IEEE Transactions on Product Engineering and Production

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  • Chemical Processes as Manufacturing Tools for the Electronics Industry

    Publication Year: 1963, Page(s):32 - 36
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (597 KB)

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  • Picture-Tube Improvement through Controlled Manufacturing Environment and Ultrasonic Cleaning Technologies

    Publication Year: 1963, Page(s):29 - 37
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1288 KB)

    . The trend toward higher-voltage picture-tube operation requires basic improvements in manufacturing techniques. The threshold of high-voltage instability characteristics of modern picture tubes cannot be increased significantly by design without adversely affecting focus and other performance characteristics. A practical technique of increasing the threshold of highvoltage instability by about 6... View full abstract»

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  • Suction vs. Pressure Forced Air Cooling

    Publication Year: 1965, Page(s):30 - 35
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretio... View full abstract»

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  • Assured Reliability in Soldered Connections: Solderability as Parameter of Assurance

    Publication Year: 1963, Page(s):28 - 33
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (880 KB)

    The reliability of any connecting process is statistically governed by the number of process parameters. Significantly, for reliable welding a multiplicity of parameters requires close control, but reliable soldering depends primarily upon one - solderability of the surfaces to be joined. The theoretical and practical implications of solderability and tests for its evaluation are discussed. An ent... View full abstract»

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  • Miniaturized Wire Wrap

    Publication Year: 1963, Page(s):12 - 19
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1104 KB)

    Miniaturization and micro-miniaturization are key words that are often heard in the electronic industry today. The increasing frequency of these terms reflects the growing importance attached to the reduction in size, of logic and power components used for data processing applications. In fact, miniaturization is now a primary project of many scientific research teams throughout the industry. The ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope