Volume 7 Issue 1 • March 2013
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[Front cover]
Publication Year: 2013, Page(s): C1|
PDF (651 KB)
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Table on contents
Publication Year: 2013, Page(s): 1|
PDF (1259 KB)
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Masthead
Publication Year: 2013, Page(s): 2|
PDF (163 KB)
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Supporting and driving innovation [The Editor's Desk]
Publication Year: 2013, Page(s): 3 -
Video Rate Atomic Force Microscopy: Use of compressive scanning for nanoscale video imaging
Publication Year: 2013, Page(s):4 - 8
Cited by: Papers (12)Atomic Force Microscopy (AFM) is a powerful instrument for studying and exploring the nanoworld [1]. AFM can obtain ultrahigh-resolution images at the subnanoscale level. However, AFM has a very significant drawback of slow imaging speed, which is due to its working principle. A conventional AFM conducts a raster scan of an entire area to generate a topography image. Therefore, the frame rate is l... View full abstract»
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Nanotechnology Public Funding and Impact Analysis: A Tale of Two Decades (1991-2010)
Publication Year: 2013, Page(s):9 - 14
Cited by: Papers (7)Nanotechnology's economic and societal benefits have continued to attract significant research and development (R&D) attention from governments and industries worldwide. Over the past two decades, nanotechnology has seen quasi-exponential growth in the numbers of scientific papers and patent publications produced. New research topics and application areas are continually emerging, and investme... View full abstract»
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Communicating Novel Computational State Variables: Post-CMOS Logic
Publication Year: 2013, Page(s):15 - 23
Cited by: Papers (1)The semiconducting material silicon forms the heart of the current complimentary metal?oxide semiconductor (CMOS) technology. Over the last four decades, the productivity of silicon technology has increased by a factor of more than a billion [1]. This growth in silicon technology was made possible by a steady reduction in the feature size, which helps pack more functionality per cost in a micropro... View full abstract»
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Advancing Electronic Packaging Using Microsolder Balls: Making 25-nm Pitch Interconnection Possible
Publication Year: 2013, Page(s):24 - 30
Cited by: Papers (3)Electronic packaging technology has advanced in the direction of integrating diverse components into one package to satisfy market demands for multifunctionality as well as portability. For this reason, various packaging structures have been introduced, such as multichip modules, package on package, package in package, and eventually three-dimensional (3-D)-chip stacks. All of these approaches req... View full abstract»
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Integrated microfluidic systems for molecular diagnostics: A universal electrode platform for rapid diagnosis of urinary tract infections
Publication Year: 2013, Page(s):31 - 37
Cited by: Papers (2)Transforming microfluidics-based biosensing systems from laboratory research into clinical reality remains an elusive goal despite decades of intensive research. A fundamental obstacle in the development of fully automated microfluidic diagnostic systems is the lack of an effective strategy for combining multiple pumping, sample preparation, and detection modules into an integrated platform. In th... View full abstract»
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IEEE-NANOMED 2012 [Conference Review]
Publication Year: 2013, Page(s): 38|
PDF (917 KB)
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Graphene Synthesis and Applications (Choi, W. and Lee, J.-W., Eds.) [Book Review]
Publication Year: 2013, Page(s):39 - 40
Aims & Scope
The scope of IEEE Nanotechnology Magazine is all aspects of nanotechnology including theory, analysis, design, implementation, and applications related to creation of materials, devices, structures, etc. by manipulating matter at the nanometer length scale and taking advantage of novel (physical, chemical, electrical, mechanical, optical, magnetic, biological) properties which arise solely due to the nanometer scale. Contents are written at a general level aimed at a broad audience. The magazine publishes articles covering new research and developments toward a broad audience, tutorials, and surveys in the field of nanotechnology in addition to industry news, research news, education news, policy news, opinion pieces, book reviews, updates on people, introduction to new tools and techniques, funding and meetings news, patent summary, and commercialization.
Meet Our Editors
Editor-in-Chief
John T.W. Yeow
Professor
Dept. of Systems Design Engineering
University of Waterloo
jyeow@uwaterloo.ca