# IEEE Transactions on Advanced Packaging

## Filter Results

Displaying Results 1 - 25 of 32

Publication Year: 2008, Page(s):C1 - 441
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• ### IEEE Transactions on Advanced Packaging publication information

Publication Year: 2008, Page(s): C2
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• ### Power and Interface Features of Thermosonic Flip-Chip Bonding

Publication Year: 2008, Page(s):442 - 446
Cited by:  Papers (2)
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Driving voltage and current signals of piezoceramic transducer were measured directly by using digital storage oscilloscope, and interface microcharacteristics of the specimens of flip-chip bonding were inspected by using a transmission electron microscope. Results show such a trend that power curves of badly bonding were much lower than that of hard bonding, and indicated a monitoring system of u... View full abstract»

• ### Warpage Measurement of Board Assemblies Using Projection MoirÉ System With Improved Automatic Image Segmentation Algorithm

Publication Year: 2008, Page(s):447 - 453
Cited by:  Papers (1)
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Out-of-plane displacement (warpage) has been a major reliability concern for board-level electronic packaging. Printed wiring board (PWB) and component warpage results from coefficient of thermal expansion (CTE) mismatch among the materials that make up the printed wiring board assembly (PWBA). Warpage occurring during surface-mount reflow process and normal operations may lead to serious reliabil... View full abstract»

• ### Transient Stress Distributions in NCF-Bonded COG Packages due to Moisture Diffusion

Publication Year: 2008, Page(s):454 - 462
Cited by:  Papers (3)
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The nonconductive film (NCF) adhesives have potentials to replace the anisotropic conductive film (ACF) adhesive in the chip-on-glass (COG) or other packages in liquid crystal displays (LCDs) due to their feasible features of finer bump pitch and cost reduction. Prior to applying the NCF to the COG packages, reliability issues, such as interfacial delamination and increase of bump contact resistan... View full abstract»

• ### Modeling of Combined Temperature Cycling and Vibration Loading on PBGA Solder Joints Using an Incremental Damage Superposition Approach

Publication Year: 2008, Page(s):463 - 472
Cited by:  Papers (23)
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Concurrent vibration and temperature cycle environments are commonly encountered in the service life of many electronic products, particularly those used in automotive, avionic, and military applications. However, the ability to predict life expectancy under these types of environments remains a technical challenge. In this paper, a traditional linear damage superposition modeling approach and a d... View full abstract»

• ### Bumpless Interconnect of 6- $mu$m-Pitch Cu Electrodes at Room Temperature

Publication Year: 2008, Page(s):473 - 478
Cited by:  Papers (32)
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Bumpless interconnect of 6-mum-pitch Cu electrodes was realized at room temperature with the surface activated bonding (SAB) method. In this study, we propose a novel bumpless structure, where the electrodes and a surrounding Cu frame are fabricated with the same height to increase bond strength and demonstrate the feasibility of a sealing interconnection between Cu surfaces. The damascene process... View full abstract»

• ### End-Facet Polishing of Surface Plasmon Waveguides in Lithium Niobate

Publication Year: 2008, Page(s):479 - 483
Cited by:  Papers (4)
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This paper describes a custom polishing procedure developed to produce high quality end-facets on die having a rather unique cross section. The dies comprise two thin lithium niobate claddings on either side of a thin narrow gold stripe, supported by a silicon substrate. This heterogeneous structure operates as an optical waveguide supporting a long-range surface plasmon-polariton mode, and is fab... View full abstract»

• ### One-Component, Low-Temperature, and Fast Cure Epoxy Encapsulant With High Refractive Index for LED Applications

Publication Year: 2008, Page(s):484 - 489
Cited by:  Papers (38)  |  Patents (2)
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The cationic polymerization of diglycidyl ether of bisphenol-A (DGEBA) using a latent cationic thermal initiator, ammonium antimony hexafluoride, and the effect of addition of cycloaliphatic epoxy resin on the polymerization were studied with DSC, TGA, and hardness measurement. It was found that the cationically polymerized DGEBA at 0.5 phr initiator level gives the best compromise of chemical rea... View full abstract»

• ### A Packaging Solution for Optically Testing Wire-Bonded Chips

Publication Year: 2008, Page(s):490 - 495
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In this paper, we describe the design and the experimental characterization of a packaging technique for backside optical testing of chips requiring wirebonding. Optical testing methods, based either on the collection of spontaneous hot-carrier photoemission or on laser stimulation, require an optical access to the active area of the circuit through the backside of the chip, while still providing ... View full abstract»

• ### Physical Mechanism of Interfacial Thermal Resistance in Electronic Packaging Based on a Mixed MD/FE Model

Publication Year: 2008, Page(s):496 - 501
Cited by:  Papers (14)
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A multiscale model is constructed to study interfacial thermal resistance in electronic packaging. The model combines a molecular dynamics simulation for the critical regions within the system with a finite element (FE) method for a continuum description of the remainder of the system. For nonequilibrium simulations, the establishment of the proper boundary condition is very difficult. In this mix... View full abstract»

• ### Low-Cost, Precision, Self-Alignment Technique for Coupling Laser and Photodiode Arrays to Polymer Waveguide Arrays on Multilayer PCBs

Publication Year: 2008, Page(s):502 - 511
Cited by:  Papers (31)  |  Patents (5)
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The first, to our knowledge, passive, precision, self-alignment technique for direct coupling of vertical cavity surface emitting laser (VCSEL) and photodiode (PD) arrays to an array of polymer buried channel waveguides on a rigid printed circuit board (PCB) is reported. It gives insertion losses as good as the best achieved previously, to within experimental measurement accuracy, but without the ... View full abstract»

• ### Drainage-Induced Dry-Out of Thermal Greases

Publication Year: 2008, Page(s):512 - 518
Cited by:  Papers (5)
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In this study, the mechanism of grease dry-out, a long-term failure mode of thermal greases, is investigated using optical microscopy and infrared (IR) thermography. Results show that the dry-out phenomenon is accelerated in aged greases and we suggest that this is due to inhomogeneities in the filler packing structure that develop over time due to segregation of the grease components, though they... View full abstract»

• ### Packaging and Assembly of 3-D Silicon Stacked Module for Image Sensor Application

Publication Year: 2008, Page(s):519 - 526
Cited by:  Papers (8)  |  Patents (1)
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This paper is for process development of assembly technologies used to fabricate the 3-D silicon carrier system-in-package (SiP). The five assembly technologies are wafer thinning, thin flip chip attach on silicon carrier, ultra low loop wire bonding, glass cap fabrication and sealing, and silicon carrier stacking. The developed SiP has three silicon carriers with four flip chip and one wire bond ... View full abstract»

• ### RF Low-Pass Design Guiding Rules to Improve PCB to Die Transition Applied to Different Types of Low-Cost Packages

Publication Year: 2008, Page(s):527 - 535
Cited by:  Papers (8)
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We present in this paper some design rules to improve the signal integrity (SI) of a package transition. The design rules are based on standard low-pass (LP) filter synthesis methodology. This methodology uses the modeling of the package transition by a pi network and is valid as long as the through phase shift of the package transition remains sufficiently small. Based on this pi network approxim... View full abstract»

• ### Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Publication Year: 2008, Page(s):536 - 543
Cited by:  Papers (19)
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A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal... View full abstract»

• ### Modeling and Measurement of Interlevel Electromagnetic Coupling and Fringing Effect in a Hierarchical Power Distribution Network Using Segmentation Method With Resonant Cavity Model

Publication Year: 2008, Page(s):544 - 557
Cited by:  Papers (29)
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A hierarchical power distribution network (PDN) consists of chip, package, and printed circuit board (PCB) level PDNs, as well as various structures such as via, ball, and wire bond interconnections, which connect the different level PDNs. When estimating the simultaneous switching noise (SSN) generation and evaluating PDN designs, PDN impedance calculation is an efficient criterion. In this paper... View full abstract»

• ### Implementation of Packaged Integrated Antenna With Embedded Front End for Bluetooth Applications

Publication Year: 2008, Page(s):558 - 567
Cited by:  Papers (11)
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The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today's printed circuit board manufacturing capability. A commercially available bluetooth integrated chip was chos... View full abstract»

• ### Perturbation Schemes for Passivity Enforcement of Delay-Based Transmission Line Macromodels

Publication Year: 2008, Page(s):568 - 578
Cited by:  Papers (17)
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This paper introduces two different algorithms for passivity enforcement of transmission-line macromodels based on the generalized method of characteristics (MoC). The first scheme corrects passivity violations via perturbation of purely imaginary solutions of a nonlinear Hamiltonian eigenvalue problem. The second scheme is based on a linearly constrained quadratic optimization formulated at caref... View full abstract»

• ### Robust Causality Characterization via Generalized Dispersion Relations

Publication Year: 2008, Page(s):579 - 593
Cited by:  Papers (19)  |  Patents (1)
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The self-consistency of frequency responses obtained via numerical simulations or measurements is of paramount importance in the analysis and design of linear systems. In particular, tabulated responses with flaws and causality violations have been demonstrated to be the root cause for numerical problems and unreliability in modeling and simulation tasks. In this work, we present the generalized d... View full abstract»

• ### Modeling Package-Induced Effects on Molded Hall Sensors

Publication Year: 2008, Page(s):594 - 603
Cited by:  Papers (13)
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The consideration of package-induced effects during the design process of microelectromechanical systems (MEMS) sensors is still of major importance in order to estimate its influence on performance and reliability. A method for predicting the influence of the packaging and assembly process on the performance of a Hall sensor is described. The geometry of the device, the behavior of the packaging ... View full abstract»

• ### Effective Pigtailing Method for Fiber Arrays to InP-Based Photonic Integrated Circuits

Publication Year: 2008, Page(s):604 - 611
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A reliable technology for interfacing signals in both the optical and electrical domain that provides the possibility of precise control of the thermal optical chip properties is an essential requirement to utilize photonic integrated circuits in system-related areas. Hence, a practical assembly method is developed here to connect fiber arrays to a wide range of different kinds of advanced indium ... View full abstract»

• ### A Recovery Algorithm of Linear Complexity in the Time-Domain Layered Finite Element Reduction Recovery (LAFE-RR) Method for Large-Scale Electromagnetic Analysis of High-Speed ICs

Publication Year: 2008, Page(s):612 - 618
Cited by:  Papers (3)
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Time-domain layered finite element reduction recovery (LAFE-RR) method was recently developed for large-scale electromagnetic analysis of high-speed integrated circuits (ICs). This method is capable of analytically and rigorously reducing the system matrix of a 3-D multilayer circuit to that of a single-layer one regardless of the original problem size. In addition, the reduced system matrix prese... View full abstract»

• ### Reflection Enhanced Compensation of Lossy Traces for Best Eye-Diagram Improvement Using High-Impedance Mismatch

Publication Year: 2008, Page(s):619 - 626
Cited by:  Papers (17)  |  Patents (1)
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As the signal rates increase toward the multigigabit range, the lossy effect of typical transmission lines on the signal quality of printed circuit boards has become a more and more significant issue. This paper introduces the concept of reflection gain resulted from the high-impedance mismatch to improve the eye diagram at the receiving end by inserting the inductance or high-impedance line betwe... View full abstract»

• ### Proper Orthogonal Decomposition in the Generation of Reduced Order Models for Interconnects

Publication Year: 2008, Page(s):627 - 636
Cited by:  Papers (10)
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In this paper, reduced order models are generated using the technique of proper orthogonal decomposition (POD), also known as Karhunen-Loeve decomposition (KLD) for the simulations of interconnect problems. Model order reduction is achieved by projecting the state-space of the original problems onto a subspace spanned by a few number of proper orthogonal modes (POMs) extracted by the POD procedure... View full abstract»

## Aims & Scope

IEEE Transactions on Advanced Packaging has its focus on the design, modeling, and application of interconnection systems and packaging: device packages, wafer-scale and multichip modules, TAB/BGA/SMT, electrical and thermal analysis, opto-electronic packaging, and package reliability.

This Transactions ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

## Meet Our Editors

Editor-in-Chief
Ganesh Subbarayan
Purdue University, School of Mechanical Engineering