Volume 2 Issue 4 • Dec. 2012
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Table of contents
Publication Year: 2012, Page(s): C1|
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IEEE Journal on Emerging and Selected Topics in Circuits and Systems publication information
Publication Year: 2012, Page(s): C2|
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A Self-Contained System With CNTs-Based Biosensors for Cell Culture Monitoring
Publication Year: 2012, Page(s):658 - 671
Cited by: Papers (4)Biosensors have been applied to disparate fields, especially for endogenous compounds such as glucose and lactate. The main areas of application are certainly related to medical and diagnostic purposes. However, metabolic monitoring can be also of interest in cell analysis. Cells can be cultivated for several purposes, such as understanding and modeling some biological mechanisms, the development ... View full abstract»
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Heterogeneous Integration of Bio-Sensing System-on-Chip and Printed Electronics
Publication Year: 2012, Page(s):672 - 682
Cited by: Papers (23)In this paper, we present a heterogeneous integration platform for bio-sensing applications, which seamlessly integrates low-power silicon-based circuits with cost-effective printed electronics. A prototype of wearable Bio-Sensing Node is fabricated to investigate the suitability of this integration approach. A 1.5 ×3.0 mm2customized mixed-signal system-on-chip (SoC) with the size of is... View full abstract»
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An Optically Powered CMOS Receiver System for Intravascular Magnetic Resonance Applications
Publication Year: 2012, Page(s):683 - 691
Cited by: Papers (9)This paper presents a low-power optically powered receiver system designed in 0.18 μm triple well UMC complementary metal-oxide-semiconductor (CMOS) technology. Optical transmission is used for both power delivery and signal transmission. The power of the whole system can be supplied in two different configurations, namely continuous and intermittent mode configurations. In the continuous mode con... View full abstract»
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Power Distribution in TSV-Based 3-D Processor-Memory Stacks
Publication Year: 2012, Page(s):692 - 703
Cited by: Papers (14) | Patents (1)Three primary techniques for manufacturing through silicon vias (TSVs), via-first, via-middle, and via-last, have been analyzed and compared to distribute power in a 3-D processor-memory system with nine planes. Due to distinct fabrication techniques, these TSV technologies require significantly different design constraints, as investigated in this paper. A valid design space that satisfies the pe... View full abstract»
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Distributed On-Chip Power Delivery
Publication Year: 2012, Page(s):704 - 713
Cited by: Papers (28) | Patents (1)The performance of an integrated circuit depends strongly upon the power delivery system. With the introduction of ultra-small on-chip voltage regulators, novel design methodologies are needed to simultaneously determine the location of the on-chip power supplies and decoupling capacitors. In this paper, a unified design methodology is proposed to determine the optimal location of the power suppli... View full abstract»
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3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS
Publication Year: 2012, Page(s):714 - 722
Cited by: Papers (53) | Patents (48)3-D sequential integration stands out from other 3-D schemes as it enables the full use of the third dimension. Indeed, in this approach, 3-D contact density matches with the transistor scale. In this paper, we report on the main advances enabling the demonstration of functional and performant stacked CMOS-FETs; i.e., wafer bonding, low temperature processes (<;650°C) and salicide stabilization... View full abstract»
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CMOS-3D Smart Imager Architectures for Feature Detection
Publication Year: 2012, Page(s):723 - 736
Cited by: Papers (17) | Patents (9)This paper reports a multi-layered smart image sensor architecture for feature extraction based on detection of interest points. The architecture is conceived for 3-D integrated circuit technologies consisting of two layers (tiers) plus memory. The top tier includes sensing and processing circuitry aimed to perform Gaussian filtering and generate Gaussian pyramids in fully concurrent way. The circ... View full abstract»
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2012 Index IEEE Journal on Emerging and Selected Topics in Circuits and Systems Vol. 2
Publication Year: 2012, Page(s):737 - 747|
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IEEE Journal on Emerging and Selected Topics in Circuits and Systems information for authors
Publication Year: 2012, Page(s): 748|
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IEEE Circuits and Systems Society Information
Publication Year: 2012, Page(s): C3|
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[Blank page - back cover]
Publication Year: 2012, Page(s): C4|
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Aims & Scope
The IEEE Journal on Emerging and Selected Topics in Circuits and Systems publishes special issues covering the entire Field of Interest of the IEEE Circuits and Systems Society and with particular focus on emerging areas.
Meet Our Editors
Editor-in-Chief
Eduard Alarcon
UPC BarcelonaTech
Barcelona, Spain
eduard.alarcon@upc.edu