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IEEE Transactions on Parts, Materials and Packaging

Issue 1/2 • Date March/June 1966

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Displaying Results 1 - 8 of 8
  • Who's Who in G-PMP

    Publication Year: 1966, Page(s): 2
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    Freely Available from IEEE
  • Transient and Steady-State Temperature Distribution in Foil-Wound Solenoids and Other Electric Apparatus of Rectangular Cross Section

    Publication Year: 1966, Page(s):3 - 9
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (841 KB)

    The formal solution is obtained for the transient thermal response of a rectangular region with orthotropic thermal conductivity, Joulean heating, and general boundary conditions (where the temperature in the surrounding medium is a function of both space and time). In the most practical case, where the surrounding medium is at a constant ambient temperature, the transient solution takes the form ... View full abstract»

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  • Zinc Oxide-Bismuth Oxide Low Q Decoupling Capacitor

    Publication Year: 1966, Page(s):9 - 24
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    A description and analysis are presented of the fabrication and electrical properties of a non-ferroelectric material with a high apparent dielectric constant over a wide frequency range into the megacycle region. This material is zinc oxide with additions of bismuth oxide. Specific attention is focused on those properties which make the material uniquely suited for microminiature high-frequency l... View full abstract»

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  • Birefringent Tape-A New, Easier Technique for Seperating Thin Film and Printed Circuit Master Drawings with Perfect Registration

    Publication Year: 1966, Page(s):25 - 28
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (577 KB)

    A novel, easier technique is described for separating thin film and printed circuit master drawings with near-perfect registration for microelectronic production-masking purposes By employing inexpensive, readily manufactured, and easily identifiable strips or rolls of adhesive-backed transparent birefringent plastic tape, there results a more accurate, less costly, less tedious, and less time-con... View full abstract»

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  • Properties and Life Performance of Silicon Monoxide Capacitors

    Publication Year: 1966, Page(s):29 - 35
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1479 KB)

    In SiO capacitors, deposition rate and thickness interact in their effect on leakage resistance. Slow (2 Å/s) and fast (20 Å/s) deposited films in the 2000-Å thickness range exhibit almost a million-fold difference in leakage, while similar rates, for 10000-Å films, show only a thousand-fold difference. Dissipation factor and temperature coefficient of capacitance (TCC), under ... View full abstract»

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  • Suction vs. Pressure Forced Air Cooling-Part II

    Publication Year: 1966, Page(s):35 - 43
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1234 KB)

    In present compact electronic equipment, efficient cooling is a prime design factor. Certain aspects of the current state of the art of cooling are subjected to continuing controversy. In an electronic equipment, cooled by forced air flow, fans may be placed at the air inlet location, at the air outlet, or at both locations. Depending on the location of fans, a different air flow pattern is genera... View full abstract»

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  • Optimum taper for thermal conduction paths in electronic equipment

    Publication Year: 1966, Page(s):43 - 44
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (254 KB)

    Walls must often serve as conduction heat paths in many industrial applications. For the general case where heat is uniformly supplied to a wall or plate, the heat to be conducted down the wall to a heat sink, the question arises whether the wall should be of uniform thickness or tapered, for a given volume of material. The wall giving the smaller temperature drop could be considered the better de... View full abstract»

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  • Trimming thin film resistors by direct resistance heating

    Publication Year: 1966, Page(s):44 - 45
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (249 KB)

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope