# IEEE Transactions on Components, Packaging and Manufacturing Technology

## Filter Results

Displaying Results 1 - 25 of 27
• ### [Front cover]

Publication Year: 2013, Page(s): C1
| PDF (223 KB)
• ### IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2013, Page(s): C2
| PDF (122 KB)

Publication Year: 2013, Page(s):361 - 362
| PDF (131 KB)
• ### Low-Temperature Pressure-Less Silver Direct Bonding

Publication Year: 2013, Page(s):363 - 369
Cited by:  Papers (15)
| | PDF (1470 KB) | HTML

A light-emitting diode (LED) die and a glass substrate, both of which were coated with a few-micrometers-thick silver layer, was successfully direct-bonded above 200°C in air without any pressure. In this silver direct bonding, the following three factors are essential: 1) keeping surfaces of silver layers clean; 2) bonding with a suitable solvent that can be reduced and has a boiling point... View full abstract»

• ### Effect of the Thermomechanical Properties of No-Flow Underfill Materials on Interconnect Reliability

Publication Year: 2013, Page(s):370 - 376
Cited by:  Papers (1)
| | PDF (1414 KB) | HTML

The demands on flip chip packaging are increasing as the requirement for miniaturization and thinner silicon chips rises. In encapsulating flip chip packages it is important to not only maintain the mountability, but also to control the warpage of the package. In this paper, three types of underfill material with different thermomechanical properties are prepared. The requirements for achieving bo... View full abstract»

• ### Contact Physics of Capacitive Interconnects

Publication Year: 2013, Page(s):377 - 383
Cited by:  Papers (3)
| | PDF (1092 KB) | HTML

The resistance and capacitance of a typical multipoint contact interface have been used to assess the impact on high-frequency signal integrity. In the past, it has been shown how fully degraded interfaces could still provide acceptable performance for signal transfers at high data rates. In the case of fully degraded contacts, signals were shown to transfer by capacitive coupling and wave propaga... View full abstract»

• ### Material and Structure Designs for Reliable Quad-Flat-Package for Scaled-Down Ultralarge-Scale Integrations With Porous Low-$k/{rm Cu}$ Interconnects

Publication Year: 2013, Page(s):384 - 390
| | PDF (1642 KB) | HTML

Reliability of a quad-flat-package (QFP) with a circuit-under-pad (CUP) structure is investigated for Cu interconnects with porous low dielectric constant (low-k) films in scaled-down ultralarge-scale integrations. The following experimental factors are discussed: 1) low-k material properties and their stacking structures; 2) CUP structure; and 3) mold compound material properties. The QFP charact... View full abstract»

• ### Compact Tunable Bandpass Filter With a Fixed Out-of-Band Rejection Based on Hilbert Fractals

Publication Year: 2013, Page(s):391 - 400
Cited by:  Papers (7)
| | PDF (1512 KB) | HTML

This paper proposes a new type of compact tunable bandpass filter with bandwidth tuning and out-of-band fixed rejection. Because we employ the modified Hilbert fractal structure loaded with varactors as resonators, the tunable filter has a very compact configuration and a constant shape over the entire tuning range. The frequency selectivity is improved by introducing a cross coupling between the ... View full abstract»

• ### Acceleration of Spectral Domain Approach for Generalized Multilayered Shielded Microstrip Interconnects Using Two Fast Convergent Series

Publication Year: 2013, Page(s):401 - 410
Cited by:  Papers (5)
| | PDF (1269 KB) | HTML

A simple and versatile approach for the acceleration of the spectral domain approach for generalized shielded microstrip interconnects is presented. This approach uses asymptotic expansion for the Bessel's function and the Green's function followed by an approximation of infinite summation using two fast convergent sine cosine series. The asymptotic expansion coefficients of the Green's functions ... View full abstract»

• ### High-Performance, Compact Quasi-Elliptic Band Pass Filters for V-Band High Data Rate Radios

Publication Year: 2013, Page(s):411 - 416
Cited by:  Papers (14)
| | PDF (762 KB) | HTML

This paper presents a comparison of the design and implementation of V-band quasi-elliptic band pass filters suitable for system-on-package integration at millimetre-wave frequencies. Filters were designed and manufactured at low-temperature co-fired ceramic (LTCC) and alumina substrates. Filter circuits include the input/output coplanar waveguide to microstrip transitions as well as the microwave... View full abstract»

• ### Conformal Phosphor Distribution for White Lighting Emitting Diode Packaging by Conventional Dispensing Coating Method With Structure Control

Publication Year: 2013, Page(s):417 - 421
Cited by:  Papers (12)
| | PDF (1073 KB) | HTML

Conformal phosphor distribution is a well known way to improve optical performance for white light emitting diode (LED) packaging. However, it is difficult to be realized by mature and cheap dispensing coating methods. In this paper, with consideration given to the effect of boundary constraint on liquid wetting morphology, a method to achieve phosphor conformal distribution is presented by conven... View full abstract»

• ### Broadband Packaging of Photodetectors for 100 Gb/s Ethernet Applications

Publication Year: 2013, Page(s):422 - 429
Cited by:  Papers (1)
| | PDF (1248 KB) | HTML

The packing structure of functional modules is a major limitation in achieving a desired performance for 100 Gb/s ethernet applications. This paper presents a methodology of developing advanced packaging of photodetectors (PDs) for highspeed data transmission applications by using 3-D electromagnetic (EM) simulations. A simplified model of the PD module is first used to analyze and optimize packag... View full abstract»

• ### On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes

Publication Year: 2013, Page(s):430 - 440
Cited by:  Papers (10)
| | PDF (2634 KB) | HTML

The long-term reliability of SnAgCu solder joints under actual field service conditions is far from well understood. Most accelerated cycling tests are restricted to constant amplitudes, whereas realistic environments usually involve varying amplitudes and/or more than one type of loading. Thus assessments of life as well as relative comparisons of alternatives in terms of life in service invariab... View full abstract»

• ### High-Speed Shear Test for Low Alpha Sn-1.0%Ag-0.5%Cu (SAC-105) Solder Ball of Sub-100-$mu{rm m}$ Dimension for Wafer Level Packaging

Publication Year: 2013, Page(s):441 - 451
Cited by:  Papers (7)
| | PDF (2219 KB) | HTML

The issue of soft error in microelectronics packaging has necessitated the development of low alpha activity solders, as solders are found to be one of the major sources of radiation in electronic devices that causes soft error. Low alpha ray emitter Sn-1.0Ag-0.5Cu (SAC) solders were prepared and their alpha activity was measured using ultra-low background alpha particle counting systems. The sold... View full abstract»

• ### Warpage Prediction and Experiments of Fan-Out Waferlevel Package During Encapsulation Process

Publication Year: 2013, Page(s):452 - 458
Cited by:  Papers (18)
| | PDF (1086 KB) | HTML

A wafer level package (WLP) that has a flip chip form and uses thin-film redistribution with solder bumps to connect the package to the printed wiring board directly is discussed in this paper. A liquid molding compound is used for the encapsulation process. Since the thickness of the fan-out WLP is smaller than that in a traditional integrated circuit (IC) package, the fan-out WLP induces more se... View full abstract»

• ### Warpage Estimation of a Multilayer Package Including Cure Shrinkage Effects

Publication Year: 2013, Page(s):459 - 466
Cited by:  Papers (6)
| | PDF (637 KB) | HTML

Warpage and residual stresses in plastic electronics packages are partly due to the shrinkage of the epoxy molding compound during the cure stage and partly due to the mismatch in thermal expansions during the cooling stage. Here, we present a simple but robust way of estimating the warpage part due to the curing effects. The main assumption of our analytical model is that the molding compound rem... View full abstract»

• ### Design of Compact Dual-Band Power Dividers With Frequency-Dependent Division Ratios Based on Multisection Coupled Line

Publication Year: 2013, Page(s):467 - 475
Cited by:  Papers (15)  |  Patents (1)
| | PDF (1192 KB) | HTML

In this paper, a design method of compact dual-band power dividers with frequency-dependant power division ratios in two separated bands is proposed. A multisection coupled-line scheme is presented that takes advantage of the different odd- and even-phase velocities of a microstrip implemented coupled line. The proposed method is applicable to an extended frequency ratio of 1.4-3 compared to the f... View full abstract»

• ### Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC

Publication Year: 2013, Page(s):476 - 488
Cited by:  Papers (3)
| | PDF (2870 KB) | HTML

In this paper, we propose a fast and accurate model of the vertical noise coupling from an on-chip switching-mode power supply (SMPS) to a low noise amplifier (LNA) in a stacked 3-D-IC. To achieve both speed and accuracy, the model is based on the analytic formulas of static R, L, and C parasitic extraction, and includes consideration of the phase difference in the on-chip inductors using a new it... View full abstract»

• ### Complete Modeling of Large Via Constellations in Multilayer Printed Circuit Boards

Publication Year: 2013, Page(s):489 - 499
Cited by:  Papers (15)
| | PDF (824 KB) | HTML

This paper presents, for the first time, the comprehensive modeling of complete via constellations consisting of several thousands of vias in multilayer printed circuit boards using the physics-based approach. For each computational step of the physics-based approach, several alternatives are analyzed with regard to their computational efficiency, and calculation times are discussed as a function ... View full abstract»

• ### Novel Extraction of a Table-Based I–Q Behavioral Model for High-Speed Digital Buffers/Drivers

Publication Year: 2013, Page(s):500 - 507
Cited by:  Papers (7)
| | PDF (925 KB) | HTML

An efficient and accurate table-based behavioral model extraction for high-speed input/output (I/O) buffer behavior is presented in this paper. The nonlinear current-voltage (I-V) and charge-voltage (Q-V) functions describing the graybox model structure are extracted via least-squares methods using identification signals recorded from large signal transient simulation. The resulting continuous tim... View full abstract»

• ### Predicting the Behavior of Screen Printing

Publication Year: 2013, Page(s):508 - 515
Cited by:  Papers (1)
| | PDF (797 KB) | HTML

A novel mathematical model is presented of the liquid transfer process encountered during screen printing, enabling the prediction of the volume of liquid removed from a mesh and printed on a substrate with reasonable accuracy. It is based on the key assumption that free surface effects dominate and the printed liquid is pulled out of, rather than flows from, the mesh. The model is validated again... View full abstract»

• ### Classification of Solder Joint Using Feature Selection Based on Bayes and Support Vector Machine

Publication Year: 2013, Page(s):516 - 522
Cited by:  Papers (8)
| | PDF (807 KB) | HTML

In this paper, a feature selection and a two-stage classifier for solder joint inspection have been proposed. Using a three-color (red, green, and blue) hemispherical light-emitting diode array illumination and a charge-coupled device color digital camera, images of solder joints can be obtained. The color features, including the average gray level and the percentage of highlights and template-mat... View full abstract»

• ### Laser Trim Pattern Optimization for CuAlMo Thin-Film Resistors

Publication Year: 2013, Page(s):523 - 529
Cited by:  Papers (4)
| | PDF (630 KB) | HTML

The influence of varying laser trim patterns on the electrical performance of a novel CuAlMo thin-film resistor material is investigated. The benefits and limitations of various trim geometries are considered before two patterns, the “L” cut and serpentine cut, are selected to laser-trim resistor samples to target values of 1-10 Ω, using previously optimized laser conditions. ... View full abstract»

• ### [Blank page]

Publication Year: 2013, Page(s): 530
| PDF (5 KB)
• ### Open Access

Publication Year: 2013, Page(s): 531
| PDF (1156 KB)

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel