# IEEE Transactions on Components, Packaging and Manufacturing Technology

Includes the top 50 most frequently accessed documents for this publication according to the usage statistics for the month of

• ### 3-D Printed Metal-Pipe Rectangular Waveguides

Publication Year: 2015, Page(s):1339 - 1349
Cited by:  Papers (89)
| | PDF (2414 KB) | HTML

This paper first reviews manufacturing technologies for realizing air-filled metal-pipe rectangular waveguides (MPRWGs) and 3-D printing for microwave and millimeter-wave applications. Then, 3-D printed MPRWGs are investigated in detail. Two very different 3-D printing technologies have been considered: low-cost lower-resolution fused deposition modeling for microwave applications and higher-cost ... View full abstract»

• ### Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Publication Year: 2018, Page(s):991 - 1002
Cited by:  Papers (5)
| | PDF (4565 KB) | HTML

The design, materials, process, fabrication, and reliability of fan-out wafer-level packaging (FOWLP) with chip-first and die face-up method are investigated in this paper. Emphasis is placed on the issues and their solutions (such as reconstituted carrier, die-attach film placement, pitch compensation, die shift, epoxy molding compound dispensing, compression molding, warpage, and Cu revealing) d... View full abstract»

• ### Manufacturing Considerations in the 3-D Printing of Fractal Antennas

Publication Year: 2017, Page(s):1891 - 1898
Cited by:  Papers (3)
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The use of additive manufacturing (AM) techniques for the fabrication of 3-D fractal monopole antennas is presented. The 3-D printing (3-D P) of 3-D designs based on the Sierpinski fractal concept is studied, and the performance discussed. The AM allows the fabrication of the complex features of these antennas. The specific structures, on the other hand, provide a reduction of the material used in... View full abstract»

• ### A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Publication Year: 2018, Page(s):1281 - 1291
| | PDF (7054 KB) | HTML

A broadband, low-cost, high-gain, multilayer differential antenna without air cavity is proposed for the 60-GHz phased array system. By using the standard low-cost printed circuit board process, a 60-GHz phased array antenna element and a 16-element phased array antenna prototype are implemented. To improve the bandwidth and antenna gain, a superstrate and a float rectangular ring are designed. Th... View full abstract»

• ### A Filtering Dual-Polarized Antenna Subarray Targeting for Base Stations in Millimeter-Wave 5G Wireless Communications

Publication Year: 2017, Page(s):964 - 973
Cited by:  Papers (9)
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A 2×2 dual-polarized antenna subarray with filtering responses is proposed in this paper. This antenna subarray is a multilayered 3-D geometry, including a dual-path 1× 4 feeding network and four cavity-backed slot antennas. The isolation performance between two input ports is greatly improved by a novel method, which only needs to modify several vias in a square resonator. Cavities in the feeding... View full abstract»

• ### Packaging Solution for a Millimeter-Wave System-on-Chip Radar

Publication Year: 2018, Page(s):73 - 81
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In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a ... View full abstract»

• ### Geometry Analysis in Screen-Printed Stretchable Interconnects

Publication Year: 2018, Page(s):1344 - 1352
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Deformability of interconnects and conductors as the skeleton of soft electronic devices plays an important role in the stretchability of the whole system. To make the interconnects stretchable, either employing deformable materials or tailoring the design are the primary approaches. It is also possible to combine the two strategies. In advanced stretchable electronic circuits, there is a frequent... View full abstract»

• ### Novel Absorptive Balanced Bandpass Filters Using Resistive Loaded Transmission Lines

Publication Year: 2018, Page(s): 1
| | PDF (4458 KB)

This paper reports on design of novel balanced bandpass filters using quarter-wavelength stub resonators. For the design purposes, differential-mode (DM) and common-mode (CM) half equivalanet circuits are established and analyzed carefully. In this work, CM noise is introduced into the filter and dissipated on the resistors on periodic bands. First, a balanced bandpass filter topology based on con... View full abstract»

• ### An sEMG-Based Human–Robot Interface for Robotic Hands Using Machine Learning and Synergies

Publication Year: 2018, Page(s):1149 - 1158
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Developing natural control strategies represents an intriguing challenge in the design of human-robot interface (HRI) systems. The teleoperation of robotic grasping devices, especially in industrial, rescue, and aerospace applications, is mostly based on nonintuitive approaches, such as remote controllers. On the other hand, recent research efforts target solutions that mimic the human ability to ... View full abstract»

• ### Monolithic IPD-MEMS Technology and Its Applications to High-$Q$Switched Capacitor Banks and Variable True-Time-Delay Networks

Publication Year: 2018, Page(s):1327 - 1335
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A low-loss monolithic integrated passive device-microelectromechanical systems (IPD-MEMS) technology process on an alumina substrate is proposed. Two applications are investigated both theoretically and experimentally using the proposed IPD-MEMS process: 1) a high-quality-factor switched capacitor bank, and 2) a variable true-time-delay (TTD) network with a fine resolution. The measured IPD-MEMS c... View full abstract»

• ### Electrical Modeling and Characterization of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integration

Publication Year: 2018, Page(s):1336 - 1343
| | PDF (3276 KB) | HTML

Based on the extracted resistance, inductance, capacitance, and conductance parameters, this paper introduces the distributed transmission line model of silicon-core coaxial through-silicon vias (CTSVs), in which the vertical interconnect is made of a Cu-coated silicon pole. The proposed model is validated against a commercial electromagnetic simulation tool, showing it is highly accurate up to 10... View full abstract»

• ### Package Inductors for Intel Fully Integrated Voltage Regulators

Publication Year: 2016, Page(s):3 - 11
Cited by:  Papers (16)
| | PDF (3209 KB) | HTML

Intel fourth-generation and fifth-generation Core microprocessors are powered by high-frequency integrated switching voltage regulators. The inductors required to implement these regulators are constructed using the routing layers of conventional organic flip chip packaging. This paper provides an overview of the construction of these inductors including representative results from production pack... View full abstract»

• ### Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging

Publication Year: 2017, Page(s):1729 - 1738
Cited by:  Papers (2)
| | PDF (3972 KB) | HTML

In this paper, the warpage and thermal performances of fan-out wafer-level packaging (FOWLP) are investigated. Emphasis is placed on the characterization of the effects of FOWLP important parameters, such as chip size, chip thickness, package/chip area ratio, epoxy molding compound (EMC), chip EMC cap, reconstituted carrier material and thickness, and die-attach film, on the warpage after postmold... View full abstract»

• ### Design and Packaging of an Eye-Shaped Multiple-Input–Multiple-Output Antenna With High Isolation for Wireless UWB Applications

Publication Year: 2018, Page(s):635 - 642
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This paper presents a bandwidth enhanced, compact, multiple-input-multiple-output (MIMO) antenna with high isolation for modern wireless ultrawideband (UWB) applications. The proposed antenna consists of two simple eye-shaped slot radiators, and in order to enhance isolation, the proposed antenna uses a rectangular-shaped ground plane with an extruded T-shaped stub. The antenna characteristics suc... View full abstract»

• ### High Selectivity Balanced-to-Unbalanced Filtering Power Dividers Using Dual-mode Ring Resonators

Publication Year: 2018, Page(s): 1
| | PDF (1755 KB)

Two novel high selectivity balanced-to-unbalanced filtering power dividers using ring resonators are proposed. Even/odd-mode analysis method is applied to obtaine the design equations at the operating frequency. The ring resonators can bring two transmission zeros in each side of the passband for differential-mode for the filtering power divider (Structure I). Moreover, the three quarters waveleng... View full abstract»

• ### Novel Ultra-Wideband and Multi-Mode LTCC Common-Mode Filter Based on the Dual Vertical Coupling Paths

Publication Year: 2018, Page(s): 1
| | PDF (953 KB)

A novel ultra-wideband and miniaturized common- mode filter (CMF) is proposed for suppressing the common-mode (CM) noise based on the dual vertical coupling paths. In the proposed CMF, a modified quarter-wavelength transmission line resonator and a modified half-wavelength transmission line resonator are utilized to introduce three CM transmission zeros. Moreover, another CM transmission zero is p... View full abstract»

• ### Metallic Nanowires and Their Application

Publication Year: 2016, Page(s):1733 - 1751
Cited by:  Papers (5)
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Metallic nanowire films, especially silver nano-wires (AgNWs) and copper nanowires (CuNWs), with a random mesh structure have attracted considerable attention as high-performance flexible transparent films to replace the traditional, expensive, and brittle indium tin oxide films. These films have been widely used in displays, touchscreens, and solar cells to achieve next-generation electronics tha... View full abstract»

• ### Design of a Compact Wideband Butler Matrix Using Vertically Installed Planar Structure

Publication Year: 2018, Page(s):1420 - 1430
| | PDF (2726 KB) | HTML

In this paper, a novel 4×4 Butler matrix with wide bandwidth and compact size is presented. The existing coupled-line-based quadrature coupler cannot be used to construct a Butler matrix due to the location of output ports. To solve this problem, a swap is introduced in a vertically installed planar structure to implement the quadrature coupler and a crossover required by a Butler matrix. For demo... View full abstract»

• ### Plasma-Generated Etchback to Improve the Via-Reliability in High-Tg Substrates Used in Multilayer PWBs for Space Electronic Packaging

Publication Year: 2016, Page(s):926 - 932
Cited by:  Papers (1)
| | PDF (2982 KB) | HTML

High-Tg (glass transition temperature, 210°C) woven fiber-glass reinforced multifunctional-epoxy FR-4 laminates are now becoming main trend in the fabrication of multilayer printed wiring boards (PWBs) for space application due to their inherent properties of better dimensional stability, low coefficient of thermal expansion, and the capability to withstand multiple soldering operations. In PWBs, ... View full abstract»

• ### Die Attach Materials for High Temperature Applications: A Review

Publication Year: 2011, Page(s):457 - 478
Cited by:  Papers (144)
| | PDF (3230 KB) | HTML

The need for high power density and high temperature capabilities in today's electronic devices continues to grow. More robust devices with reliable and stable functioning capabilities are needed, for example in aerospace and automotive industries as well as sensor technology. These devices need to perform under extreme temperature conditions, and not show any deterioration in terms of switching s... View full abstract»

• ### Printing Green Nanomaterials for Organic Electronics

Publication Year: 2018, Page(s):1307 - 1315
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Organic electronics have attracted increasing attention in recent years because of their large-scale production potential. In this context, inkjet printing as a scalable manufacturing process is well positioned for supporting the fabrication of organic electronics. In this paper, we propose a green substrate and functional inks based on bionanomaterials for fabricating dielectric and conductive la... View full abstract»

• ### Wire Defect Recognition of Spring-Wire Socket Using Multitask Convolutional Neural Networks

Publication Year: 2018, Page(s):689 - 698
| | PDF (4221 KB) | HTML

As a critical electrical connector component in the modern industrial environment, spring-wire sockets and their manufacture quality are closely relevant to equipment safety. These types of defects in a component are difficult to properly distinguish due to the defect similarity and diversity. In such cases, defect types can only be determined using cumbersome human visual inspection. To satisfy t... View full abstract»

• ### Broadband Duplex–Filtenna Based on Low-Profile Metallic Cavity Packaging

Publication Year: 2018, Page(s):1451 - 1457
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An integrated method of broadband duplex-filtenna based on a 3-D metallic cavity structure is proposed in this paper. In our design, two broadband filtennas with different operation frequency bands share the same metallic cavity-backed resonator. The two operation bands are realized with fractional bandwidths (FBWs) of 24% and 18%. The whole total FBW of two bands achieves 57%, and there are radia... View full abstract»

• ### Planar In-Phase Filtering Power Divider With Tunable Power Division and Controllable Band for Wireless Communication Systems

Publication Year: 2018, Page(s):1458 - 1468
| | PDF (2284 KB) | HTML

A wideband in-phase power divider with tunable power division ratio (PDR) and filtering response is presented. The proposed design is quite compact and consists of a three-line coupled structure and loaded with a pair of varactor-loaded short-ended stubs at two output terminations. A variable power division is realized by tuning the coupling factors between the centerline and sidelines of the thre... View full abstract»

• ### Inkjet Printing of Wideband Stacked Microstrip Patch Array Antenna on Ultrathin Flexible Substrates

Publication Year: 2018, Page(s):1695 - 1701
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This paper presents a bandwidth-enhanced, low-cost, compact, inkjet-printed multilayer microstrip fractal patch antenna for integration into flexible and conformal devices. The antenna consists of two layers of patches, with the first layer inkjet-printed directly on a 0.125-mm (only 0.005 of the operating wavelength) Kapton polyimide substrate. On top of it, a 0.12-mm-thick SU-8 polymer is covere... View full abstract»

• ### Novel RDL Design of Wafer-Level Packaging for Signal/Power Integrity in LPDDR4 Application

Publication Year: 2018, Page(s):1431 - 1439
| | PDF (6123 KB) | HTML

The emerging wafer-level packaging (WLP) technology suffers from serious signal integrity (SI) and power integrity (PI) issues due to its redistribution layer (RDL). There exhibit serious parasitic effects by the high-density RDL traces and less flexibility of decoupling capacitors, so the robust power distribution network is critical to design. This paper proposed a novel two-layered RDL design i... View full abstract»

• ### Insertion Loss Characterization of Impedance Matching Networks for Low-Power Rectennas

Publication Year: 2018, Page(s):1632 - 1641
| | PDF (2813 KB) | HTML

An impedance matching network inserted between an antenna and a rectifier is essential for rectennas, but few studies have characterized the insertion loss of the matching network if nonideal matching elements are considered. In general, the matching elements, including lumped capacitors, lumped inductors, and transmission lines, are approximated as lossless; if the overall conversion efficiency d... View full abstract»

• ### Thermal Management of Electronic Devices Using Combined Effects of Nanoparticle Coating and Graphene–Water Nanofluid in a Miniature Loop Heat Pipe

Publication Year: 2018, Page(s):1241 - 1253
| | PDF (3463 KB) | HTML

The thermal management of electronic devices such as high-end central processing units, graphic processing units, insulated gate bipolar transistor, and circuit breaker in low-voltage switchboard operating between 20 and 380 W is investigated using a miniature loop heat pipe (mLHP) having nanoparticle-coated evaporator with graphene-water nanofluid. The thermal evaporation method is used to deposi... View full abstract»

• ### Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

Publication Year: 2018, Page(s):1231 - 1240
| | PDF (4282 KB) | HTML

High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles... View full abstract»

• ### A Low-Phase-Noise and Wide-Tuning-Range CMOS/IPD Transformer-Based VCO With High$\mathrm {FOM}_{T}$of −206.8 dBc/Hz

Publication Year: 2016, Page(s):145 - 152
Cited by:  Papers (9)
| | PDF (2074 KB) | HTML

This paper presents a low-phase-noise and wide-tuning-range voltage-controlled oscillator (VCO) implemented in a standard 0.18-μm complementary metal-oxide-semiconductor (CMOS) process with an integrated passive device (IPD) transformer. Even- and odd-mode oscillations of the transformer-based resonator can be achieved by the mode-switching topology, and the oscillations in the two modes result in... View full abstract»

• ### Towards Thermal-Acoustic Co-Design of Noise-Reducing Heat Sinks

Publication Year: 2018, Page(s):1411 - 1419
| | PDF (1491 KB) | HTML

Several thermal management applications involve fan-mounted heat sinks that result in fan-generated noise as an undesired by-product. These applications require noise reduction and attempt to reduce noise using separate muffler devices. However, space for separate heat-sinking and noise-reducing functionalities may be challenging in high-performance applications such as electronics cooling, data c... View full abstract»

• ### High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Publication Year: 2015, Page(s):863 - 878
Cited by:  Papers (5)
| | PDF (4503 KB) | HTML

As technology develops, the number of chips increases while the thickness of mobile products continuously decreases, which leads to the need for high-density packaging techniques with high numbers of power and signal lines. By applying wireless power transfer technology at the printed circuit board (PCB) and package levels, the number of power pins can be greatly reduced to produce more space for ... View full abstract»

• ### $48\times10$-Gb/s Cost-Effective FPC-Based On-Board Optical Transmitter and Receiver

Publication Year: 2018, Page(s):1353 - 1362
| | PDF (3118 KB) | HTML

In this paper, we demonstrate a low-cost, 48-channel, high-speed, flexible printed circuit (FPC)-based interconnect packaging concept for on-board optical modules. Due to the good high-speed performance and low cost, the FPC board is used as the base carrier for both transmitter and receiver modules. The on-board transmitter and receiver are based on a commercial 1-mm-pitch ISI HoLi pin grid array... View full abstract»

• ### Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

Publication Year: 2018, Page(s):1254 - 1262
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High-power light-emitting diode (LED) chip-scale packages (CSPs) prepared by the flip-chip technology have become one of the most promising light sources. The die attach solder layer always plays an important role in heat dissipation, mechanical support, and electronic conductivity. Among different types of solder materials, Sn-3.0Ag-0.5Cu (SAC305) solder alloy shows its great competitiveness on s... View full abstract»

• ### Thermally Conductive MgO-Filled Epoxy Molding Compounds

Publication Year: 2013, Page(s):1994 - 2005
Cited by:  Papers (4)  |  Patents (1)
| | PDF (3264 KB) | HTML

The use of magnesium oxide (MgO) as a filler in an epoxy molding compound (EMC) was considered to identify the maximum thermal conductivity that could be achieved without compromising rheological or processing control and processing flexibility. MgO is an attractive candidate filler for EMCs used in automotive and other applications because MgO is inexpensive, electrically insulative, has relative... View full abstract»

• ### A Wideband Reconfigurable Impedance Matching Network for Complex Loads

Publication Year: 2018, Page(s):1073 - 1081
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A novel wideband reconfigurable impedance matching network is presented, which consists of a main transmission line and several switchable branch lines. The proposed network can match different complex loads at different frequency bands. A novel optimization method is proposed to calculate the circuit parameters efficiently. The calculation results indicate that the proposed impedance matching net... View full abstract»

• ### Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure

Publication Year: 2018, Page(s):1363 - 1372
| | PDF (2470 KB) | HTML

The linear viscoelastic properties of epoxy molding compound (EMC) are measured by an embedded fiber Bragg grating (FBG) sensor. A single cylindrical EMC specimen is fabricated, and it is subjected to constant uniaxial compression and hydrostatic pressure at various temperatures. The FBG embedded in the specimen records strain histories as a function of time. Two linear viscoelastic properties (Yo... View full abstract»

Publication Year: 2016, Page(s):1162 - 1173
Cited by:  Papers (3)
| | PDF (4252 KB) | HTML

A phased-array receiver module operating at 77 GHz is designed and manufactured to obtain beam-steering capability. The module has four patch antennas integrated with three active phase shifter (APS) chips on a single-layer Rogers 3003 printed circuit board PCB board. The W-band 1.65-mm2novel APS chip is fabricated using 0.13-μm SiGe Heterojunction Bipolar Transistor (HBT) technology. T... View full abstract»

• ### 3-D X-Ray Imaging With Nanometer Resolution for Advanced Semiconductor Packaging FA

Publication Year: 2018, Page(s):745 - 749
| | PDF (1257 KB) | HTML

As the complexity and interconnect density of advanced semiconductor packages increase, failure analysis and root cause determination are also facing new challenges and higher requirements. The 3-D X-ray microscopy, enabling nondestructive defect imaging and enhanced navigation for failure analysis, is considered a key method to fulfill these requirements. This technique results in a short time to... View full abstract»

• ### Integrated Packaging Design of Low-Cost Bondwire Interconnection for 60-GHz CMOS Vital-Signs Radar Sensor Chip With Millimeter-Wave Planar Antenna

Publication Year: 2018, Page(s):177 - 185
| | PDF (3551 KB) | HTML

This paper presents a compact integration design of a low-cost bondwire-interconnection scheme between a 60-GHz CMOS vital-signs Doppler radar sensor chip and a millimeterwave patch-array planar antenna (17-dBi gain). The interconnection has the form of an inductance-capacitance-inductance structure configured as a T-matching network. It consists of a short microstrip line as a small capacitance a... View full abstract»

• ### Design Exploration of Package-Embedded Inductors for High Efficiency Integrated Voltage Regulators

Publication Year: 2018, Page(s): 1
| | PDF (1815 KB)

This paper describes the modeling and design of package-embedded magnetic core inductors for a System-in-Package based high efficiency integrated voltage regulator. An application example is used to demonstrate the complete design process, starting with the fabrication of two candidate magnetic composite materials. Based on the measured properties of these materials, magnetic core inductors are de... View full abstract»

• ### Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC for Frequencies up to 67 GHz

Publication Year: 2011, Page(s):595 - 601
Cited by:  Papers (23)
| | PDF (811 KB) | HTML

A wide-band microstrip-to-microstrip via transition proposed for connecting an integrated circuit chip and an antenna array on the opposite sides of a multilayered low-temperature co-fired ceramic substrate is investigated in this paper. To facilitate the design, it is decomposed into external and internal segments, which consist of two microstrip-to-via transitions and a multilayered through-hole... View full abstract»

• ### Ultracompact CMOS 60-GHz Tapped-Line Combline BPF With Two Transmission Zeros Using Defected Ground Structures

Publication Year: 2018, Page(s):1642 - 1649
| | PDF (2152 KB) | HTML

In this paper, we propose a compact on-chip 60-GHz bandpass filter (BPF) in complementary metal–oxide–semiconductor (CMOS) technology. The CMOS BPF employs a tapped-line combline configuration with folding and overlapping to achieve a compact size. The combline BPF is realizable with low insertion loss (IL) due to capacitive loading, which reduces the physical length of the resonators and conseque... View full abstract»

• ### New Wilkinson Power Dividers and Their Integration Applications to Four-Way and Filtering Dividers

Publication Year: 2014, Page(s):1828 - 1837
Cited by:  Papers (22)
| | PDF (3159 KB) | HTML

This paper involved developing two (Type I and Type II) equal-split Wilkinson power dividers (WPDs). The Type I divider can use two short uniform-impedance transmission lines, one resistor, one capacitor, and two quarter-wavelength (λ/4) transformers in its circuit. Compared with the conventional equal-split WPD, the proposed Type I divider can relax the two λ/4 transformers and the output ports l... View full abstract»

• ### PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models

Publication Year: 2011, Page(s):208 - 219
Cited by:  Papers (72)
| | PDF (1770 KB) | HTML

The impedance of a power-distribution network (PDN) in three-dimensionally stacked chips with multiple through-silicon-via (TSV) connections (a 3D TSV IC) was modeled and analyzed using a power/ground (P/G) TSV array model based on separated P/G TSV and chip-PDN models at frequencies up to 20 GHz. The proposed modeling and analysis methods for the P/G TSV and chip-PDN are fundamental for estimatin... View full abstract»

• ### Impact of Ground via Placement in Grounded Coplanar Waveguide Interconnects

Publication Year: 2016, Page(s):136 - 144
Cited by:  Papers (4)  |  Patents (1)
| | PDF (3617 KB) | HTML

Methods for higher order parallel plate mode suppression in grounded coplanar waveguides (GCPW) using unique ground via structures are presented in this paper. Suppression of these higher order modes can increase GCPW bandwidth. The ground via fence parameters that affect the bandwidth of the GCPWs are also discussed. Two new structures using staggered ground via fences and with defected side grou... View full abstract»

• ### Study on Whisker Growth on Solder Joints—Part I: Study on Acceleration Test Method

Publication Year: 2018, Page(s):1477 - 1486
| | PDF (3580 KB) | HTML

The shift to lead-free tin-based solder in electronics has created a frequent observation of whisker growth from the plated tin surface. With an expectation that the tin whisker growth is not limited to the tin-plated surface, a three-year project of the Japan Electronics and Information Technology Industries Association (JEITA) for a study of whiskers on lead-free electronics was initiated in 200... View full abstract»

• ### High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)

Publication Year: 2011, Page(s):181 - 195
Cited by:  Papers (221)  |  Patents (2)
| | PDF (3071 KB) | HTML

We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic <i>RLGC</i> equations derived from the physical configuration. Each ... View full abstract»

• ### Theoretical Design of Broadband Multisection Wilkinson Power Dividers With Arbitrary Power Split Ratio

Publication Year: 2016, Page(s):605 - 612
Cited by:  Papers (8)
| | PDF (2884 KB) | HTML

This paper describes a new approach for the theoretical design of unequal multisection Wilkinson power dividers, using single-layer microstrip lines. Similar to most multisection structures, the presented unequal divider can provide a broadband performance. To provide the design guideline, closed-form formulas are derived for the divider with odd or even number of sections. In each case, various s... View full abstract»

• ### SMPS Ringing Noise Modeling and Managing Methodology for RFI Solutions in Mobile Platforms

Publication Year: 2018, Page(s):554 - 561
| | PDF (1459 KB) | HTML

In mobile platforms, RF interference issues caused by the switched-mode power supply (SMPS) ringing noise often arise in the on-the-go mode and the charging mode of the interface power management integrated circuits. In this paper, we introduce the modeling method for the SMPS ringing noise in the conventional two-level dc-dc converters and then, based on the modeling insight from the two-level dc... View full abstract»

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel