IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volume 1 Issue 4 • December 1978

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  • Editorial Accolades

    Publication Year: 1978, Page(s):329 - 330
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    Freely Available from IEEE
  • Who's Who in CHMT

    Publication Year: 1978, Page(s): 331
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    Freely Available from IEEE
  • Foreword

    Publication Year: 1978, Page(s): 332
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    Freely Available from IEEE
  • X-Band High-Burnout Silicon-Schottky Mixer Diodes

    Publication Year: 1978, Page(s):340 - 344
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (841 KB)

    The development of a highly reliable thermal-compression bonded X-band silicon-Schottky barrier diode is described. A highburnout diode capable of handling peak RF power of 10-14 watts (tau= 1 µs, 103 Hz) with a noise figure of 6.5-7.0 dB (SSB) was suceessfully demonstrated. These diodes are more rugged than whisker type point contact and Schottky-barrier devices and exhibit two to... View full abstract»

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  • Material Characterization of Thick Film Resistor Pastes

    Publication Year: 1978, Page(s):383 - 392
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1814 KB)

    The study of material characterization of DuPont 1400 BIROXr thick-film resistor pastes is described. An understanding of the aging mechanisms of thick-film resistors requires a precise knowledge of their chemical composition and material characteristics. This information provides the technical basis for the Arrhenius-type time-temperature extrapolations of accelerated aging data on the resistors ... View full abstract»

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  • Internal Conformal Coatings for Microcircuits

    Publication Year: 1978, Page(s):416 - 422
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (928 KB)

    Inadvertent inclusion of conductive particulate contaminants in sealed hybrid microcircuit packages often results in electrical failure of the device. Particles that escape detection by postsealing radiographic (X-ray) or particle impact noise analysis can be effectively immobilized by conformally coating the circuit with a thin resilient film of silicone, epoxy, or polyxylylene (parylene). The ad... View full abstract»

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  • Evaluation of Adhesives for Hybrid Microcircuit Package Sealing

    Publication Year: 1978, Page(s):412 - 415
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    A study was performed to evaluate the suitability of adhesives for sealing hybrid packages for NASA/MSFC applications. This study consisted of three parts. 1) Screening ten selected adhesives on the basis of their ability to seal gold-plated Kovar packages that retain their seal integrity after individual exposures to four increasingly severe temperature-humidity environments. 2) Screening the fou... View full abstract»

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  • The Restructuring of Aluminum on Gallium Arsenide

    Publication Year: 1978, Page(s):432 - 433
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB)

    The restructuring of aluminum (Al) on GaAs has been observed on low-power GaAs field-effect transfers (FETs) and on special test structures. For 4 X 104heating and cooling cycles, temperature swings as low as 90°C produced restructuring. Restructuring is weakly dependent on deposition temperature, and no change in the Al resistance was observed. View full abstract»

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  • Extreme Temperature Range Microelectronics

    Publication Year: 1978, Page(s):333 - 340
    Cited by:  Papers (25)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1256 KB)

    Down-hole geothermal instrumentation must operate over a large temperature range. The technology and capabilities of room temperature to 300°C hybrid and printed-circuit (PC) board electronics that were developed during the last two years to meet that need are summarized. To ensure rapid widespread commercialization, this technology was developed, insofar as possible, using commericaUy availa... View full abstract»

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  • Lead Forming and Outer Lead Bond Pattern Design for Tape-Bonded Hybrids

    Publication Year: 1978, Page(s):377 - 383
    Cited by:  Papers (1)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1496 KB)

    Tape automated bonding (TAB) has progressed to such an extent that hybrid devices are now being designed and built with this technology. In contrast with monolithic device configurations, where inner and outer lead bonds are coplanar, the hybrid device requires the leads to descend from the chip top surface level to the substrate level. It is desirable that the leads follow a carefully designed tr... View full abstract»

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  • Ion Microprobe Analysis of Cathode Nickel Alloys

    Publication Year: 1978, Page(s):400 - 404
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (880 KB)

    An ion-microprobe technique of analysis for manganese and other potentially detrimental impurities in machined cathode nickel alloy buttons is described. This nondestructive method does not jeopardize the subsequent performance characteristics of the nickel ahoy button as a substrate for the barium-strontium oxide emitter material. This analytical technique is currently used as a standard quality ... View full abstract»

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  • Breakdown in Ceramic Capacitors Under Pulsed High-Voltage Stress

    Publication Year: 1978, Page(s):423 - 428
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    Failure in ceramic capacitors due to high-impulse voltages was investigated to determine the parameters which limit the breakdown voltage. It was found that the breakdown field strength is a function of the dielectric constant, the dielectric thickness, and the capacitor area. There was little correlation between the breakdown voltage and the rated voltage. Breakdown usually occurred at the edge o... View full abstract»

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  • Electrical Overstress Failure Modeling for Bipolar Semiconductor Components

    Publication Year: 1978, Page(s):345 - 353
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1288 KB)

    Engineering techniques are presented for predicting the failure threshold of bipolar semiconductor components. The failure threshold is expressed in terms of a failure current and failure voltage. Prediction of the failure conditions is based on estimation of background doping concentration and junction area. These estimates may be reade either from specification sheet parameters commonly provided... View full abstract»

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  • Five-Year Life Test Data on Pressure (10 000 lbf/in2) Tolerant Electronic Components

    Publication Year: 1978, Page(s):365 - 371
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1168 KB)

    A program is described where long-term reliability data on contemporary electronic components under a fluid pressure environment were accumulated. Resistors, capacitors, diodes, integrated circuits, inductors, and preamplifier modules that showed excellent short-term immunity to pressure were pressure-cycled five times and stored in silicone oil at 10 000 lbf/in2 (deep ocean pressure) for five yea... View full abstract»

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  • Reducing Post-Trim Drift of Thin-Film Resistors by Optimizing YAG Laser Output Characteristics

    Publication Year: 1978, Page(s):392 - 397
    Cited by:  Papers (8)  |  Patents (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    A study to determine the effects of laser parameters on tantalum nitride resistor stability is presented. A model Of the laser heat affected zone is proposed which relates laser pulse width, power, wavelength, repetition rate, and waist size parameters to energy delivered to remaining resistor material. Samples of qualified tantalum nitride resistors are trimmed with a range of laser parameters, a... View full abstract»

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  • Mass Changes of Adhesives During Curing, Exposure to Water Vapor, Evacuation and Outgassing, Part I: Ablefilms 529, 535, and 550

    Publication Year: 1978, Page(s):405 - 411
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    Mass losses of Ablefilms 529, 535, and 550 during curing ranged from 1-1.8 percent of the adhesive. The major gases evolved included the curing agent, solvent, water, carbon dioxide, and carbon monoxide. Exposure of Ablefilm 529 to 2.4 kPa (18 tort) water vapor yielded a saturation uptake of 0.27 percent of the sample mass, which could supply up to about ten times more water than needed for a dew ... View full abstract»

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  • A New Electroless Method for Low-Loss Microwave Integrated Circuits

    Publication Year: 1978, Page(s):428 - 431
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    A new method of depositing copper on alumina substrates is described. This results in less attenuation and better adhesion than that obtained by the prior method. The measured attenuation of microstriplines made by conventional vacuum evaporation of chromegold and by electroless copper deposition methods is compared in the range of 2-10 GHz. It is found that classical chrome-gold metallization giv... View full abstract»

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  • Radiation Effects on Silicon Charge-Coupled Devices

    Publication Year: 1978, Page(s):353 - 365
    Cited by:  Papers (19)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1824 KB)

    The permanent ionizing and neutron radiation-induced degradation in silicon charge-coupled devices, (CCD's), along with transient upset effects, are reviewed. The operation of a threshold voltage insensitive CCD input technique in a total dose radiation environment is evaluated. CCD structural design rules for decreasing ionizing radiation sensitivity are presented. The increased total ionizing do... View full abstract»

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  • Thermocompression Bondability of Bare Copper Leads

    Publication Year: 1978, Page(s):372 - 377
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (920 KB)

    Thermocompression bondability of bare (unplated) Cu leads to TiPdAu ~ms on alumina substrates was investigated. This is an extension of earlier work to reduce the Au-plating thickness on Cu leads. Initial bondability, prebond shelf life, and long-term reliability were evaluated. The results follow. 1) Initial bondability is satisfactory provided suitable bond deformation is used. 2) Prebond shelf ... View full abstract»

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  • Reactive Sputter Etching of Thin Films for Pattern Delineation

    Publication Year: 1978, Page(s):397 - 399
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    Thin films of several metals, commonly used in integrated circuit fabrication, were reactively sputter-etched in an oxygen atmosphere with a focused ion beam. A decrease in the sputter-etch rate was observed as the partial pressure of oxygen was increased from 1.5 X 10...6 to 1 X 10-4 tort. This decrease was attributed to a buildup of a surface layer of adsorbed oxygen on the target. The partial p... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope