# IEEE Transactions on Components, Packaging and Manufacturing Technology

Includes the top 50 most frequently accessed documents for this publication according to the usage statistics for the month of

• ### 3-D Printed Metal-Pipe Rectangular Waveguides

Publication Year: 2015, Page(s):1339 - 1349
Cited by:  Papers (51)
| | PDF (2414 KB) | HTML

This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost ... View full abstract»

• ### Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Publication Year: 2018, Page(s):73 - 81
| | PDF (4790 KB) | HTML

In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a ... View full abstract»

• ### Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Publication Year: 2017, Page(s):1891 - 1898
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The use of additive manufacturing (AM) techniques for the fabrication of 3-D fractal monopole antennas is presented. The 3-D printing (3-D P) of 3-D designs based on the Sierpinski fractal concept is studied, and the performance discussed. The AM allows the fabrication of the complex features of these antennas. The specific structures, on the other hand, provide a reduction of the material used in... View full abstract»

• ### Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Publication Year: 2018, Page(s):635 - 642
| | PDF (2835 KB)

This paper presents a bandwidth enhanced, compact, multiple-input–multiple-output (MIMO) antenna with high isolation for modern wireless ultrawideband (UWB) applications. The proposed antenna consists of two simple eye-shaped slot radiators, and in order to enhance isolation, the proposed antenna uses a rectangular-shaped ground plane with an extruded T-shaped stub. The antenna characterist... View full abstract»

• ### A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Publication Year: 2017, Page(s):964 - 973
Cited by:  Papers (1)
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A 2×2 dual-polarized antenna subarray with filtering responses is proposed in this paper. This antenna subarray is a multilayered 3-D geometry, including a dual-path 1× 4 feeding network and four cavity-backed slot antennas. The isolation performance between two input ports is greatly improved by a novel method, which only needs to modify several vias in a square resonator. Cavities ... View full abstract»

• ### Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Publication Year: 2017, Page(s):1729 - 1738
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In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold... View full abstract»

• ### An sEMG-Based Human-Robot Interface for Robotic Hands Using Machine Learning and Synergies

Publication Year: 2018, Page(s):1 - 10
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Developing natural control strategies represents an intriguing challenge in the design of human-robot interface (HRI) systems. The teleoperation of robotic grasping devices, especially in industrial, rescue, and aerospace applications, is mostly based on nonintuitive approaches, such as remote controllers. On the other hand, recent research efforts target solutions that mimic the human ability to ... View full abstract»

• ### 3-Axis, Ultrahigh-Sensitivity, Miniature Acceleration Sensor

Publication Year: 2018, Page(s):244 - 250
| | PDF (1441 KB)

This paper introduces a miniature, 3-axis, acceleration sensor with extremely high sensitivity. The sensor is of the variable capacitance type. However, instead of using a conventional variable capacitor configuration, the sensor is based on a variable ultracapacitor (or supercapacitor). A very small droplet of electrolyte is positioned in between six electrodes that are arranged in the form of a ... View full abstract»

• ### Substrate-Integrated Waveguide Dual-Band Filters With Closely Spaced Passbands and Flexibly Allocated Bandwidths

Publication Year: 2018, Page(s):465 - 472
| | PDF (3608 KB) | HTML

Substrate-integrated waveguide (SIW) dual-band bandpass filters (BPFs) with closely spaced passbands and flexibly allocated bandwidths are presented based on TE102 and TE201 modes in substrate-integrated rectangular cavities (SIRCs). The constraint relationship among the first four mode resonances in an SIRC with its aspect ratio is theoretically analyzed first to explore the... View full abstract»

• ### Design of Compact Bandpass Filters Using Quarter-Mode and Eighth-Mode SIW Cavities

Publication Year: 2017, Page(s):956 - 963
Cited by:  Papers (1)
| | PDF (2031 KB) | HTML

The contribution of this paper is to propose novel balanced and dual-band bandpass filters (BPFs), using quarter-mode (QM) and eighth-mode (EM) substrate integrated waveguide (SIW) cavities, for the size reduction of the overall circuit. Two balanced BPFs, which separately demonstrate a third-order Chebyshev response and a fourth-order quasi-elliptic response, are realized by properly choosing, fe... View full abstract»

• ### Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip With Millimeter-Wave Planar Antenna

Publication Year: 2018, Page(s):177 - 185
| | PDF (3551 KB)

This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeterwave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance a... View full abstract»

• ### Modeling and Optimization of Inductively Coupled Wireless Bio-Pressure Sensor System Using the Design of Experiments Method

Publication Year: 2018, Page(s):65 - 72
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This paper presents an approach for modeling and design of inductively coupled wireless bio-pressure sensor system for chronic intracardiac pressure monitoring. Making use of recent advances in microelectromechanical systems and semiconductor technology, bio-pressure sensor is developed as a series LC resonant circuit with a featured pressure-dependent capacitance working at the medical implant co... View full abstract»

• ### 77-GHz Automotive Radar Sensor System With Antenna Integrated Package

Publication Year: 2014, Page(s):352 - 359
Cited by:  Papers (7)
| | PDF (1449 KB) | HTML

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire bonding, which not only introduces significant radio frequency loss, but also occupies large footprint for high-pin count die. The transceiver bare die is embedded in a reconfigured molded wafer with compression molding process. ... View full abstract»

• ### A Coupled-Line Isolation Network for the Design of Filtering Power Dividers With Improved Isolation

Publication Year: 2018, Page(s):1 - 8
| | PDF (1605 KB)

A coupled-line isolation network is proposed for the design of filtering power dividers. The isolation network functions as the input coupling structures for two bandpass filters (BPFs), and meanwhile isolates the filters to realize a filtering power divider. It can be embedded into various types of BPFs to implement a variety of filtering power dividers. As demonstrated by the theoretical and exp... View full abstract»

• ### Die Attach Materials for High Temperature Applications: A Review

Publication Year: 2011, Page(s):457 - 478
Cited by:  Papers (123)
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The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching s... View full abstract»

• ### High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Publication Year: 2011, Page(s):181 - 195
Cited by:  Papers (191)  |  Patents (2)
| | PDF (3071 KB) | HTML

We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equ... View full abstract»

• ### Broadband Microwave Frequency Characterization of 3-D Printed Materials

Publication Year: 2013, Page(s):2147 - 2155
Cited by:  Papers (51)
| | PDF (3082 KB) | HTML

3-D printing allows increased design flexibility in the fabrication of microwave circuits and devices and is reaching a level of maturity that allows for functional parts. Little is known about the RF and microwave properties of the standard materials that have been developed for 3-D printing. This paper measures a wide variety of materials over a broad spectrum of frequencies from 1 MHz to 10 GHz... View full abstract»

• ### Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Publication Year: 2017, Page(s):138 - 152
Cited by:  Papers (3)
| | PDF (4122 KB) | HTML

Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic devices. As the system design aims for higher performance, the physical dimensions of the channels are continuously decreasing. With TSV diameter of less than 10 μm and pitch of several tens of m... View full abstract»

• ### Design of Compact Coaxial-Like Bandpass Filters Using Dielectric-Loaded Strip Resonator

Publication Year: 2018, Page(s):456 - 464
| | PDF (3083 KB) | HTML

This paper presents a novel dielectric-loaded strip resonator (DLSR) with coaxial-like characteristic, comprising a metal strip attached on the surface of a high-permittivity dielectric rod. The strip of traditional strip-loaded dielectric resonator only functions as the perturbation for tuning the dielectric resonator mode. In particular, the dominant mode of the proposed DLSR stems from the stri... View full abstract»

• ### Design and Characterization of Inductors for Self-Powered IoT Edge Devices

Publication Year: 2018, Page(s):1 - 9
| | PDF (3007 KB)

This paper discusses the design, fabrication, and characterization of packaged planar inductors with magnetic material [nickel zinc (NiZn) ferrite]. Inductors are designed specifically for Internet of Things (IoT) applications based on power loss in an IoT architecture. Different spiral inductor geometries are demonstrated on a printed wiring board with varying thicknesses using a stencil printing... View full abstract»

• ### Design of Miniaturized Dual-Band Low-Pass–Bandpass and Bandpass Filters

Publication Year: 2018, Page(s):132 - 139
| | PDF (2859 KB) | HTML

In this paper, a lumped-element structure with four potential transmission zeros (TZs), one zero-value transmission pole (TP), and three nonzero TPs is first proposed to design dual-band low-pass-bandpass filter (DB-LBF). Then, a pair of capacitors to block zero-value TP and an inductor to generate another nonzero TP are introduced in the DB-LBF structure to transform the low-pass passband into ba... View full abstract»

• ### Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

Publication Year: 2017, Page(s):1191 - 1205
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This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication S... View full abstract»

• ### Single-Layer Broadband Phase Shifter Using Multimode Resonator and Shunt $\lambda$ /4 Stubs

Publication Year: 2017, Page(s):1119 - 1125
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This paper presents a new method for single-layer broadband phase shifter without needing any coupling structure. The phase shifter consists of a multimode resonator and two shunt λ/4 stubs. Meanwhile, the bandwidth of proposed phase shifters can be achieved more than 100%. For prescribed return loss, phase shift value, and phase error, this paper develops a synthesis approach to determine ... View full abstract»

• ### Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface

Publication Year: 2018, Page(s):1 - 14
| | PDF (5275 KB)

In this paper, for the first time, we designed and analyzed channels between a graphic processing unit and memory in a silicon interposer for a 3-D stacked high bandwidth memory (HBM). We thoroughly analyzed and verified the electrical characteristics of the silicon interposer considering various design parameters, such as the channel width and space, redistribution layer via, and under bump metal... View full abstract»

• ### Hotspot Thermal Management via Thin-Film Evaporation—Part I: Experimental Characterization

Publication Year: 2018, Page(s):88 - 98
| | PDF (2079 KB) | HTML

The presence of hotspots with extreme heat fluxes and temperatures in high-performance electronics has led to severe thermal management challenges in the semiconductor industry. Our work experimentally investigates the potential of capillary-fed thin-film evaporation as a thermal management solution for devices where hotspots are superposed with mild background heating. The front side of our test ... View full abstract»

• ### PCB Reverse Engineering Using Nondestructive X-ray Tomography and Advanced Image Processing

Publication Year: 2017, Page(s):292 - 299
| | PDF (1397 KB) | HTML

Reverse engineering (RE) of electronic systems is performed for many different reasons, including, but not limited to, failure analysis and fault isolation, obsolescence management, proof of IP rights infringement, security assessment, development of attacks, and counterfeiting. Regardless of the goal, it is imperative that the community understands the requirements, complexities, and limitations ... View full abstract»

• ### A 2.5-D Integrated Data Logger for Measuring Extreme Accelerations

Publication Year: 2017, Page(s):1930 - 1939
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A very compact and rugged 2.5-D integrated data logger has been built and tested. The data logger is capable of measuring accelerations exceeding 70 000 g. Microcontroller and flash memory as bare dies have been mounted onto a silicon interposer with through silicon vias using anisotropic conductive film and Au stud bump bonding. A microelectromechanical system accelerometer is mounted onto the in... View full abstract»

• ### Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices

Publication Year: 2018, Page(s):1 - 9
| | PDF (1791 KB)

A new thermal model based on a distributed and fast modeling approach for the modeling of gallium nitride (GaN) power devices is presented in this paper. The model is based on the application of Green's function theory to obtain an analytical solution of the heat conduction equation. The model comprises an accurate, spatially distributed, and fast algorithm that calculates a 2-D thermal response a... View full abstract»

• ### Wideband Tunable Differential Bandstop Filter Based on Double-Sided Parallel-Strip Line

Publication Year: 2018, Page(s):1 - 8
| | PDF (2275 KB)

This paper presents a wideband tunable differential bandstop filter (BSF) using optimized varactor-loaded stepped-impedance resonators (SIRs) based on the double-sided parallel-strip line (DSPSL). A detailed investigation on the relationship between the frequency tunability and the properties of the SIR is presented. It can be found that there are two extra factors for determining frequency-tuning... View full abstract»

• ### Demonstration of RF and Microwave Passive Circuits Through 3-D Printing and Selective Metalization

Publication Year: 2017, Page(s):463 - 471
Cited by:  Papers (4)
| | PDF (3604 KB) | HTML

The ultimate goal of this paper is to print radio frequency (RF) and microwave structures using a 3-D platform and to pattern metal films on nonplanar structures. To overcome substrate losses, air core substrates that can readily be printed are utilized. To meet the challenge of patterning conductive layers on complex or nonplanar printed structures, two novel self-aligning patterning processes ar... View full abstract»

• ### Hotspot Thermal Management via Thin-Film Evaporation—Part II: Modeling

Publication Year: 2018, Page(s):99 - 112
| | PDF (1883 KB) | HTML

We developed a unified semianalytical thermal- fluidic model for hotspot (HS) thermal management via thin-film evaporation from well-defined silicon micropillar wicks. The capillary pressure generated at a receding liquid meniscus is matched with the flow resistance of the micropillar wick to estimate the dryout heat flux. In addition to modeling the fluidic transport within the porous wick struct... View full abstract»

• ### Planar In-Phase Filtering Power Divider With Tunable Power Division and Controllable Band for Wireless Communication Systems

Publication Year: 2018, Page(s):1 - 11
| | PDF (2354 KB)

A wideband in-phase power divider with tunable power division ratio (PDR) and filtering response is presented. The proposed design is quite compact and consists of a three-line coupled structure and loaded with a pair of varactor-loaded short-ended stubs at two output terminations. A variable power division is realized by tuning the coupling factors between the centerline and sidelines of the thre... View full abstract»

• ### Compact and Broadband CB-CPW-to-SIW Transition Using Stepped-Impedance Resonator With 90$^{circ}$-Bent Slot

Publication Year: 2013, Page(s):247 - 252
Cited by:  Papers (10)
| | PDF (1237 KB) | HTML

In this paper, a compact and broadband conductor-backed coplanar waveguide (CB-CPW) to substrate integrated waveguide (SIW) transition using a stepped-impedance resonator (SIR) with a 90°-bent slot is proposed. The proposed transition can achieve a 36.8% 15-dB fractional bandwidth, which almost covers the S-band (2.6-3.95 GHz). Compared to the CB-CPW-to-SIW transition using the single-secti... View full abstract»

• ### The Mathematical Model of Contact Resistance and Injected Current in DRM Tests of SF6 Circuit Breaker

Publication Year: 2018, Page(s):82 - 87
| | PDF (1898 KB) | HTML

Dynamic contact resistance measurement (DRM) has been widely used in evaluating the contact condition of circuit breakers from 20 years ago. With the increasing of the injected current, the contact resistance is lower than it was. It is considered that the contact hardness, contact force, and specific resistivity are affected by the injected current. SF6 circuit breaker with self-elasti... View full abstract»

• ### Improving Data Center Energy Efficiency With Advanced Thermal Management

Publication Year: 2017, Page(s):1228 - 1239
Cited by:  Papers (1)
| | PDF (2364 KB) | HTML

Experimental investigation of data center cooling and computational energy efficiency improvement through advanced thermal management was performed. A chiller-less data center liquid cooling system was developed that transfers the heat generated from computer systems to the outdoor ambient environment while eliminating the need for energy-intensive vapor-compression refrigeration. This liquid cool... View full abstract»

• ### Compact Selective Bandpass Filter With Wide Stopband for TETRA Band Applications

Publication Year: 2018, Page(s):653 - 659
| | PDF (1680 KB)

A selective miniaturized bandpass filter with wide stopband for TETRA band applications is presented in this paper. Basic resonator used in the filter construction is an open stub-loaded-short-circuited stepped-impedance resonator, which has the inherent property of having harmonics far from the fundamental mode. The high selectivity of the filter is obtained by virtue of the transmission zeros ar... View full abstract»

• ### Novel Microstrip-Based Simplified Approach for Fast Determination of Substrate Permittivity

Publication Year: 2018, Page(s):660 - 669
| | PDF (2408 KB)

This paper presents a simple and fast microstrip transmission line method for the broadband radio frequency characterization of dielectric substrate materials. The proposed method utilizes only the magnitude of the S-parameters of the microstrip line at certain discrete frequency points. The technique is thus free from the phase uncertainty problem, which is the main concern in conventional broadb... View full abstract»

• ### Improved Image Processing Algorithms for Microprobe Final Test

Publication Year: 2018, Page(s):499 - 505
| | PDF (2384 KB) | HTML

With the rapid development of the integrated circuit (IC) industry, testing of IC chips is becoming more and more important. A chip probe final test is an important means of final chip testing, which makes use of contacts between probes and bumps on the chip for electrical connections of the test instrument and the chip, through which the electrical characteristics of the chip are tested one by on... View full abstract»

• ### Thermally Conductive MgO-Filled Epoxy Molding Compounds

Publication Year: 2013, Page(s):1994 - 2005
Cited by:  Papers (4)  |  Patents (1)
| | PDF (3264 KB) | HTML

The use of magnesium oxide (MgO) as a filler in an epoxy molding compound (EMC) was considered to identify the maximum thermal conductivity that could be achieved without compromising rheological or processing control and processing flexibility. MgO is an attractive candidate filler for EMCs used in automotive and other applications because MgO is inexpensive, electrically insulative, has relative... View full abstract»

• ### Broadband Duplex-Filtenna Based on Low-Profile Metallic Cavity Packaging

Publication Year: 2018, Page(s):1 - 7
| | PDF (1852 KB)

An integrated method of broadband duplex-filtenna based on a 3-D metallic cavity structure is proposed in this paper. In our design, two broadband filtennas with different operation frequency bands share the same metallic cavity-backed resonator. The two operation bands are realized with fractional bandwidths (FBWs) of 24% and 18%. The whole total FBW of two bands achieves 57%... View full abstract»

• ### Design of $V$ -Band Wide-Beamwidth Circularly Polarized Wire-Bond Antenna

Publication Year: 2018, Page(s):261 - 268
| | PDF (4360 KB)

A V-band wide-beamwidth left-handed circularly polarized wire-bond antenna is presented in this paper. The proposed design, which is implemented by using integrated passive device process, consists of a 1:4 series-type ring-shaped microstrip power divider and four bond-wire radiators. The design of bond-wire radiator with wide-beamwidth characteristic is described. The design method of power divid... View full abstract»

• ### Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

Publication Year: 2018, Page(s):169 - 176
| | PDF (5939 KB) | HTML

In this paper, wafer-level AuSn/Pt solid-liquid interdiffusion bonding for hermetic encapsulation of microelectromechanical systems (MEMS) is evaluated. Although AuSn is used for bonding of ICs, the implementation of AuSn diffusion bonding in MEMS applications requires thorough understanding of its compatibility with the complete layer stack including adhesion, buffer, and metallization layers. Pa... View full abstract»

• ### Integration of Wireless Coil and Bluetooth Antenna for High Charging and Radiation Efficiencies

Publication Year: 2018, Page(s):1 - 8
| | PDF (2431 KB)

In this paper, a wireless charging coil integrated with a Bluetooth antenna is proposed. The equivalent circuit model is developed to analyze this multifunctional coil. The outermost turn of the coil is appropriately designed in order to improve the radiation efficiency of the antenna. In this way, the radiation frequency of the coil is determined by the length of the outermost coil. Meanwhile, th... View full abstract»

• ### Chip-to-Chip Copper Interconnects With Rough Surfaces: Analytical Models for Parameter Extraction and Performance Evaluation

Publication Year: 2018, Page(s):286 - 299
| | PDF (4060 KB)

In multigigahertz integrated circuit design, the extra delay and power losses due to surface roughness in copper (Cu) interconnects is more evident than ever before and needs utmost consideration. This paper reports novel closed-form expressions for parameter extraction in chip-tochip Cu interconnects at several gigahertz frequency ranges considering experimentally measured fractal surface roughne... View full abstract»

• ### Optimal Thermal Placement and Loss Estimation for Power Electronic Modules

Publication Year: 2018, Page(s):236 - 243
| | PDF (3168 KB)

In this paper, a study on loss estimation and optimal thermal placement of power electronic modules is presented. The module is a high-voltage inverter with three separated legs, mostly applicable in electric and hybrid vehicles. The loss is estimated using behavioral model and output waveforms obtained from the simulation in MATLAB. This model has used manufacturer's datasheets in order to facili... View full abstract»

• ### A Universal Approach for Designing an Unequal Branch-Line Coupler With Arbitrary Phase Differences and Input/Output Impedances

Publication Year: 2017, Page(s):944 - 955
| | PDF (2613 KB) | HTML

For the first time, this paper presents a novel approach for designing a coupler with arbitrary division, optional phase difference, and alternative input/output impedances. In the section of theoretical analysis, rigorous closed-form design equations are derived, and explicit methodology for computer-aided design is given based on the equations. To validate the idea, several numerical examples ex... View full abstract»

• ### PCB Embedded Semiconductors for Low-Voltage Power Electronic Applications

Publication Year: 2017, Page(s):387 - 395
| | PDF (2928 KB) | HTML

Power conversion applications in the low voltage (LV) range (≤ 1.2 kV)-such as three-phase inverters-are required to operate at higher efficiencies, higher ambient temperatures, increasingly smaller form factor, and higher power density. Up to now, most research has focused on voltages up to 650 V for printed circuit board (PCB) embedded power electronics. This research evaluates a novel th... View full abstract»

• ### Very Sharp Roll-Off Ultrawide Stopband Low-Pass Filter Using Modified Flag Resonator

Publication Year: 2018, Page(s):1 - 8
| | PDF (1742 KB)

In this paper, a low-pass filter (LPF) using modified flag resonators to achieve sharp roll-off and an ultrawide stopband up to 18 times the cutoff frequency (fc) is presented. To obtain a sharp roll-off, the inductor value of the prototype LC resonator is increased, and two series prototype LC resonators are considered. To realize compact size, the flagpoles of resonators are meandered. On the ot... View full abstract»

• ### Reconfigurable Bandstop and Bandpass Filters With Wideband Balun Using IPD Technology for Frequency Agile Applications

Publication Year: 2017, Page(s):610 - 620
| | PDF (5707 KB) | HTML

A tunable bandstop filter (BSF) with a wideband balun using integrated passive devices (IPDs) technology for multichip module is proposed. The compact tunable BSF uses barium strontium titanate (BST) varactors demonstrating a tuning range of 55% from 1.3 to 2.3 GHz with a 20-dB rejection level. The performance of the filter is optimized by applying asynchronous biases to the BST varactors, leading... View full abstract»

• ### Ultracompact Via-Based Absorptive Frequency-Selective Surface for 5-GHz Wi-Fi With Passbands and High-Performance Stability

Publication Year: 2018, Page(s):41 - 49
| | PDF (2329 KB) | HTML

A miniaturized absorptive frequency-selective surface (AFSS) allowing power transmission in other specific band is proposed in this paper. The via-based structure is adopted to make unit-cell size only 0.109λ0 × 0.109λ0, where λ0 is the wavelength in free space at operating frequency. The maximum absorption rate of 99.3% locates at 5.45 ... View full abstract»

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel