Scheduled System Maintenance
On Tuesday, May 22, IEEE Xplore will undergo scheduled maintenance. Single article sales and account management will be unavailable
from 6:00am–5:00pm ET. There may be intermittent impact on performance from noon–6:00pm ET.
We apologize for the inconvenience.

IEEE Transactions on Parts, Materials and Packaging

Volume 1 Issue 1 • June 1965

Filter Results

Displaying Results 1 - 25 of 50
  • Electrolytic Corrosion of Metallic Resistors

    Publication Year: 1965, Page(s):143 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (494 KB)

    Metallic resistors are encapsulated mainly for two reasons. Firstly to avoid mechanical damage, secondly to provide protection against moisture. If moisture penetration is not prevented and if at the same time ions are present capable of moving through or along the insulating materials, a resistance change will occur with time, whenever the resistor is subjected to a high relative humidity and a d... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (754 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A Graphical Sequential Weibull Life Test Procedure

    Publication Year: 1965, Page(s):343 - 351
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (714 KB)

    This paper presents a series of graphed sequential tests to be used for testing the joint hypothesis that (the Weibull shape factor)beta=beta0and that (the Weibull scale factor)theta=theta0. These o plans, obtained by simulating life tests on an IBM 7090 computing system, are specified for two sample sizes, five confidence levels, a... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Put Engineering Efforts Back in Reliability Techniques

    Publication Year: 1965, Page(s):297 - 302
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    Conventional statistical reliability techniques are a necessary condition of reliability. They are, however, insufficient and inadequate. Other reliability techniques are needed to turn a feasibly designed system into a completely successful one. The implementation of these techniques is lagging. They have not as yet been unified on an industry-wide basis. They must be implemented and unified, how... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Use of Devitrification for Improved Structure in Ceramics

    Publication Year: 1965, Page(s):28 - 30
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The devitrification process, which entails fritting the complete composition, preparing specimens of the powdered glass, and firing, has resulted in markedly improved structure in ceramics. This is the result of mixing of the composition on an atomic basis, retaining a randomly oriented structure in the fritted raw material, forming the basic crystalline phase by devitrification during a subsequen... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Universal Component Packaging System

    Publication Year: 1965, Page(s):230 - 236
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Impact of Microminiaturization on Printed Circuit Boards

    Publication Year: 1965, Page(s):352 - 358
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    First Page of the Article
    View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A New Dried Anodized Aluminum Capacitor

    Publication Year: 1965, Page(s):224 - 229
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    The capacitance, dissipation factor, resistivity, and dielectric strength of dried anodized aluminum films are discussed. A miniature non polar self healing capacitor using metalized anodic films is described. Construction techniques, performance, and ratings are presented. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Gard - A New Era of Component Testing

    Publication Year: 1965, Page(s):320 - 326
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    This paper describes the GARD test theory and associated test instrument which is proposed as a means of economically replacing present burnin screening tests for resistive components. The total test requires approximately 5 seconds and offers a new and improved concept of temperature coefficient of resistance measurement in addition to the high reliability screening capability. This test is appli... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Improving the Confidence Level of Microwave Attenuation Measurements

    Publication Year: 1965, Page(s):332 - 342
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    Stringent contractual specifications covering complex radar, communications, and space probe systems frequently call for accuracies beyond those derived from existing standards. In many cases, the true value of a standard is not exactly known: in addition, uncertainties are incurred during a measurement process. These, along with the hierarchy of calibrations from higher-to lower-echelon testing l... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Observations on Fromation of "Cleavage" at Interface Between Glaze Resistor and Termination

    Publication Year: 1965, Page(s):387 - 392
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    A low-power bench microscope was modified to facilitate direct observation of fusion of paints to make glaze resistors during heating cycles which simulate production and experimental firing cycles. Using this tool, the formation of "cleavage" (clear line of separation between noble-metal glaze resistor and screened-on termination) was studied. The mode of formation of "cleavage" and possible sour... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Gaseous Anodization of Aluminum

    Publication Year: 1965, Page(s):217 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    Gaseous anodization of aluminum has been investigated as an alternative procedure to forming thin oxide films by such standard techniques as electrolytic anodization and air oxidation. Oxide films are formed on an aluminum surface when positioned in the plateau region of a glow discharge of oxygen. Process variables such as the oxygen pressure and the applied voltage are found to affect the time f... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Factors Influencing the Current Rating of R-F Capacitors

    Publication Year: 1965, Page(s):205 - 209
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    R. F. tests were run on a large number of capacitors to determine practical ratings, define operating characteristics and optimize design. Frequency and thermal effects were encountered and analyzed mathematically. A system for reporting rating characteristics was developed, a derating curve was derived and factors influencing operation were defined. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Thermal Processing of Tantalum Nitride Resistors

    Publication Year: 1965, Page(s):123 - 128
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    A study of the thermal oxidation of tantalum nitride (Ta-N) thin films has led to the development of a thermal processing technique by which these metal films can be made to exhibit superior resistor characteristics. The thermal process simply involves heating the Ta-N film resistors in air at some temperature between 450° and 700°C. Radiant heating has been found to be most convenient f... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Thin-Film Hybrids - A Practical Approach to Integrated Circuitry

    Publication Year: 1965, Page(s):63 - 69
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    Thin-film hybrid circuits are described, and it is shown how, and why they are especially applicable, both practically and economically, in applications where space, weight, power, and operating speed are important considerations. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Tolerance Study of Printed-Circuit Process Steps for a Microwave Application

    Publication Year: 1965, Page(s):16 - 27
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    This study provides tolerance-distribution data for a microwave printed-circuit development utilizing "strip-line" type filters, 50-ohm transmission lines, and tuning stubs. Irradiated polyethylene is the dielectric. Data is given on tolerance distribution in the following process areas: Artwork cutting; Photographic (reduction, exposure and development, contact printing with glass and film, step-... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Environmental and Life Testing of High Reliability Magnetic Components

    Publication Year: 1965, Page(s):109 - 114
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    Over 2.5 million hours of life test have been accumulated in the process of manufacturing High Reliability Magnetic Components for Missile and Space Programs. These units were manufactured under a High Reliability Program and were subjected to qualification and acceptance tests as required by the customer's specifications. The compiled life hours is composed of twenty-five electrical specification... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Reliability Cost Effectiveness Through Parts Control and Standardization

    Publication Year: 1965, Page(s):327 - 331
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    Early in the F-lll design effort, an F-lll Parts Control and Standardization Program was developed and implemented through a team of electronic parts specialists from General Dynamics and 12 of the major electronic equipment contractors. Basic objectives of the team were (1) the standardization of common electronic parts by joint evaluation, selection, and use of preferred part types, (2) the prep... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A Discrete Tantalum Nitride Thin Film Resistor on a Flat Embossed Ceramic Substrate

    Publication Year: 1965, Page(s):129 - 135
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    A newly developed tantalum nitride thin film resistor is being evaluated that uses an unglazed flat ceramic substrate with a pattern for the resistive element embossed into its surface. The resistive element is the sputtered tantalum nitride film with its inherent low temperature coefficient of resistance and high stability over long term load life. The design is such that it eliminates the use of... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Reliability Improvement in Pulse Transformers

    Publication Year: 1965, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    As part of the NASA Orbiting Geophysical Observatory (OGO) program, an investigation was made of failure mechanisms in miniature pulse transformers, a type commonly used for drive pulse coupling in low-power digital circuitry. The resulting corrective action methods are useful for reliability improvement in other similar magnetic devices and components. Failures were traced to breaks in small diam... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design of Solid-State Radar Transmitter Units for the Lunar Excursion Module

    Publication Year: 1965, Page(s):257 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    The design of all-solid-state radar transmitters for satisfactory performance in trans-lunar space or on the lunar surface poses many problems, the solution of which provides beneficial fallout for other applications. This paper discusses the design considerations which were combined to produce a highly reliable end sophisticated package adapted to accomplish, for a lunar excursion mission profile... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Adhesion of Platinum-Gold Glaze Conductors

    Publication Year: 1965, Page(s):381 - 386
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    The present work studies the time-temperature relationships of adhesion for typical platinum-gold glaze conductors. An empirical equation is derived from which it is possible to calculate the optimum time and temperature of firing. It is shown that the effects of two firings must be taken into account in choosing primary firing conditions. Adhesion was studied as a function of time at elevated tem... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A High-Accuracy Thin Film PCM Decoder Network Operating at 12 Mc

    Publication Year: 1965, Page(s):45 - 53
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (984 KB)

    A precision tantalum nitride thin film integrated resistor network has been constructed to convert 9-bit parallel binary words to equivalent analog voltages at a rate of 12 megacycles per second. There are 35 precision resistors and 9 matched diode bridges that make up the decoder network. This paper concerns fabrication and performance of the resistor portion of the network. The network was fabri... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A Thin Film Lubricant for Connector Contacts

    Publication Year: 1965, Page(s):1 - 9
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1112 KB)

    A thin film lubricant has been developed for gold plated contacts. This film is Octadecylamine-hydrochloride (ODA·HCL), and it exhibits excellent adherence to gold surfaces. The friction between solid gold surfaces and gold plated surfaces was reduced by a factor of approximately 4 to 1. The lubricating properties of this film have been adequately demonstrated under loads ranging from 20 to 3... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Electronic Packaging in the Phoenix Missile

    Publication Year: 1965, Page(s):237 - 247
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1576 KB)

    This paper contains a description of the concepts and techniques used in the electronic packaging of the Phoenix Missile Electronics Unit. The unit consists of etched circuit chassis pairs sandwiched between heat transfer panels. The sandwiches of heat transfer panels and chassis are compressed by end plates. Circuits such as logic networks, audio amplifiers and high gain DC amplifiers are package... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope