IEEE Transactions on Product Engineering and Production

Issue 1 • April 1964

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Displaying Results 1 - 5 of 5
  • Editorial

    Publication Year: 1964, Page(s): 1
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (65 KB)

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  • Design of the CO60Facility at Washington State University

    Publication Year: 1964, Page(s):2 - 8
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1000 KB)

    Factors leading to design and construction of the 5500 curie Co60 facility are presented. Emphasis is placed on safety restrictions, research needs, and location limitations. Particular emphasis is given to design of linear isodose curves in the usable portion of the radiation field. Source geometry and intensity calculations as well as economy and feasibility problems are presented along with lim... View full abstract»

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  • Designing Dynamic Test Sets for Use Optimization

    Publication Year: 1964, Page(s):9 - 15
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (896 KB)

    Problems resulting where test sets must be both dynamic (or system exercising), and portable are analyzed and discussed, with a study of maintenance philosophy applicable to the system being tested. Three basic problems are covered, relating to the questions: Is there actually a portability requirement? - What is the optimal component density? - What is the optimal degree of automaticity? This rep... View full abstract»

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  • Multilayer Printed Circuit Interconnection Techniques

    Publication Year: 1964, Page(s):16 - 20
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (568 KB)

    Proponents of the various miniaturization techniques claim advantages of: reduced size, weight and cost, and increased reliability. Reduction in size and weight are obvious consequences of the technique. Reduced cost and improved reliability are still to be proven. Shrinking electronic assemblies and sub-assemblies bring about interconnection problems to the packaging engineer. Interconnecting dev... View full abstract»

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  • Memory Drums and Spindles

    Publication Year: 1964, Page(s):21 - 31
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1664 KB)

    With the advent of the age of computers, electronic systems engineers turned their attention to the development of memory drums and spindles. Thus, they affiliated themselves, intentionally or otherwise, with the mechanical engineer and his wealth of knowledge in the field of machine design. System considerations and requirements are examined in addition to some of the primary technical areas, o I... View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope