by a load-insensitive multimode balun bandpass filter is proposed in this paper. The balun filter is designed and realized using multilayer structure for miniaturization. To be directly integrated into the antenna, both amplitude and phase performances of the balun filter are investigated with different complex load impedances. With insensitive respons... View full abstract»

• ### Self-Packaged, Low-Loss, Planar Bandpass Filters for Millimeter-Wave Application Based on Printed Gap Waveguide Technology

Publication Year: 2017, Page(s):1419 - 1431
| | PDF (4517 KB) | HTML

A new concept of printed planar technology is introduced for the realization of low-loss bandpass filters in millimeter band. The new technology is self-packaged, and the insertion loss shows meaningful improvement compared to microstrip (MS) filters. The designs are based on the ridge gap waveguide (RGW), which is composed of printed parallel-plate waveguide surrounded by beds of mushrooms that s... View full abstract»

• ### Single-Layer Broadband Phase Shifter Using Multimode Resonator and Shunt $\lambda$ /4 Stubs

Publication Year: 2017, Page(s):1119 - 1125
| | PDF (1718 KB) | HTML

This paper presents a new method for single-layer broadband phase shifter without needing any coupling structure. The phase shifter consists of a multimode resonator and two shunt λ/4 stubs. Meanwhile, the bandwidth of proposed phase shifters can be achieved more than 100%. For prescribed return loss, phase shift value, and phase error, this paper develops a synthesis approach to determine ... View full abstract»

• ### Theoretical Design of Broadband Multisection Wilkinson Power Dividers With Arbitrary Power Split Ratio

Publication Year: 2016, Page(s):605 - 612
Cited by:  Papers (5)
| | PDF (2884 KB) | HTML

This paper describes a new approach for the theoretical design of unequal multisection Wilkinson power dividers, using single-layer microstrip lines. Similar to most multisection structures, the presented unequal divider can provide a broadband performance. To provide the design guideline, closed-form formulas are derived for the divider with odd or even number of sections. In each case, various s... View full abstract»

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel