# IEEE Transactions on Components, Packaging and Manufacturing Technology

### Early Access Articles

Early Access articles are made available in advance of the final electronic or print versions. Early Access articles are peer reviewed but may not be fully edited. They are fully citable from the moment they appear in IEEE Xplore.

## Filter Results

Displaying Results 1 - 25 of 61
• ### ATAR: An Adaptive Thermal-Aware Routing Algorithm for 3-D Network-on-Chip Systems

Publication Year: 2018, Page(s):1 - 8
| | PDF (1909 KB)

3-D network-on-chip (NoC) is gaining popularity among designers due to scalability, higher bandwidth, fault tolerance, and reliability. However, the stacking of multiple dies leads to severe thermal problems due to increase in power density. Unequal traffic distribution across the chip and higher power density results in higher on-chip temperature resulting in performance degradation, increase in ... View full abstract»

• ### Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front Ends for Phased Arrays up to 60 GHz

Publication Year: 2018, Page(s):1 - 13
| | PDF (4349 KB)

High-gain steerable antenna arrays in the K-, Ka-, and V-frequency bands have the potential to facilitate high-bandwidth satellite communication for a variety of applications. Copper-core printed circuit boards (PCBs) can offer a cost-effective integration platform for such systems by simultaneously addressing both the high frequency and thermal challenges. Integrating GaAs dies into test vehicles... View full abstract»

• ### Design and Implementation of a Compact 3-D Stacked RF Front-End Module for Micro Base Station

Publication Year: 2018, Page(s):1 - 12
| | PDF (6948 KB)

In the current 4G Long Term Evolution and the incoming 5G mobile communication technology, as the number of radio frequency (RF) devices in the RF front-end module is increasing fast, miniaturization is essential and significant. The 3-D RF system-in-package (SiP) technology is an excellent miniaturization solution. In this paper, a 700-2900-MHz 3-D stacked RF module with the size of 23 mm x 23 mm... View full abstract»

• ### Optimal Design of Jetting Configuration for Robust Performance

Publication Year: 2018, Page(s):1 - 7
| | PDF (1728 KB)

The jetting technology has become popular in microelectronic packaging owing to its high efficiency and the noncontact property. However, high-speed jetting will generate strong oscillation that will affect the jetting consistency. To improve the jetting consistency, the optimal jetting configuration will be designed in this paper. First, the optimal jetting structure is proposed. Then, jetting pe... View full abstract»

• ### Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

Publication Year: 2018, Page(s):1 - 12
| | PDF (3650 KB)

In this paper, we first propose and demonstrate a novel on-interposer active power distribution network (PDN) scheme to efficiently suppress simultaneous switching noise (SSN) in a 2.5-D/3-D integrated circuit (IC). The on-interposer active PDN can change the PDN impedance by controlling on-interposer decoupling capacitors. The SSN in a 2.5-D/3-D IC is suppressed by optimal control of the on-inter... View full abstract»

• ### Analysis of Electrical Life Distribution Characteristics of AC Contactor Based on Performance Degradation

Publication Year: 2018, Page(s):1 - 10
| | PDF (2738 KB)

Electrical life is an important performance indicator of ac contactor, and it is influenced by various factors, among which the most important one is arc erosion caused by arc current. This paper proposes a general contact erosion model based on arcing phase angle to simulate the electrical life distribution characteristics of ac contactor under random breaking operations. For the same type of ac ... View full abstract»

• ### Post-CMOS Fabrication Technology Enabling Simultaneous Fabrication of 3-D Solenoidal Micro-Inductors and Flexible I/Os

Publication Year: 2018, Page(s):1 - 6
| | PDF (3268 KB)

In this paper, co-fabrication and characterization of micro-inductors with mechanically flexible interconnects (MFIs) as I/Os is presented. A double-lithography and double-reflow process is used to obtain different heights of reflowed photoresist domes for the micro-inductors and the MFIs. The developed process allows fabrication of MFIs with different heights, pitches, and materials. The fine-pit... View full abstract»

• ### Fabrication and RF Property Evaluation of High-Resistivity Si Interposer for 2.5-D/3-D Heterogeneous Integration of RF Devices

Publication Year: 2018, Page(s):1 - 9
| | PDF (4175 KB)

In this paper, a high-resistivity silicon (HR-Si) interposer integrated with through-silicon via (TSV) electrically grounded coplanar waveguide (CPW) line is presented for 2.5-D/3-D heterogeneous integration of radio frequency (RF) microelectronics devices. In addition, design of TSV interconnection composed of two coaxial ladder-hollow-annular Cu (copper) TSVs of different diameters is utilized t... View full abstract»

• ### A Low-Cost and High-Gain 60-GHz Differential Phased Array Antenna in PCB Process

Publication Year: 2018, Page(s):1 - 11
| | PDF (7105 KB)

A broadband, low-cost, high-gain, multilayer differential antenna without air cavity is proposed for the 60-GHz phased array system. By using the standard low-cost printed circuit board process, a 60-GHz phased array antenna element and a 16-element phased array antenna prototype are implemented. To improve the bandwidth and antenna gain, a superstrate and a float rectangular ring are designed. Th... View full abstract»

• ### Wideband and Compact Impedance-Transforming 90° DC Blocks With Symmetric Coupled Transmission-Line Sections

Publication Year: 2018, Page(s):1 - 8
| | PDF (1940 KB)

Wideband and compact 90° dc blocks are presented for the impedance-transforming function and designed based on the transmission-zero movement method combined with the pole (root) split method, which is the reason for the wide bandwidth responses, even with being very compact. For a proof-of-concept demonstration, one prototype is tested, and the measured bandwidth with the 10-dB return loss... View full abstract»

• ### Stencil Printing Process Optimization to Control Solder Paste Volume Transfer Efficiency

Publication Year: 2018, Page(s):1 - 9
| | PDF (1789 KB)

This research aims to optimize the stencil printing parameters to control the solder paste volume TE and increase the first-pass-yields of printed circuit boards (PCBs). Stencil printing process (SPP) factors considered in this research are related to solder paste composition, product configuration, printer setup, and stencil design. Support vector regression (SVR) with different kernels and regre... View full abstract»

• ### Solid and Vapor Chamber Integrated Heat Spreaders: Which to Choose and Why

Publication Year: 2018, Page(s):1 - 12
| | PDF (2899 KB)

The performance and reliability of semiconductor electronics require that thermal management hardware be used to adequately cool devices, components, and packages. A vital component of many devices, including but not limited to PAs, CPUs, GPUs, and LEDs, is the integrated heat spreader (IHS). IHSs are implemented to spread the heat from the small electronic component to a larger area in order to f... View full abstract»

• ### Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

Publication Year: 2018, Page(s):1 - 8
| | PDF (4208 KB)

A low-temperature wafer-level hybrid bonding process using micro Cu pillar solder bumps and photopatternable dry film adhesive is developed and investigated, where the microbumps and dry film adhesive are simultaneously bonded at a low temperature of 240 °C. The proposed hybrid bonding method has been applied to an 8-in wafer-to-wafer bonding. The effects of two kinds of bonding profiles, i... View full abstract»

• ### Investigation and Optimization of Ultrathin Buffer Layers Used in Cu/Sn Eutectic Bonding

Publication Year: 2018, Page(s):1 - 6
| | PDF (2442 KB)

Ultrathin buffer layers (UBLs) with varied thickness ranging from 10 to 100 nm and different materials were used in Cu/Sn eutectic bonding. A Cu/Sn film thinner than 2 μm could fully react and became stiff and rough Cu-Sn intermetallic compound layer, which leads to failure bonding. Four kinds of semiconductor compatible materials including Ti, Pd, Co, and Ni were inserted between Cu/Sn to ... View full abstract»

• ### Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module

Publication Year: 2018, Page(s):1 - 7
| | PDF (4147 KB)

In this paper, fatigue life of solder joints of the power module and the printed circuit board in a power inverter under directional random vibration using the finite element method (FEM) was evaluated. Five angles of 0°, 30°, 45°, 60°, and 90° were selected for direction of vibration loading. The simulation results showed that the outermost corner of the solder ... View full abstract»

• ### Low-Cost Microfabrication for MEMS Switches and Varactors

Publication Year: 2018, Page(s):1 - 9
| | PDF (3500 KB)

This paper presents a low-cost microfabrication technique for manufacturing radio frequency microelectromechanical system (RF MEMS) switches and varactors without intensive clean-room environments. The fabrication process entails only laser microstructuring technique, non-clean-room microlithography, and standard wet-bench and hot-film emboss of SU-8 and ADEX polymers. MEMS movable structures were... View full abstract»

• ### Wear Mechanism and Mass Loss Characteristic of Arcing Contacts in SF₆ Circuit Breaker in Making Process

Publication Year: 2018, Page(s):1 - 11
| | PDF (3396 KB)

Large-capacity capacitor banks have been used to control the reactive power of ultra high voltage ac grid in China. The high switching inrush current of SF₆ circuit breakers used for large-capacity capacitor banks has caused great mechanical wear after arc ablation, which leads to the serious erosion of the arcing contacts of the circuit breakers, thus shortening the electrical life. To imp... View full abstract»

• ### High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test

Publication Year: 2018, Page(s):1 - 11
| | PDF (6027 KB)

This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket for high-bandwidth and high-density package test using a fabricated sample. In addition, this paper also characterizes and verifies the coaxial silicone rubber socket. Because of the proposed coaxial socket's novel coaxial structure, the proposed socket successfully achieves the electrical performance improv... View full abstract»

• ### Near-Field Radiation Estimation and Its Reduction Using a Novel EBG for PCB

Publication Year: 2018, Page(s):1 - 7
| | PDF (1705 KB)

To investigate and quantify the radiation emission of an electronic package model, the partial element equivalent circuit method combined with the field equivalence principle is developed in this paper and used for the near-field radiation prediction. Furthermore, this paper presents a novel electromagnetic bandgap (EBG) design to suppress the electromagnetic radiation. The simulation results obta... View full abstract»

• ### Effects of a Reduced Torque on Heating of Electrical Contacts in Plugs and Receptacles

Publication Year: 2018, Page(s):1 - 9
| | PDF (1750 KB)

Thermal effects of poor electrical contacts caused by a reduced torque on the wire screw terminal connections in plugs and receptacles were experimentally investigated. By changing the torque, poor connections caused by environmental vibrations or negligence by the installer were simulated. Various types and cross-sectional areas of the copper wires, as well as loads and their duration, were teste... View full abstract»

• ### Research on the Rolling and Sliding Behavior of Making Contact and Associated Welding Mechanism for Low-Current Switching Devices

Publication Year: 2018, Page(s):1 - 10
| | PDF (4258 KB)

The electrical lifetime of electromechanical device is affected by the contact mechanical rolling and sliding behavior greatly. The sliding distance and broadside lines of contact pair are captured in situ and analyzed by introducing charge-coupled device camera with a high pixel resolution. The variations in sliding distance and electrical performance parameters with operation cycles at each cons... View full abstract»

• ### A Module-Level Spring-Interconnected Stack Power Module

Publication Year: 2018, Page(s):1 - 8
| | PDF (1862 KB)

This paper presents the design, fabrication, and characterization of a module-level spring-interconnected stack power module for power semiconductor devices. The benefit of multilayer design capability offered by a low-temperature cofired ceramic (LTCC) substrate is used for this module-level power module structure. A half-bridge configuration is demonstrated using two standalone wire-bondless pow... View full abstract»

• ### Optoelectronic System for Mycotoxin Detection in Food Quality Control

Publication Year: 2018, Page(s):1 - 8
| | PDF (2142 KB)

Here, we report on the design, fabrication, and characterization of a prototype of a portable detection system, able to determine if the contamination level of Ochratoxin A (OTA) is below or above the limit imposed by the EU Commission for a specific food. The operating principle of the system is the real-time monitoring of a chromatographic run when an extract of the sample under analysis is spot... View full abstract»

• ### A Low-Loss Fully Board-Integrated Low-Pass Filter Using Suspended Integrated Strip-Line Technology

Publication Year: 2018, Page(s):1 - 8
| | PDF (3041 KB)

This paper presents a low-loss fully board-integrated low-pass filter (LPF) using suspended integrated strip-line (SISL) technology. A multilayer board stack-up, with internally buried hollow cavities, is used to create the suspended strip-line. By transitioning from the top copper ground-backed coplanar waveguide trace to an internal strip-line and vice versa, a more traditional industry-standard... View full abstract»

• ### Reduction of Structural Thermal Resistance for Deep Ultraviolet Light-Emitting Diodes Fabricated on AlN Ceramic Substrate via Copper- Filled Thermal Holes

Publication Year: 2018, Page(s):1 - 6
| | PDF (2208 KB)

In this paper, a structure was proposed to promote thermal management of deep ultraviolet light-emitting diodes (DUV-LEDs) by introducing the aluminum nitride (AlN) ceramic substrate fabricated with copper-filled thermal holes (CFTHs). Different numbers of CFTHs ($0,2x 2, 3x3$, and $4x4$) were formed in AlN ceramic substrates using direct-plated-copper process. The thermal resistance of DUV-LEDs w... View full abstract»

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel