IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • September 1979

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Displaying Results 1 - 15 of 15
  • Editorial Comment

    Publication Year: 1979, Page(s): 277
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    Freely Available from IEEE
  • Who's Who in CHMT

    Publication Year: 1979, Page(s): 278
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    Freely Available from IEEE
  • A Low-Cost Solar-Cell Front Contact Using Trapped Silver Mesh and Electrostatic Bonding

    Publication Year: 1979, Page(s):350 - 355
    Cited by:  Papers (4)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (889 KB)

    One of the major costs of modern solar-cell manufacture is that of applying a metallized contact grid to the cell front surface. If solar energy is to become a viable source of !ow-cost electricity, this expense must be reduced significantly. To keep efficiency high, a metallization grid must provide narrow closely spaced high conductivity lines. A new system to provide this contact with a silver ... View full abstract»

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  • Bumped Tape Automated Bonding (BTAB) Practical Application Guidelines

    Publication Year: 1979, Page(s):301 - 308
    Cited by:  Papers (3)  |  Patents (10)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1336 KB)

    A number of mass bonding techniques have been used to replace wire bonding in hybrid microcircuit (HM) fabrication, but none has approached universal acceptance. In recent years tape carrier technology, typically called tape automated bonding (TAB) has received considerable attention. A more recent development, bumped tape automated bonding (BTAB), maintains the advantages of conventional TAB, off... View full abstract»

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  • Reliability of Clip-on Terminals Soldered to Ta-Ta2N-NiCr-Pd-Au Thin Films

    Publication Year: 1979, Page(s):294 - 301
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1136 KB)

    Reliability of solder bonds to Ta-Ta2N-NiCr-Pd-Au conductors used for resistor-capacitor (RC) hybrid integrated circuits (HIC's) was investigated. The investigation consisted of aging 60 Sn-40 Pb solder bonds at elevated temperatures and measuring the bond strength. The experimental results are similar to those previously measured for Ta2N-Ti-Pd-Au conductors used for resisto... View full abstract»

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  • Characterization of Thermal Compression Wire Bonds to Thick-Film Conductors on Porcelain Substrates

    Publication Year: 1979, Page(s):288 - 293
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (792 KB)

    Four conductor compositions are examined for thermal compression bondability on porcelainized metal substrates. These materials, Thick Film Systems (TFS) 3045 Au, 3106 Pt-Au, 3535 Pt-Pd-Ag, and 3408 Pd-Ag, were evaluated on Alphamet® substrates. The study includes conductors printed on the substrate enamel and on substrates previously printed and fired with the Thick Film Systems 1129 RCB die... View full abstract»

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  • A System for Analyzing Contact Resistance

    Publication Year: 1979, Page(s):317 - 320
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (648 KB)

    A resistance measuring system and technique which has proven to be valuable as a means for studying the resistance behavior of electrical contacts is described. The system described is not intended for the rapid repetititive collection of resistance data but rather for gaining insight into the conduction properties of a contact by providing a versatile measurement system which takes into account t... View full abstract»

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  • Adhesion Characteristics of Ag-60Pd Alloy Under Extremely Short Arcs on Closure

    Publication Year: 1979, Page(s):337 - 342
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (784 KB)

    The adhesion or welding mechanism of an Ag-60Pd alloy during extremely short arcs on closure is investigated. The effect of oxygen on the adhesion is also examined under nonarcing conditions in an ultrahigh vacuum. The adhesion force and contact resistance are simultaneously measured under the conditions of a 10-g contact force, l-min contact duration, and 30-s contact interval. An Ag-60Pd alloy a... View full abstract»

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  • Aging of Solder Connections to Ti-Pd-Au Films

    Publication Year: 1979, Page(s):279 - 283
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (736 KB)

    Soldered connections to TiPdAu film composites show enhanced resistance changes (up to 0.02 ohms) during elevated temperature aging. This is attributed to solid-state dissolution by solder of Au from under the fillet edge, forming a AuSn intermetallic phase. The pull strength of soldered external leads decreases by as much as 40 percent during aging, probably by solid-state dissolution of Pd, form... View full abstract»

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  • Search for Test Simulating the Environment of Industrial Atmospheres for Contacts and Connections

    Publication Year: 1979, Page(s):343 - 350
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (960 KB)

    To define an environmental simulation test capable of predicting the behavior of contacts and connections in industrial atmospheres a study was conducted from two viewpoints. First, field tests relating to contact resistance measurements, analysis of tarnished surface layers of a great number of contacts, continuous atmospheric contaminant measurements (S02, H2S, NO, NOX... View full abstract»

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  • Diamond-Tipped and Other New Thermodes for Device Bonding

    Publication Year: 1979, Page(s):283 - 288
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (968 KB)

    Work is reported on the design and evaluation of new device-bonding thermodes with improved thermal properties. The present conventional titanium-carbide-tipped thermodes may have inadequate heat-transfer characteristics for certain new TAB and beamlead bonding applications. Two new thermodes were constructed. One of the new thermodes has a diamond bonding tip. A unique feature of this thermode is... View full abstract»

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  • Dielectric Stimulated Arcs in Lightning-Arrestor Connectors

    Publication Year: 1979, Page(s):309 - 316
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1032 KB)

    Substantial lowering of breakdown voltage can occur between electrodes in air when a solid insulator surface bridges these electrodes. The breakdown mechanism involves a type of surface flashover across the insulator. The apparent triggering of the breakdown by the insulator is called a dielectric stimulated arc. This phenomenon, based on previous experimental results, has been incorporated into t... View full abstract»

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  • A Capacitance Humidity-Sensing Transducer

    Publication Year: 1979, Page(s):321 - 323
    Cited by:  Papers (20)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (504 KB)

    Recent improvements in the design of humidity-sensing transducers and the materials used in their construction have minimized many of the past limitations. A new capacitance humidity sensor is described that has a design, construction, and material composition that impart a unique combination of properties. This humidity sensor also has an ease of fabrication that makes it an improvement over othe... View full abstract»

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  • A New Concept for Electroplated Electronic Contact Golds

    Publication Year: 1979, Page(s):324 - 329
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (872 KB)

    Due to the shortcomings of the present-day standard gold/cobalt and gold/nickel low-alloy contact golds, especially from aspects of high-temperature storage (approximately 125°C for 1000 h plus) and also their consistent risk of spontaneous cracking and solution operating difficulties, efforts were made to deviate from this thinking. The deposit was required to have low porosity at approximat... View full abstract»

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  • A Transmission-Line Analog Simulating Thin-Film Distributed-RC Elements

    Publication Year: 1979, Page(s):330 - 336
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (920 KB)

    Methods of modeling distributed-RC lines by finite-ladder networks are discussed. This culminates in the design and construction of a 20-section adjustable transmission-line analog capable of simulating a variety of uniform and tapered, three-terminal and four-terminal structures. The model also takes into account stray effects and permits performance insight without the otherwise complex irration... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope