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Parts, Hybrids, and Packaging, IEEE Transactions on

Issue 3 • Date September 1977

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Displaying Results 1 - 23 of 23
  • Foreword

    Publication Year: 1977 , Page(s): 193
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    Freely Available from IEEE
  • Tab Lead Capacitor

    Publication Year: 1977 , Page(s): 279 - 282
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (648 KB)  

    Differential thermal expansion between a monolithic chip capacitor and the common hybrid substrate materials gives rise to significant stresses in the chip. For conventional attach techniques and conventional chips, these stresses may exceed the strength of one or more of the components, chip, termination, substrate metallization, or solder, in the assembly with disastrous effects. Further, common... View full abstract»

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  • Failure Mechanisms in Beam Lead Semiconductors

    Publication Year: 1977 , Page(s): 225 - 229
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    Hybrid microcircuits (HMC's) designed for the Energy Research and Development Administration (ERDA) by Sandia Laboratory in Albuquerque, NM, are manufactured by the Kansas City, MO, Division of the Bendix Corporation employing beam lead devices (BLD's) as active components. The HMC's consist of sputtered tantalum-nitride (Ta2N) resistors and evaporated chromium-gold (Cr-Au) conductors o... View full abstract»

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  • The Reliability of Soldered or Epoxy Bonded Chip Capacitor Interconnections on Hybrids

    Publication Year: 1977 , Page(s): 218 - 224
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    The influence of capacitor chip-to-substrate assembly variables on interconnect reliability was evaluated using several conventional environmental tests. The variables investigated included: capacitor chip size, capacitor end metallization, substrate pad size, substrate metallization, different solders, and a nonconduetive and a conductive epoxy. Environmental tests consisted of mechanical shock, ... View full abstract»

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  • The Application of Magnetically Enhanced Sputtering in a Production Cylindrical Sputtering System

    Publication Year: 1977 , Page(s): 268 - 273
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    A Penning cylindrical sputtering geometry has been used for the production of tantalum thin films. A simple magnetic field-shaping technique coupled with proper target design has produced films with a uniformity characteristic of a quality deposit. The technique has proven to be a cost effective way of producing a high throughput of product in a system designed for a cylindrical sputtering mode. View full abstract»

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  • Reliability Study of a High-Precision Thick Film Resistor Network

    Publication Year: 1977 , Page(s): 229 - 234
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (808 KB)  

    This investigation was undertaken to determine the reliability of a thick film resistor network, comprised of 4 matched 1.1 M \Omega resistors. The objectives of the program were: 1) to define any potential failure mechanism and 2) to determine the end-of-life (20 years) resistot properties. These objectives were achieved by a simulated life-testing of the re... View full abstract»

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  • Phase and Amplitude Tracking of Hybrid RF Components

    Publication Year: 1977 , Page(s): 291 - 298
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    A study of data taken on bandpass filters and power dividers produced by the Harris Electronic Systems Division hybrid lab resulted in data that show precise amplitude and phase tracking. This paper addresses the design and fabrication techniques used to develop these two types of hybrid components used in most multichannel receiver systems. Aids for the design of thin-film interdigital capacitors... View full abstract»

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  • The Response of Optical Isolators in a Nuclear Radiation Environment

    Publication Year: 1977 , Page(s): 248 - 252
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    The effects of gamma total dose and gamma dose rate ex. posures on the operation of a state-of-the-art optical isolator were inves. tigated. The isolator was irradiated in both "on" and "off" states to determine upset in dose rate environments from 1.5 X 108to 2.2 X 1011rd/s (Si). High-state output voltage was subject to upset at all dose rates tested. Propagation delay times... View full abstract»

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  • Corona Discharge--Electrostatic Method for Deposition of Powdered Passivation Glass on Semiconductor Devices

    Publication Year: 1977 , Page(s): 322 - 328
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    Selective deposition of powdered passivating glass on either insulating or conducting regions of a device wafer can be accomplished by first depositing ions from a corona discharge on the insulating regions of the device wafer and then immersing the wafer in an insulating liquid containing a charged suspension of the powdered glass. The method is fast (about 15 s per wafer) and both sides can be c... View full abstract»

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  • Assessment of Silicone Encapsulants for Hybrid Integrated Circuits (HIC)

    Publication Year: 1977 , Page(s): 298 - 304
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1240 KB)  

    A silicone encapsulant has been investigated as to its effectiveness in preventing migrated gold resistive shorts (MGRS). Using a temperature cycle of -10°C to +100°C, MGRS formation was observed at moisture levels of 0.9 to 1.2 percent V/V for Cl-, 1-, K+, and Na+ion contaminated environments. The results indicate that water molecules and halo... View full abstract»

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  • A Production Parylene Coating Process for Hybrid Microcircuits

    Publication Year: 1977 , Page(s): 273 - 279
    Cited by:  Papers (3)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1256 KB)  

    Application of Parylene for protecting microelectronic circuits from loose particles and external environment has been visualized for many years. With a joint effort by NASA and TMD, a process has now been qualified to perform Parylene deposition on hybrid circuits on a production basis, for the Centaur inertial guidance computer. The Parylene coating process developed during this program consists... View full abstract»

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  • Design of a Single Stress-Relaxation Test for Pressure Connections

    Publication Year: 1977 , Page(s): 198 - 202
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (824 KB)  

    Pressure connections, for example, solderless wrap, sprit beam type, etc., have a common design principle of maintaining a high pressure at the interface of the wire and the terminal. Because of the creep characteristics of all materials, such connections can lose their pressure sustaining ability with time and temperature. Considering the long expected life of a connection, usually 40 years, and ... View full abstract»

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  • Obtaining High Reliability Performance from Commercial Quality Opto-Isolators

    Publication Year: 1977 , Page(s): 235 - 247
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1200 KB)  

    Techniques are presented for effectively screening plastic DIP opto-isolators for latent dark current leakage and premature current transfer end of life, with resultant low laboratory field failure rates. Investigations are described which included long life tests conducted at TRW Components Laboratories and vendor test laboratories, and field experience with TRW/Data Systems and TRW/VIDAR/Digital... View full abstract»

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  • Effect of Foil Edge Modifications and Configurational Changes on Energy Storage Capacitor Weight

    Publication Year: 1977 , Page(s): 314 - 317
    Cited by:  Papers (5)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (712 KB)  

    Corona failure at foil edges is the principal failure mechanism in well-designed and manufactured high energy-density pulse-discharge capacitors. By forming the foil edge with laser cutting or spark discharge machining, a 25-percent increase in corona inception voltage (CIV) over untreated edges is obtained. Folded foil produces a larger increase. Weight minimization using peak edge field as the l... View full abstract»

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  • Hybrid Microcircuit Tape Chip Carrier Materials/Processing Trade-Offs

    Publication Year: 1977 , Page(s): 257 - 268
    Cited by:  Papers (1)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2656 KB)  

    This paper surveys and compares several metallurgical structures and compositions used in the various reel-to-reel gang bonding processes now being implemented by high-volume semiconductor manufacturers. Various gang bonding techniques are reviewed briefly as background. Thermocompression (TC), hard solder, and soft solder inner lead bonding processes are compared, as well as TC, welding, and sold... View full abstract»

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  • Computerized Thermal Analysis of Hybrid Circuits

    Publication Year: 1977 , Page(s): 283 - 290
    Cited by:  Papers (24)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (872 KB)  

    A computer program was written to perform steady-state analysis for hybrid circuits. The output of the program gives the temperature of each power dissipating element in the hybrid. The program is based upon solution of Laplace's equation in three dimensions using Fourier techniques. The assumptions made are: no convection or radiation, constant and isotropic thermal conductivity for any single ma... View full abstract»

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  • The Effect of Solid-State Reactions Upon Solder Lap Shear Strength

    Publication Year: 1977 , Page(s): 202 - 207
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2128 KB)  

    The effect of solid-state reactions between gold plating and the eutectic solders 88Au:12Ge, 80Au:20Sn, 90SN:10Au, and 85Pb: 15Au and the off eutectic solder 60SN:36Pb:4Ag upon the solder lap shear strength has been investigated at four aging temperatures ranging from 75 to 150°C. Failure analysis of the lap shear samples has shown that Au-Ge and Au-Sn solders failed cohesively whereas Sn-Au,... View full abstract»

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  • Thermal Fatigue Failure of Soft-Soldered Contacts to Silicon Power Transistors

    Publication Year: 1977 , Page(s): 318 - 321
    Cited by:  Papers (11)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (848 KB)  

    Scanning electron microscopy was employed to characterize the structure of the soft-soldered joints in Si power transistors (type 2N3055), which failed electrically during thermal cycling. Cracks were observed in the soldered joint of many failed devices. Crack propagation seems to be accelerated by the presence of voids in the joint region. The importance of the reactions between the Ni layers an... View full abstract»

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  • Reduced Gold-Plating on Copper Leads for Thermocompression Bonding--Part II: Long Term Reliability

    Publication Year: 1977 , Page(s): 309 - 313
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (704 KB)  

    This two-part series is an evaluation of the acceptability for thermocompression (TC) bonding of Cu leads having reduced thicknesses of Au-plating at the bond sites. Part I was concerned with initial characterization which made use of recent grain boundary diffusion work in the Cu-Au system. In this second part, long term reliability is considered where use is made of recent work in volume interdi... View full abstract»

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  • Reduced Gold-Plating on Copper Leads for Thermocompression Bonding-Part I: Initial Characterization

    Publication Year: 1977 , Page(s): 305 - 309
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (728 KB)  

    In this two part series, Au-plated Cu leads with reduced Au thicknesses are evaluated for thermocompression (TC) bonding. Part I is concerned with initial characterization, which makes use of recent measurements of grain boundary diffusion coefficients (D') of Cu through Au. Part II considers the problem of predicting the long term reliability (40 years at 50°C) of these TC bonds, using recen... View full abstract»

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  • Hybrid Microcircuitry for 300°C Operation

    Publication Year: 1977 , Page(s): 252 - 257
    Cited by:  Papers (10)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (952 KB)  

    Microelectronic instrumentation for geothermal well logging must operate in ambient temperatures up to 300°C for several hundred hours. This study involved an extensive survey of 25 to 300°C operation of resistors, capacitors, conductors, interconnections, and active devices. Three major selection criteria were: 1) part lifetime of at least 1000 h at 300°C; 2) minimum change in elec... View full abstract»

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  • Performance of New Copper Based Metallization Systems in an 85°C 80-Percent RH Cl2Contaminated Environment

    Publication Year: 1977 , Page(s): 208 - 218
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1792 KB)  

    The performance of TPCNA (Ti-Pd-Cu-Ni-Au) and TCN+A (Ti-CuoNi+Au in selected areas only) meta!lizations in 85°C, 80-percent RH, with 0.5 to 1.8 ppm Cl2was compared with that of the standard TPA (Ti-Pd-Au) metallization. Encapsulated (RTV silicone rubber) and unencapsulated triple track conductor test specimens were used. Electrolytic corrosion was studied by biasing the specimens i... View full abstract»

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  • Lead-Indium for Controlled-Collapse Chip Joining

    Publication Year: 1977 , Page(s): 194 - 198
    Cited by:  Papers (13)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1000 KB)  

    Lead-indium for flip-chip solder ("controlled-collapse") connections has been investigated as a possible alternative to the commonly used 5-95 tin-lead. In thermal cycle tests, lead-indium was substantially mote resistant than tin-lead to fatigue resulting from chipsubstrate mismatch. The lead-indium that has been studied most extensively, 50-50 by weight, gives a 3:1 improvement in lifetime over ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope