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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Issue 3 • Date September 1980

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Displaying Results 1 - 24 of 24
  • Foreword - Special Issue on Manufacturing Technology

    Publication Year: 1980 , Page(s): 314
    Save to Project icon | Request Permissions | PDF file iconPDF (118 KB)  
    Freely Available from IEEE
  • Strain Sensitivity in Thick-Film Resistors

    Publication Year: 1980 , Page(s): 421 - 423
    Cited by:  Papers (1)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (416 KB)  

    Piezoresistive properties of Dupont 1400 series thick-film resistors have been investigated by measuring longitudinal and transverse gauge factors as a function of applied strain between 0 and _+ 1000 microstrain in the temperature range from -70 to + 140°C. The relative change in resistance of thick-film resistors is linear, reproducible, and hysteresis free for the full range of applied str... View full abstract»

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  • Foreword on Productivity

    Publication Year: 1980 , Page(s): 313
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (152 KB)  

    First Page of the Article
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  • Voltage Breakdown Testing of Relays in the 1000-V Range

    Publication Year: 1980 , Page(s): 442 - 448
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1104 KB)  

    The ac voltage breakdown between adjacent conductors separated by an insulator on relays has been examined using two types of breakdown test sets and a sensitive corona (partial discharge) detector. A large difference in the breakdown voltages was observed on relays from the same population using two breakdown test sets. The characteristics of the test sets were examined to identify the cause of t... View full abstract»

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  • Computer Control and Data Management in an LSI Fabrication Facility

    Publication Year: 1980 , Page(s): 339 - 344
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1008 KB)  

    A minicomputer system is used to control diffusion furnaces, monitor temperatures, provide operator instructions for each processing step, and record detailed process histories for wafer lots fabricated in the Sandia Semiconductor Development Laboratory. The system provides a complete data base for laboratory operations, a variety of displays describing equipment status, scheduling and utilization... View full abstract»

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  • Traceability via Voice Data entry

    Publication Year: 1980 , Page(s): 360 - 366
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (784 KB)  

    The manufacture of high reliability electronic black boxes requires traceability, which, in essence, is the availability of data that creates a road map from the final product down to the microscopic semiconductor chip on a microelectronic hybrid assembly.The information is usually recorded by each operator and is eventually keyboard entered into a computer for a storage in a data bank. Alternativ... View full abstract»

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  • Heat Transfer Correlatins for Use in Naturally Cooled Enclosures with High-Power Integrated Circuits

    Publication Year: 1980 , Page(s): 449 - 452
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (504 KB)  

    Heat transfer rates were experimentally measured in an air-filled two-dimensional simplified model of a naturally cooled rectangular enclosure with a concentrated energy source representing a high-power integrated circuit (IC). The aspect ratio of the enclosure and the size and location of the source were parametrically varied. Correlations are presented such that a component temperature rise can ... View full abstract»

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  • The Frequency Response of Some Trimmed Passive Distributed RC Low-Pass Networks

    Publication Year: 1980 , Page(s): 408 - 420
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1016 KB)  

    An improved element, derived from the admittance parameters of a uniform distributed RC network, is proposed for use in a finite element simulation program. Its superiority over the simple RC element in the modeling of trimmed distributed RC structures is demonstrated. The improved element has been used to analyze the effects of single trim cuts, double trim cuts, and L-shaped trim cuts upon the p... View full abstract»

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  • Heat Transfer of Modified Silicon Surfaces

    Publication Year: 1980 , Page(s): 387 - 391
    Cited by:  Papers (9)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (808 KB)  

    The heat transfer between silicon surfaces and perfluorohexane has been measured for fluxes ranging from 0 to 2.2 W/cm2. Data are presented for ten different surface treatments designed to encourage thermal nucleation. View full abstract»

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  • Component Verification System

    Publication Year: 1980 , Page(s): 367 - 369
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (616 KB)  

    Typical hybrid microcircuits (HMC's) manufactured at the Bendix Corporation, Kansas City, MO, contain 100 beam lead devices and gold ribbon crossovers. Verification for the presence of these applique components historically has been done manually by comparing a visual aid to the HMC. All HMC's were verified visually, a process requiring 4-5 min/HMC. Approximately 12 percent of the defects were mis... View full abstract»

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  • Computerized Thick-Film Printer

    Publication Year: 1980 , Page(s): 327 - 330
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (488 KB)  

    The computerized thick-film printer has been developed as a manufacturing tool for the efficient and economical production of small quantities of thick-film hybrid microcircuits. Its capability for fine-line definition onto ceramic substrates is based on the use of a high-speed orifice printing process. The printer reduces the time and cost of developing and producing thick-film hybrid microcircui... View full abstract»

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  • Resolution of the Gold Wire Grain Growth Failure Mechanism in Plastic Encapsulated Microelectronic Devices

    Publication Year: 1980 , Page(s): 370 - 374
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (824 KB)  

    The relative statistical influence of bonding parameters and assembly materials on the failure frequency rate of microelectronic devices in plastic encapsulated packages due to grain growth, "wire creep" failure are resolved. Wire creep is a stressinduced break in a thermocompression gold wire ball bond which most frequently occurs within several wire diameters above the ball in plastic encapsulat... View full abstract»

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  • Electroless Bath Automatic Analyzers from a User's Viewpoint

    Publication Year: 1980 , Page(s): 384 - 386
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (576 KB)  

    Seven years of production floor use of automatic analyzers developed by Photocircuits has proven their effectiveness in controlling the metal deposition processes in additive and substractive printed board manufacturing with a minimum of operator intervention. The control capabilities include continuous chemical analysis and adjustment of the additions to the plating baths. Use of analysers has el... View full abstract»

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  • Novel Process for Fabricating Nichrome-Aluminum Film Resistor Networks

    Publication Year: 1980 , Page(s): 453
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (128 KB)  

    A novel process for the fabrication of nichrome-aluminium based thin-film resistor networks on glass plates is described. The process uses only an aluminium etchant, and it can also be used with a cermet-aluminium film system. Various advantages of the process are pointed out. View full abstract»

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  • Hybrid Integrated Circuit Manufacturing Process as Controlled by Shop Information Systems

    Publication Year: 1980 , Page(s): 345 - 353
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2248 KB)  

    Hybrid integrated circuits (HIC's) used in Bell System transmission equipment are rapidly increasing in numbers, type, and complexity. An efficient and effective system of controlling and monitoring the HIC manufacturing process is therefore of prime importance if scheduling, inventory, product yield, and operator performance are to be accurately determined. The major sequence of operations is des... View full abstract»

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  • Automatic Work Direction Preparation

    Publication Year: 1980 , Page(s): 354 - 359
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (704 KB)  

    The preparation of written work directions for manufacturing processes becomes routine paperwork for standard products such as printed wiring boards. The printed wiring board process has been standardized to the degree that a computer can automatically prepare a work direction after the engineer answers approximately 20 questions about the process. After a few minutes of editing, the work directio... View full abstract»

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  • Numerical Analysis of the Resistance of Interference-Fit Pin Connections

    Publication Year: 1980 , Page(s): 402 - 407
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (792 KB)  

    A three-dimensional analysis is presented for the resistance of an interference-fit pin connection in a plated-through hole. The analysis examines the electric potential distribution resulting from the application of a four-wire resistance measurement method. In light of the resultant potential distributions, the utility of the test method is discussed and found to give variable results with respe... View full abstract»

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  • A Thick-Film Hybrid Laser Target Board

    Publication Year: 1980 , Page(s): 436 - 441
    Cited by:  Papers (1)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (944 KB)  

    The concept and feasibility of a thick-film thermistor array laser target board is presented. Laser detector concepts are reviewed, and the justification for using a thick-film hybrid array is given. The design concepts and theoretically predicted performance are presented, and experimental results are compared to predictions. The hybrid approach is believed capable of producing a practical laser ... View full abstract»

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  • Automatic Control of Large-Scale Integrated Circuit Fabrication Processes-Process Control Algorithms

    Publication Year: 1980 , Page(s): 331 - 339
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1688 KB)  

    An automated manufacturing process control technique which reliably and repeatedly signals the end of integrated circuit fabrication is designed to make optimum use of either a process control operator who will inspect an on-line strip chart recording of process generated reflectance data and determine the optimum time to quench the fabrication process, or a small data processing system to signal ... View full abstract»

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  • Stress Distributions Around an Interference-Fit Pin Connection in a Plated Through Hole

    Publication Year: 1980 , Page(s): 392 - 402
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1208 KB)  

    ln our applications with interference fit pins in plated through holes, we find it necessary to determine regions of high stress. The regions of high stress may be a source of cracks in the plated copper or land regions. In order to understand the source of these high stress regions, two analyses were performed. First, a thermal stress analysis of an interference fit pin connection is carried out ... View full abstract»

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  • Bonding Wire Microelectronic Interconnections

    Publication Year: 1980 , Page(s): 375 - 383
    Cited by:  Papers (9)  |  Patents (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1728 KB)  

    Fine-wire bonding is an important technology used for making electrical connections inside microelectronic device packages. In this method of interconnection, wire leads carry power and signals between semiconductor active circuits and leadframe or substrate metallization. Wire bonding technology is reviewed from a practical point of view. The thermocompression (T/C), thermosonic (T/S), and ultras... View full abstract»

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  • Formation of a Highly Resistive Deposit in the Reed Contact Unit

    Publication Year: 1980 , Page(s): 431 - 436
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1136 KB)  

    The formation of a highly resistive deposit in reed contact units working with low level loads is investigated. The buildup of the deposit is studied. It is analyzed in an Auger electron spectrometer (AES) and is found to consist of mainly carbon. The amount formed is estimated. The load range in which the deposit is formed is studied. It is shown that, under no-load conditions, a deposit is forme... View full abstract»

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  • An Introduction to the Navy Manufacturing Technology Program for Computerized Thick-Film Printing

    Publication Year: 1980 , Page(s): 315 - 327
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1568 KB)  

    The objective of the Navy Manufacturing Technology Program for Computerized Thick-Film Printing is to establish advanced thick-film hybrid manufacturing capabilities that are cost effective and efficient when applied to the comparatively small quantities of thick-film hybrid microcircuits typically associated with defense avionics development and production programs. This program will establish a ... View full abstract»

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  • Design and Development of a 68-Lead Nonhermetic Leaded Chip Carrier

    Publication Year: 1980 , Page(s): 424 - 430
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1232 KB)  

    The design and development of a 68-lead nonhermetic leaded chip carrier (CC) suitable for Packaging a high-speed bipolar gate array device with several watts of power dissipation are covered. This CC was designed to make use of thin-film hybrid assembly technology with a package outline generally consistent with the JEDEC Leaded Type A Standards. The CC is compatable with different silicon integra... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope