IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volume 8 Issue 2 • June 1985

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Displaying Results 1 - 11 of 11
  • Editorial

    Publication Year: 1985, Page(s): 245
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    Freely Available from IEEE
  • Foreword to special issue on 1984 CHMT Symposium

    Publication Year: 1985, Page(s): 246
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    Freely Available from IEEE
  • Bibliography of Heat Transfer in Electronic Equipment

    Publication Year: 1985, Page(s):289 - 295
    Cited by:  Papers (12)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1283 KB)

    A bibliography of 237 publications dealing with heat transfer in electronic equipment is presented. The papers are arranged in twelve categories, and cover the period from 1970-1984, although a majority of the papers listed were published in the last three years. View full abstract»

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  • Thick Film and Direct Bond Copper Forming Technologies for Aluminum Nitride Substrate

    Publication Year: 1985, Page(s):253 - 258
    Cited by:  Papers (37)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1128 KB)

    Thick film and direct bond copper (DBC) were successfully formed on aluminum nitride (AIN) ceramics. Commercially available gold (Au), silver-palladium (Ag-Pd), and copper (Cu) thick film pastes for alumina (AI2O3) were formed on AIN under exactly the same firing conditions as on AI2O3. From X-ray micro analysis (XMA) and X-ray diffraction (XRD) analysis... View full abstract»

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  • A1N Substrates with High Thermal Conductivity

    Publication Year: 1985, Page(s):247 - 252
    Cited by:  Papers (82)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    A new aluminum nitride (AIN) substrate, which has high thermal conductivity of 160 W/mK at room temperture, has been developed using the hot press sintering technique. The new AIN substrate has the following excellent characteristics. 1) The thermal conductivity is eight times as high as that of AI2O3at room temperature and is almost equal to that of 99.5 percent BeO at 150&#... View full abstract»

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  • Piezoelectric Measurements on Ceramic Multilayer Capacitors

    Publication Year: 1985, Page(s):283 - 288
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (808 KB)

    Piezoelectric measurements are reported for a series of commercial multilayer capacitors which had been previously tested and sold for high-reliability applications. The capacitors conformed to BX specifications and were fabricated from various combinations of barium titanate based dielectric compositions with different electrode materials. Dielectric properties are reported, including distributio... View full abstract»

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  • Analytical and Experimental Analysis of Nonlinear Bouncing Contacts

    Publication Year: 1985, Page(s):296 - 302
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1072 KB)

    Methods of experimental and analytical analysis of bouncing contacts of real relay are described. The results of experiments are presented. Theoretical analysis of bouncing contacts is given. The real process represented by superposition of the linear system process with the contact line process is calculated. The comparison between the experimental and the analytical results is carried out, and a... View full abstract»

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  • Investigation of Solder Fatigue Acceleration Factors

    Publication Year: 1985, Page(s):275 - 282
    Cited by:  Papers (32)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1080 KB)

    Solder fatigue was investigated experimentally for effects of the strain loading waveform in isothermal mechanical fatigue, and frequency and strain range in true thermal cycling. Rapid strain loading followed by a long hold period at constant strain was found to be very damaging compared to constant rate cycling at the same peak amplitude and period. Thermal cycle fatigue data showed a stronger d... View full abstract»

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  • Hybrid Integrated Surge Protector for Digital Switching System

    Publication Year: 1985, Page(s):259 - 263
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    A newly developed hybrid integrated surge protector (HISP) is described. The HISP circuit configuration employs a three-stage protection circuit. The HISP consists of thick film resistors whose pattern and trimming configuration are designed to enable resistance stability for the surge current to be obtained and newly developed ieadless surge protective devices, such as a three-electrode gas-fille... View full abstract»

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  • Electrical Parameter Analysis from Three-Dimensional Interconnection Geometry

    Publication Year: 1985, Page(s):269 - 274
    Cited by:  Papers (11)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    TRISIM1, a capacitance and inductance calculation program for complex three-dimensional geometries, is described. The basic algorithm of capacitance calculation is Green's function integral equation method and the inductances are calculated by Neumann's formula applied to the thin filaments which make up the conductor segment. In TRISIM1, for efficient use of these algorithms, 1) triangular capaci... View full abstract»

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  • Two-Dimensional Tactile Sensor Using Optical Method

    Publication Year: 1985, Page(s):264 - 268
    Cited by:  Papers (1)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (712 KB)

    A new tactile sensor has been developed for use with robot hands. It is composed of a light-emitting diode (LED) matrix, a photo detector matrix, and a pressure-receiving section piled upon each other. According to this new development, the distortion of the pressurereceiving section is detected with a combination of the LED's and photo detectors, and the resultant output of the photo detectors is... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope