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IEEE Transactions on Components, Packaging and Manufacturing Technology

Volume 1 Issue 3 • March 2011

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Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Meet Our Editors

Managing Editor
Ravi Mahajan
Intel