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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Issue 2 • Date June 1984

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Displaying Results 1 - 7 of 7
  • Editorial

    Publication Year: 1984 , Page(s): 165
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    Freely Available from IEEE
  • Failure Modes of InGaAsP/InP Lasers Due to Adhesives

    Publication Year: 1984 , Page(s): 202 - 206
    Cited by:  Papers (8)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (792 KB)  

    Sudden failure modes for lnGaAsP/InP lasers were observed during aging. Growth of Sn whiskers, formation of voids between the heat sink and package stem, separation of metallized metal from the diamond heat sink, and reaction of solder material with laser chip were observed. Since they were found to induce sudden failures, the choice of bonding solders and metals for heat sink metallization is ver... View full abstract»

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  • Silicon-On-Silicon Packaging

    Publication Year: 1984 , Page(s): 193 - 196
    Cited by:  Papers (27)  |  Patents (13)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (568 KB)  

    Honeywell's new packaging technique uses silicon as a multichip substrate. Multiple integrated circuit (IC) chips are flip bonded by controlled collapse joining to a silicon substrate. The silicon substratc provides the interconnections between chips and the next level of interface. The silicon substrate is subseqently epoxy bonded to a ceramic substrate, and the package is then completed by wire ... View full abstract»

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  • Cleaning Processes For HIC's with Solder Paste

    Publication Year: 1984 , Page(s): 176 - 188
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2576 KB)  

    The use of solder paste for hybrid integrated circuit (HIC) assembly is increasing. However the full potential of solder paste has not yet been realized, partly because the fluxing systems may be very different from paste to paste. Therefore choosing the proper cleaning treatment is not trivial. In addition to removing any soldering flux present, the cleaning treatment must also effectively remove... View full abstract»

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  • Bond-Integrity Testing of Sapphire Chips Mounted with Eutectic Preforms

    Publication Year: 1984 , Page(s): 189 - 192
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    The 3000-5000 Å polysilicon film deposited on the back surface of a sapphire wafer during the polysilicon-gate deposition process is shown to provide a satisfactory bonding layer for eutectic mounting of silicon-on-sapphire (SOS) chips to gold-plated packages using Au-Si eutectic preforms, provided that the back-surface polysilicon film is maintained in the undoped state during subsequent waf... View full abstract»

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  • The VLSI Package-An Analytical Review

    Publication Year: 1984 , Page(s): 197 - 201
    Cited by:  Papers (8)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (472 KB)  

    Current very large-scale integrated (VLSI) chip packaging options, with a special emphasis on the various size and chip I/O complexity issues are reviewed, quantitatively. The two basic packaging options reviewed are the hermetic chip carrier (HCC) and the pin grid array (PGA). The impact that chip input/output (I/O) has on the "size" growth of packages as single chip enclosures, as well as that o... View full abstract»

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  • The Microstructure of RuO2Thick Film Resistors and the Influence of Glass Particle Size on their Electrical Properties

    Publication Year: 1984 , Page(s): 166 - 175
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1576 KB)  

    The microstructure and electrical properties of RuO2thick film resistors have been studied with special emphasis on the effects of material parameters and processing variables such as size of glass frit particles, RuO2-glass mixing ratio, firing conditions, and so forth. A network of RuO2develops in a glass matrix on firing, and the increase in the glass particle s... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope