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Parts, Materials and Packaging, IEEE Transactions on

Issue 4 • Date December 1966

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Displaying Results 1 - 9 of 9
  • Information for authors

    Publication Year: 1966 , Page(s): 81
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    Freely Available from IEEE
  • Who's Who in G-PMP

    Publication Year: 1966 , Page(s): 82
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    Freely Available from IEEE
  • Guest Editor

    Publication Year: 1966 , Page(s): 83
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    Freely Available from IEEE
  • A Literature Survey on Interfaces Thin Dielectric Films and Surfaces - 1965

    Publication Year: 1966 , Page(s): 84 - 90
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1382 KB)  

    The bibliography contains 181 references on thin dielectric films, interfaces and surfaces. A brief commentary on each entry is included. The references are grouped according to the following subject areas: Fabrication, Measurement Techniques, Propersies, Models, and Surface States. View full abstract»

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  • Interconnection of Monolithic Integrated Circuits Through the Use of Advanced Materials and Techniques

    Publication Year: 1966 , Page(s): 90 - 98
    Cited by:  Papers (1)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1940 KB)  

    High-density microelectronic circuity requires interconnection wire diameters of less than 0.005 inch and pad sizes less than 25 X 10-6square inch. Most ohmic contact pads on chips are aluminum as the material with the least of possible evils. Metallization of substrates to interconnect chips commonly consists of chromium for adhesion and gold or aluminum for conductivity. Substrate mat... View full abstract»

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  • An Automated X-Y Dimensional Stability Measuring System for Printed Circuits Substrates

    Publication Year: 1966 , Page(s): 99 - 107
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1484 KB)  

    A system is described for measuring length (width) changes in printed-circuit substrates under environmental (temperature/humidity) changes. A fixture for samples 20 inches in length is also described. Data are given for temperature coefficient and humidity coefficient of epoxy-glass substrates 0.010 in and 0.020 in thick, both bare and partially covered with an etched copper pattern. Two approxim... View full abstract»

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  • Elimination of Fractures in Plated-Through-Hole Printed Circuit Boards by the Use of Ductile Plating

    Publication Year: 1966 , Page(s): 107 - 109
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (440 KB)  

    This paper describes a printed wiring board manufacturing process which assures a crack-free plated-through-hole. The continuity between layers of printed circuit boards is achieved by depositing electroless copper followed by electroplated copper in a hole drilled through the layers. It was found that conventional boards were subject to cracking at the barrel of these holes during soldering. The ... View full abstract»

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  • Ceramic Dielectrics with Relatively High Thermal Conductivities

    Publication Year: 1966 , Page(s): 110 - 113
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (608 KB)  

    Ceramic dielectrics were prepared by dispersing a high dielectric constant phase in a beryllium oxide matrix. The dispersant phases were doped futile (Ti02) 'rod strontium and calcium til:anate. The microwave dielectric constants varied from 10 to 23 as a function of the amount of dispersed phase. The room temperature thermal conductivity of the same mixture-compositions varied from 0.2... View full abstract»

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  • The Variation of the Conductivity of Ta2O5in Electrolytic Capacitors

    Publication Year: 1966 , Page(s): 114 - 115
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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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