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Circuits and Devices Magazine, IEEE

Issue 4 • Date Jul 2002

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Displaying Results 1 - 6 of 6
  • Visual study of rotating electrical machines

    Publication Year: 2002 , Page(s): 3 - 4
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (348 KB)  

    This column explores a Web site describing a set of programs that illustrate various aspects of AC and DC electrical machinery. Some details of the programs are given. View full abstract»

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  • Nanometer mixed-signal system-on-a-chip design

    Publication Year: 2002 , Page(s): 7 - 17
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (491 KB) |  | HTML iconHTML  

    A mixed-signal system-on-a-chip (SoC) design methodology and the supporting CAD tools are presented. A known tools set is identified for illustration purposes and some alternative tools can equally accomplish the task. View full abstract»

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  • Directions for drivers and design

    Publication Year: 2002 , Page(s): 32 - 39
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (497 KB) |  | HTML iconHTML  

    The Design International Technology Working Group for the 2001 International Technology Roadmap for Semiconductors (ITRS) renewal consisted of over 50 international experts. Together, this group developed a new System Drivers chapter in the ITRS, a revised Design chapter, and a number of basic models (clock frequency, layout density, power dissipation, etc.) that define elements of the Overall Roadmap Technology Characteristics (ORTCs). This article excerpts several highlights of these contributions. View full abstract»

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  • Data buses take flight

    Publication Year: 2002 , Page(s): 18 - 31
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (729 KB) |  | HTML iconHTML  

    We discuss feasible design methods for implementing the reliable MIL-STD-1773 data buses that use mature optoelectronic devices. To guarantee reliable data transmission over the data bus, we present three efficient modulation techniques that can be used to reduce the complexity of optical transceivers and the processing time at each receiver, compared with using the modulation scheme recommended by MIL-STD-1773. We will also describe the design of electro-optic active couplers for AFO data buses and present the design consideration of AFO transmitters and a wavelength-division-multiplexing scheme. View full abstract»

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  • Addressing packaging challenges

    Publication Year: 2002 , Page(s): 40 - 49
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (997 KB) |  | HTML iconHTML  

    To meet the emerging near-term and long-term packaging challenges, the electronics industry must begin to increase spending on packaging research and technology development. In the short-term the industry shift to manufacturing outsourcing (combined with decreased profitability in many electronics sectors) has driven a decrease in packaging research. The market forces will correct this trend as the impact of increasing package cost and the limits of packaging technology start to constrain industry growth. However, a short-term gap will develop in broad-based industry packaging capability for emerging technologies and new applications. This gap will create an opportunity for significant competitive advantage through packaging for those companies that increase their focus on packaging development today. View full abstract»

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  • Is there light at the end of the road for optical lithography?

    Publication Year: 2002 , Page(s): 50 - 58
    Cited by:  Papers (4)
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (2146 KB) |  | HTML iconHTML  

    As optical lithography nears its physical limits, this article discusses the 2001 ITRS update to the lithography roadmap and reviews the possible next-generation lithography technologies outlined in that update. View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org