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Component Parts, IEEE Transactions on

Issue 4 • Date Dec 1964

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Displaying Results 1 - 5 of 5
  • A Single-Sideband, Disk-Wire Type Mechanical Filter

    Publication Year: 1964 , Page(s): 3 - 7
    Cited by:  Papers (9)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (688 KB)  

    A mechanical filter with real frequency transmission zeros on the high-frequency side of the passband has been developed. These points of infinite attenuation are produced through the coupling of alternate disk resonators by short lengths of wire. A procedure for designing this type of filter through use of electrical analogies is discussed in some detail. The amplitude and envelope delay characteristics of a presently manufactured 100 kc/s, single-sideband (SSB) filter being used in broadband carrier systems are described. This filter is one of a set of twelve SSB filters having carrier frequencies ranging from 64 kc/s to 108 kc/s. The use of finite frequency transmission zeros has made possible a 30 per cent reduction in differential delay over conventional constant-K models. View full abstract»

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  • The Q Contour-A Graphical Method for Characterizing Inductors

    Publication Year: 1964 , Page(s): 16 - 24
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (872 KB)  

    A graphical presentation is developed which shows Q an increase in inductance for every inductor in a family on one plot. The basic principle consists of plotting loci of constant Q in inductance-frequency coordinates. Lines of constant increase in inductance, minimum and maximum nominal inductance, and peak Q are also included. Information which conventionally would be scattered in several different places or not presented at all is thus brought together in one display. These plots very effectively present the characteristics of a single family of inductors. However, their most significant advantage is the convenience with which the characteristics of several families can be presented on one sheet for comparison and selection. The inductor designer can use the Q-contour concept to visualize the way in which existing or contemplated families complement each other in the inductance-frequency plane. The equations for the Q contour are derived assuming that an inductor can be represented with a lumped constant equivalent circuit over the frequency range of interest, and that high-frequency winding and dielectric losses are negligible compared to core losses. View full abstract»

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  • Multistate Semiconductors

    Publication Year: 1964 , Page(s): 13 - 15
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (320 KB)  

    Physical phenomena are divided into three pairs of dual phenomena, electrical and magnetic; thermal and optical; compression and shear. Temperature is termed thermal potential, and pressure, compression potential. Corresponding to thermal energy and thermal potential, the existence of thermal charge is postulated equal to their ratio. Formulas and equations are presented for the shift in centers of electrical charge, analogous to the shift of molecules of a medium in thermoelasticity. The theory presented is a mathematical analysis of two- or three-dimensional variable multistate semiconductor crystals or films which pass or block in two or three mutually perpendicular directions, and can interchange pass and nonpass from one dimension to another. In particular, the theory establishes conditions for conduction in one or two of three mutually perpendicular directions. Since the interchangeability may be controlled, the element acts as a relay. In applying the theory, the shifts of charge centers, that is, the electrical strains, are preassigned. Then the stresses can be calculated which are required to produce the preassigned strains. Thus we know what inputs are necessary to achieve preassigned desired outputs. View full abstract»

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  • Some Measurement Techniques for Characterizing Sealed Reed Contact Performance

    Publication Year: 1964 , Page(s): 8 - 12
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (696 KB)  

    The sealed magnetic reed contact offers many possibilities for improved switching performance. As its use is extended into new fields, particularly the area of miniaturization, new forms of tests are needed to characterize its behavior. Some measuring methods pertinent to such characterization are described in this paper. In the field of contact resistance, procedures are indicated for correlating resistance stability with the degree of magnetization applied to a coil surrounding the contact. Also, a procedure for applying magnetic measurements to the sealed units is described which permits accurate estimation of the actual contact forces. A new technique for characterizing the energy-handling ability of the contact is outlined. The method applies the variable stress technique used in many strength of materials studies and more recently in semiconductor device evaluation. As shown by examples, it appears to offer considerable promise for comparing designs, determining reliability, making extended estimates beyond the available data, and identifying and isolating various physical mechanisms that control performance. View full abstract»

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  • Friction Technique for Optimum Thermocompression Bonds

    Publication Year: 1964 , Page(s): 25 - 29
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (688 KB)  

    The successful application of thermocompression lead bonding to semiconductor or thin-film electronic devices depends on the establishment of the associated parameters. The quality of a thermocompression bond is primarily related to the process temperature and bonding force. A technique using the coefficient of friction is presented that both reduces the time necessary for determining optimum parameter values and increases the accuracy of the results. Modem theories of the friction process are used to develop mathematical expressions for shear and tensile bond strengths in terms of friction measurements. A further application of the parameter determination technique concerns the measurement of surface contamination that may affect thermocompression bonding. View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope