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# IEEE Transactions on Components, Packaging and Manufacturing Technology

## Filter Results

Displaying Results 1 - 25 of 26
• ### [Front cover]

Publication Year: 2012, Page(s): C1
| PDF (283 KB)
• ### IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2012, Page(s): C2
| PDF (123 KB)
• ### Table of contents

Publication Year: 2012, Page(s):1737 - 1738
| PDF (133 KB)
• ### Assembly Materials and Processes for High-Temperature Geothermal Electronic Modules

Publication Year: 2012, Page(s):1739 - 1749
Cited by:  Papers (3)
| | PDF (3459 KB) | HTML

Geothermal well logging and instrumentation applications require high-temperature logging tools and sensors with long-term operation capability at 300°C. Advanced SiC technology has enabled high-temperature electronics. To build functional systems operating at high temperatures, an interconnection and packaging technology must be developed to interconnect SiC devices and passive components.... View full abstract»

• ### Failure Mechanism in Thick Film Materials for 300$~{}^{circ}{rm C}$ Operation

Publication Year: 2012, Page(s):1750 - 1758
| | PDF (2001 KB) | HTML

Geothermal well logging and instrumentation applications require electronics capable of operation at 300°C. SiC device technology enables the design and fabrication of analog circuits that can operate at these temperatures. However, to build functional systems that can operate at high temperatures, an interconnection and packaging technology must be developed to provide interconnectivity be... View full abstract»

• ### Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$,times,$5-${rm mm}^{2}$ Chip Attachment

Publication Year: 2012, Page(s):1759 - 1767
Cited by:  Papers (19)
| | PDF (2005 KB) | HTML

For decades, soldering has been the technology of choice in die bonding for power electronics applications. However, conventional solders cannot meet the requirement for high-temperature applications. Recently, a low-temperature sintering technique involving a nanosilver paste was developed for attaching semiconductor chips to substrates. Sintered nanosilver joints showed high reliability in high-... View full abstract»

• ### Genetic-Algorithm-Based Controlling of Microcontact Distributions to Minimize Electrical Contact Resistance

Publication Year: 2012, Page(s):1768 - 1776
Cited by:  Papers (4)
| | PDF (2406 KB) | HTML

When two large conductors are in contact over a finite area, the real contact area is determined by the number of clusters of microcontacts where the positions of the clusters are determined by the large-scale waviness of the surface. In addition, the microcontacts are influenced by the small-scale surface roughness. It is widely recognized that the constriction resistance is determined partly by ... View full abstract»

• ### Development of 25-$mu{rm m}$ -Pitch Microbumps for 3-D Chip Stacking

Publication Year: 2012, Page(s):1777 - 1785
Cited by:  Papers (7)
| | PDF (1491 KB) | HTML

The development of ultrafine-pitch microbumps and the thermal compression bonding (TCB) process for advanced 3-D stacking technology are discussed in this paper. Microbumps, consisting of Cu pillars and thin Sn caps with a pitch of 25 μm, are fabricated on an Si chip by the electroplating method. Total thickness of the Cu pillar and the Sn cap is 10 μm. Electroless nickel and immersi... View full abstract»

• ### Fluid/Structure Interaction Investigation in PBGA Packaging

Publication Year: 2012, Page(s):1786 - 1795
Cited by:  Papers (10)
| | PDF (1723 KB) | HTML

This paper presents experimental and simulation studies of 3-D fluid/structure interaction (FSI) of wire sweep during the encapsulation process of plastic ball grid array (PBGA) packaging in different dies (single and stacked dies). A scaled-up package is fabricated to emulate the encapsulation of PBGA packaging and to study the effects of the FSI phenomenon in the PBGA package. A 3-D model of the... View full abstract»

• ### Moisture Ingress Into Packages With Walls of Varying Thickness And/Or Properties: A Simple Calculation Method

Publication Year: 2012, Page(s):1796 - 1801
Cited by:  Papers (7)
| | PDF (592 KB) | HTML

For electronic devices that work at high humidity (such as implants), but for which only a moderate lifetime is required, it is possible to use polymer packages for protection. However, these materials are porous and allow moisture to diffuse through the package. Fick's laws applied to water diffusion have a solution which can either be solved numerically, or approximated accurately with the singl... View full abstract»

• ### Finite Element Modeling of System Design and Testing Conditions for Component Solder Ball Reliability Under Impact

Publication Year: 2012, Page(s):1802 - 1810
Cited by:  Papers (3)
| | PDF (1487 KB) | HTML

In this paper, the effects of system design and testing conditions on the dynamic behavior of solder balls of components are studied through finite element analysis. The current JEDEC drop test board (JESD22-B111) is used as a baseline model. The model is then extended to several new configurations, which consider the effects of major component placement, secondary component attachment, and drop o... View full abstract»

• ### Comparison of Deionized Water and FC-72 in Pool and Jet Impingement Boiling Thermal Management

Publication Year: 2012, Page(s):1811 - 1823
Cited by:  Papers (1)
| | PDF (1759 KB) | HTML

High heat fluxes and stringent constraints on surface temperature and its uniformity during thermal management of electrical and electronic components often necessitate use of boiling heat transfer. This paper compares the pool and jet impingement boiling heat transfer characteristics of deionized water and FC-72 at an equivalent fluid saturation temperature of 57°C and for identical experi... View full abstract»

• ### Effects of Multiple Reworks on the Accelerated Thermal Cycling and Shock Performance of Lead-Free BGA Assemblies

Publication Year: 2012, Page(s):1824 - 1831
| | PDF (3611 KB) | HTML

In this paper, the effect of multiple rework cycles (up to 5×) on reliability of lead-free assemblies is investigated. The test vehicle is designed to capture the reliability impact of rework processes on interconnects of ball grid array (BGA) devices, the solder joints of its adjacent components, and BGA devices of clamshelled devices. The effects on high aspect ratio plated through hole (... View full abstract»

• ### Comparison of the Thermal Performance of the Multichip LED Packages

Publication Year: 2012, Page(s):1832 - 1837
Cited by:  Papers (11)
| | PDF (783 KB) | HTML

Single chip, 4-chip, and 16-chip light emitting diode (LED) packages were prepared to compare the thermal performance of the LED packages. Vertical type, GaN blue LED chips with alumina submount were used, and thermal transient analysis was conducted to investigate the thermal characteristics of the LED packages. Temperature sensitive parameter value was measured and the junction temperature was p... View full abstract»

• ### Analysis on Thermal Management Schemes of LED Backlight Units for Liquid Crystal Displays

Publication Year: 2012, Page(s):1838 - 1846
Cited by:  Papers (8)
| | PDF (691 KB) | HTML

Light-emitting diodes (LEDs), have emerged as a new light source for backlight units in novel liquid crystal displays due to their advantages in optical performance and their environmentally friendly features. The characteristics of LEDs, however, are inherently accompanied by high heat dissipation, and performance of an LED device strongly depends on the operating temperature. Therefore, proper t... View full abstract»

• ### Modeling Relative Humidity and Temperature Effects on Scattering Parameters in Transmission Lines

Publication Year: 2012, Page(s):1847 - 1858
| | PDF (1613 KB) | HTML

This paper is focused on the development of a simulation method to evaluate relative humidity (RH) and temperature effects of scattering parameters on transmission systems from DC to 26 GHz. The first step in the analysis is to design a number of experiments to quantify the environmental impacts on S-parameters. Then, a method is proposed to model the RH and temperature effects on microstrip trans... View full abstract»

• ### Model Pulses for Performance Prediction of Digital Microelectronic Systems

Publication Year: 2012, Page(s):1859 - 1870
Cited by:  Papers (13)
| | PDF (940 KB) | HTML

Pulse-shape models are presented that furnish the tools for analyzing a number of aspects of the performance of microelectronic circuits. Model pulse shapes are provided and their properties are analyzed in detail. Applications that are covered include the replication of measured pulses that are of relevance for inter- and intra-chip interconnects and, concurrently, examples of passive circuits th... View full abstract»

• ### Fast Full-Wave Solution That Eliminates the Low-Frequency Breakdown Problem in a Reduced System of Order One

Publication Year: 2012, Page(s):1871 - 1881
Cited by:  Papers (7)
| | PDF (543 KB) | HTML

Full-wave solutions of Maxwell's equations break down at low frequencies. Existing methods for solving this problem either are inaccurate or incur additional computational cost. In this paper, a fast full-wave finite-element-based solution is developed to eliminate the low-frequency breakdown problem in a reduced system of order one. It is applicable to general 3-D problems involving ideal conduct... View full abstract»

• ### Narrow-Band Microwave Filter Using High-Q Groove Gap Waveguide Resonators With Manufacturing Flexibility and No Sidewalls

Publication Year: 2012, Page(s):1882 - 1889
Cited by:  Papers (48)  |  Patents (3)
| | PDF (1095 KB) | HTML

This paper presents a new type of narrow band filter with good electrical performance and manufacturing flexibility, based on the newly introduced groove gap waveguide technology. The designed third and fifth-order filters work at Ku band with 1% fractional bandwidth. These filter structures are manufactured with an allowable gap between two metal blocks, in such a way that there is no requirement... View full abstract»

• ### Automated Void Detection in Solder Balls in the Presence of Vias and Other Artifacts

Publication Year: 2012, Page(s):1890 - 1901
Cited by:  Papers (3)
| | PDF (1396 KB) | HTML

Voids are one of the major defects in solder balls and their detection and assessment can help in reducing unit and board yield issues caused by excessive or very large voids. Voids are difficult to detect using manual inspection alone. 2-D X-ray machines are often used to make voids visible to an operator for manual inspection. Automated methods do not give good accuracy in void detection and mea... View full abstract»

• ### Anomaly Detection and Classification for PHM of Electronics Subjected to Shock and Vibration

Publication Year: 2012, Page(s):1902 - 1918
Cited by:  Papers (7)
| | PDF (3103 KB) | HTML

Failures in electronics subjected to shock and vibration are typically diagnosed using the built-in self test (BIST) or using continuity monitoring of daisy-chained packages. The BIST, which is extensively used for diagnostics or identification of failure, is focused on reactive failure detection and provides limited insight into reliability and residual life. In this paper, a new technique has be... View full abstract»

• ### Intelligent Parametric Design for a Robust LED Encapsulation Process

Publication Year: 2012, Page(s):1919 - 1927
Cited by:  Papers (1)
| | PDF (642 KB) | HTML

Light-emitting diodes (LEDs) have been adopted in a wide variety of lighting situations. As lighting technology evolves, illumination devices are moving toward miniaturization and high-power applications. Packaging of illumination devices is essential to providing a path for heat dispersion. A full understanding of the viscosity change of the encapsulation material is critical to ensure manufactur... View full abstract»

• ### Crystallographic Characterization of an Electroplated Zinc Coating Prone to Whiskers

Publication Year: 2012, Page(s):1928 - 1932
Cited by:  Papers (3)
| | PDF (1429 KB) | HTML

A Zn-electroplated steel prone to Zn whiskers has been investigated in order to obtain information about the microstructure of the Zn coating at the root of a whisker. Indeed, the characterization of the Zn coating is essential to understand the Zn whisker growth mechanism. Care was taken to prepare a sample at a whisker root by using a focused-ion beam in a dual-beam scanning electron microscope.... View full abstract»

• ### Blank page

Publication Year: 2012, Page(s):1933 - 1934
| PDF (6 KB)
• ### IEEE Components, Packaging, and Manufacturing Technology Society information for authors

Publication Year: 2012, Page(s): C3
| PDF (75 KB)

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel