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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Issue 4 • Date December 1986

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Displaying Results 1 - 25 of 32
  • Foreword

    Publication Year: 1986 , Page(s): 327
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    Freely Available from IEEE
  • Rapidly Solidified Soft Solder Die-Attach Technology

    Publication Year: 1986 , Page(s): 416 - 422
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1368 KB)  

    Soft solders used in the die-attach of power packages are prone to fatigue failure. Conventionally east soft solders typically contain nonhomogeneous Phases and organics. Failure analysis usually shows extensive voids, cracks, and segregation of metals in the die-attach medium, which leads to increased thermal resistance and catastrophic failure during power cycling. Soft solders manufactured via ... View full abstract»

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  • Translucent A1N Ceramic Substrate

    Publication Year: 1986 , Page(s): 386 - 390
    Cited by:  Papers (13)  |  Patents (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1128 KB)  

    A translucent aluminum nitride (AlN) substrate has recently come into the market which has a thermal conductivity of 140 W/mK at room temperature and 130 W/mK at 100°C, eight times that of alumina (Al2O3) and one-half to two-thirds that of beryllia (BeO). Its excellent electrical and mechanical properties as well as inherent light transmitting property ensure that the ne... View full abstract»

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  • Die Attach Evaluation Using Test Chips Containing Localized Temperature Measurement Diodes

    Publication Year: 1986 , Page(s): 410 - 415
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (928 KB)  

    The die attach related problems of lifting and die cracking become more critical with increasing size of integrated circuit (IC) devices. For this reason, a thermal test utilizing specialized chips and an automated system has been designed for the evaluation of large die attach integrity. Both void detection and statistical characterization of sample populations are possible. While an actual estim... View full abstract»

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  • A Mechanism for Board Warpage by Thermal Expansion of Surface Mounted Connector

    Publication Year: 1986 , Page(s): 508 - 512
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (520 KB)  

    A mechanism of printed circuit (PC) board warpage caused by a thermal mismatch between a surface mounted connector and a PC board is demonstrated. Both the increase and the decrease in temperature enlarge the space between the PC board and the surface mounted (SM) connector. Basically four nondimensional parameters control this mechanism. They are the thermal strain mismatch, the ratio of bending ... View full abstract»

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  • Signature Analysis of Dispatch Schemes in Wafer Fabrication

    Publication Year: 1986 , Page(s): 518 - 525
    Cited by:  Papers (10)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1120 KB)  

    Signature analysis is used to characterize lot dispatch priority schemes in wafer fabrication, a complex manufacturing operation. A number of idealized dispatch schemes are evaluated using a comprehensive assessment criterion. The production system analyzed in this paper is large in comparison to previous studies on manufacturing scheduling. Real dispatch schemes depend strongly on the characteris... View full abstract»

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  • Fatigue of 60/40 Solder

    Publication Year: 1986 , Page(s): 423 - 432
    Cited by:  Papers (126)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1656 KB)  

    Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results a... View full abstract»

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  • Screen Printing Grade Polyimide Paste for Alpha-Particle Protection

    Publication Year: 1986 , Page(s): 370 - 373
    Cited by:  Papers (2)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (648 KB)  

    Polyimide coatings are becoming an important means of providing large-scale memory devices with protection against alpha-particle induced soft error. Efforts to develop a cost-effective method of application have led to the introduction of screen-printable polyimide materials. Conventional polyimide formulations are not suitable for screen printing because their filler particles fire larger than 4... View full abstract»

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  • The Preparation and Properties of 4.7 uF 2220 Size 50 V Z5U Relaxor Multilayer Ceramic Capacitors

    Publication Year: 1986 , Page(s): 464 - 468
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (616 KB)  

    A new dielectric for multilayer ceramic capacitors is currently undergoing factory qualification. This dielectric is based on a nonstoichiometric lead magnesium niobate relaxor material. Dielectric constants in excess of 15000 have been achieved for bodies which sinter close to 900°C with 100 percent Ag internal electrodes. The use of very high Ag content electrode systems means that there is... View full abstract»

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  • Reliability of Metallized Ceramic/Polyimide Substrates

    Publication Year: 1986 , Page(s): 396 - 402
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (904 KB)  

    A new packaging technology has been developed to allow increased switching speeds, lower noise levels, and increased circuit density. The package consists of a ceramic substrate with two layers of copper circuitry separated by a polyimide layer. Extensive accelerated stress testing was performed on the chip carrier to determine the reliability exposures. We found no dielectric or interlayer failur... View full abstract»

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  • Signature Analysis: Simulation of Inventory, Cycle Time, and Throughput Trade-Offs in Wafer Fabrication

    Publication Year: 1986 , Page(s): 498 - 507
    Cited by:  Papers (7)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1448 KB)  

    Signature analysis provides a powerful heuristic method for the planning of simulation experiments and for the interpretation of simulation results. Signature analysis has been developed within the context of simulation of the dynamics of wafer fabrication operations in integrated circuit manufacturing. Graphical display of cycle time, throughput, and inventory provides a "signature" of the dynami... View full abstract»

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  • Solder Connections with a Ni Barrier

    Publication Year: 1986 , Page(s): 433 - 439
    Cited by:  Papers (3)  |  Patents (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1400 KB)  

    Copper-tin intermetallic compounds readily form when tin-bearing solder connections are made to copper surfaces. These compounds continue to grow during the life of solder connections and represent potentially weak interfaces. An investigation was undertaken to determine if a diffusion barrier between the solder and copper would inhibit Cu-Sn intermetallic compound formation and thereby extend joi... View full abstract»

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  • Current-Leakage Failures in Hybrid Microcircuits

    Publication Year: 1986 , Page(s): 403 - 409
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1544 KB)  

    Electrical failures due to excessive current leakage have been observed in several hybrids during both hot and cold temperature testing. Failures have been correlated with increased amounts of ionic and gaseous contamination in the package. Short-term failures at cold temperature appeared to be due to ammonia (from the substrate-attach epoxy) condensing on the substrate and acting as a conductive ... View full abstract»

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  • Aluminum Alloy Package for Microwave Amplifier

    Publication Year: 1986 , Page(s): 513 - 517
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (832 KB)  

    A study of hermetic sealing methods for a general-use Al alloy package for a microwave amplifier with increased output power and lighter weight is described. To solder the glass insulated terminals to the Al alloy case hermetically, using commercial Pb-Sn solder, we propose a unique "local plating method"--Ni plating inside the terminal holes of the case. In this method, Ni plating 2-4/um thick is... View full abstract»

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  • Surge Current Failure in Solid Electrolyte Tantalum Capacitors

    Publication Year: 1986 , Page(s): 475 - 479
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1024 KB)  

    Fast charging and discharging of solid tantalum capacitors causes breakdown by heating in the MuO2cathode instead of dielectric breakdown. It appears that localized regions of lower resistance and poor thermal contact to a heat sink allow very high temperatures to occur. These "hot spots" can then cause breakdown of the adjacent dielectric film and, eventually, loss of the capacitor. Te... View full abstract»

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  • Thermal Characteristics of Plastic Small Outline Transistor (SOT) Packages

    Publication Year: 1986 , Page(s): 353 - 363
    Cited by:  Papers (10)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1720 KB)  

    Surface mount plastic packages, including small outline transistor (SOT), small outline integrated circuit (SOIC), and plastic leaded chip carrier (PLCC), are projected to be the next generation replacement for plastic dual in-line packages (DIP's). Relative to DIP's, surface mount packages are small in size and allow higher package density on a hoard, leading to higher electrical speed for system... View full abstract»

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  • VLSI Packaging Technique Using Liquid-Cooled Channels

    Publication Year: 1986 , Page(s): 328 - 335
    Cited by:  Papers (15)  |  Patents (5)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1280 KB)  

    A new packaging technique which employs innovative indirect liquid cooling is described. The technique involves mounting very large-scale integrated (VLSI) chips on a multilayered alumina substrate which incorporates very fine coolant channels. In particular, an investigation into the optimal structure for the cooling section by computer simulation and by experiment involving the physical implemen... View full abstract»

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  • Noncontact Bent Pin Detection Using Laser Diffraction

    Publication Year: 1986 , Page(s): 458 - 463
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (728 KB)  

    The use of optical diffraction is investigated to detect bent pins on a high-density multi-chip integrated-circuit module as an intermediate step in a robotic assembly process. A fixed laser beam shines on a fixed optical array while the robot moves the pins of the module through the beam at four different orientations. (While two scans are mathematically adequate, four scans are required because ... View full abstract»

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  • Polyimide - Substrate Bonding Studies Using \gamma -APS Coupling Agent

    Publication Year: 1986 , Page(s): 364 - 369
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (936 KB)  

    Application of polyimides in microelectronics fabrication for interlevel dielectric, passivation, or device isolation requires that the polymer films maintain interface integrity with a variety of surfaces at high temperature and during solvent processing. y-aminopropyltriethoxy-silane (y-APS) in aqueous solution is the most commonly employed adhesion promoter for the bonding of polyimides to inor... View full abstract»

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  • Special Properties of Molding Compounds for Small-Outline Packaged Devices

    Publication Year: 1986 , Page(s): 374 - 378
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (528 KB)  

    Wave soldering techniques currently used in the surface mounting of plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC) devices may be contributing to significantly reduced moisture resistance performance levels after components are assembled on printed circuit boards. Research indicates that delamination of the plastic package from the silicon chip surface is associated... View full abstract»

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  • Charge Carriers and Time Dependent Currents in BaTiO3-Based Ceramic

    Publication Year: 1986 , Page(s): 469 - 474
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (736 KB)  

    The following items are treated for BaTiO3-based ceramic and multilayer ceramic (MLC) capacitors: type of charge carrier, mode of transport, and time dependence of conductivity during degradation. For a specific X7R-type ceramic, the charge carrier is verified to be the electron by several independent measurements. Seebeck voltages are negative; Galvanic voltages are zero; leakage curre... View full abstract»

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  • Electrical Properties of Cr - Al Alloy Thin Films

    Publication Year: 1986 , Page(s): 391 - 395
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (672 KB)  

    Electrical properties of Cr-Al alloy thin films which were deposited on 96-percent alumina substrates by using resistance-heated evaporation have been investigated. The resistivity of the thin films took a maximum value (2.2 x 10-5 ... View full abstract»

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  • A Low Cost Lead Frame Techonology for Automated Laser Packaging

    Publication Year: 1986 , Page(s): 455 - 457
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (664 KB)  

    The current price of packaged high quality 1.3 um lasers for lightwave communications makes them prohibitively expensive for local applications. To demonstrate a way of reducing this high price a laser mount has been designed and fabricated using an inherently inexpensive stamping process. The design is adaptable for automated bonding testing and accelerated aging, which promises significant furth... View full abstract»

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  • High-Density Optical Digital Datalink with Double-Sided Packaging

    Publication Year: 1986 , Page(s): 450 - 454
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1008 KB)  

    A fiber optic receiver is apt to be disturbed by electromagnetic interference by adjacent circuits because of its low input power level. Therefore, in a duplex optical datalink consisting of a transmitter and a receiver, the crosstalk from the transmitter to the receiver may become an obstacle in increasing the packaging density. An approach to fabricating a transmitter on one side of an FR-4 four... View full abstract»

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  • Parametric Study of Heatspreader Thermal Performance in 48 Lead Plastic DIP's and 68 Lead Plastic Leaded Chip Carriers

    Publication Year: 1986 , Page(s): 347 - 352
    Cited by:  Papers (8)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (808 KB)  

    A study of material and dimensional parameters that affect the thermal performance of heatspreaders internal to 48 lead dual in-line package (DIP) and 68 lead plastic leaded chip carrier (PLCC) molded plastic packages is given. It was found that package thermal resistance is relatively insensitive to heatspreader thermal conductivity and thickness, while variations in area can greatly influence th... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope