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IEEE Transactions on Parts, Materials and Packaging

Volume 4 Issue 2 • June 1968

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Displaying Results 1 - 4 of 4
  • Who's Who in G-PMP: Bernard Schwartz

    Publication Year: 1968, Page(s): 34
    Request permission for commercial reuse | PDF file iconPDF (137 KB)
    Freely Available from IEEE
  • Dielectric Property Measurement of Insulating Paper by the Gap Variation Method

    Publication Year: 1968, Page(s):35 - 40
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (792 KB)

    A brief convenient method of examining the characteristics of the dielectric properties of paper specimens, and the experimental results using the gap variation method are · presented. The dielectric property measurement of paper specimens as thin as 30 microns is possible. Paper specimens of such a size can be measured one sheet at a time and need not be stacked to be measured, as is the cas... View full abstract»

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  • Triangular, Rhomboid, and V Distributed - Resistance Networks and Their Applications

    Publication Year: 1968, Page(s):41 - 50
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    This paper presents the computer-aided design of three new distributed-resistance thin-film networks of various triangular, rhomboid, and V geometries. The triangular network may avoid two shortcomings of earlier rectangular networks: nonuniform current density and power dissipation in the resistance film and computational difficulty involved in elliptic function transformation. In distributed-res... View full abstract»

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  • The Failure Mode and Lifetime of Static Contacts

    Publication Year: 1968, Page(s):51 - 55
    Cited by:  Papers (27)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    This paper describes the failure mode due to corrosion at the contacting surfaces of static contacts in connectors and mechanical wiring connections. Copper static contacts with no mechanical separation fail to maintain electrical continuity when temperature-cycled from 20 to 200°C. Electron diffraction analysis and microscopic inspection show that this failure mode is due to growth of Cu View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope