2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of

Aggressive research on terabit per second networks has led to dramatic improvements in network transmission speeds. One result of these improvements has been to put pressure on router technology to keep pace. There is more urgent need to research and study terabit (1012 bit) router. Traditional routes using shared-bus and central processing unit cannot do it. So how to support the terab... View full abstract»

This paper addressed the question whether there is an environmental advantage of using DECT phones instead of GSM phones in offices. The paper also addresses the environmental compatibility of Electrochemical Pattern Replication (ECPR) compared to classical photolithography based microscale metallization (CL) for pattern transfer. Both environmental assessments consider electricity consumption and... View full abstract»

The European Community has been finalized to phase out on July 1,2006 for Lead(Pb) in electronic products. This cause the semiconductor industry is required to study new materials for replace the lead in its products. This paper presents the manufacturability and reliability study of the commercial lead-free alternatives to replace the currently used solder plating. This paper presents the finding... View full abstract»

Due to the fast pace of technological innovation, and the consequent shortening lifetimes of electronic products, particularly ICT equipment, a,flexible semi-automatic disassembling cell "Σ! 1592 - Disassembly Factory" for extracting components from printed wire boards (PWB) has been developed. Based on these disassembling experiences design criteria for a re-use optimized structure of PWBs ... View full abstract»

Green material requirement, i.e., lead-free and halogen-free, recently became a hot topic in IC packaging due to the environmental issues in increasing lead contamination and ozone concern in landfill and decomposition. The critical component on tape ball grid array (TBGA) reliability is heatsink adhesive which will be evaluated for the green material requirements to meet JEDEC moisture sensitivit... View full abstract»

This paper describes the application of EcoDesign (environmentally conscious design) within the electronics manufacturing company Philips. How the process has matured from a case-by-case basis driven by single persons to becoming a standard part of the product creation process of most of the Philips' business units. Since it was first introduced, the EcoDesign process has gone through many changes... View full abstract»

In this report, a preliminary investigation has been conducted on some lead free solder pastes containing Sn88Ag3.5Bi0.5In8 alloy. The wetting performances of these solder pastes on different substrates were studied under various reflow profiles. The test results of solder ball, slump and printing properties indicate that with a proper paste flux vehicle, lead free solder paste using Sn88Ag3.5Bi0.... View full abstract»

The adoption of lead-free interconnection materials and other environmentally friendly materials is causing a number of concerns for electronic package manufacturers. In this paper the methodology and results of using computer modelling to study the reliability of flip chips with lead-free solder, anisotropic conductive adhesive films and isotropic adhesives interconnects are discussed. It is show... View full abstract»

For the most recent developed BGA components, such as flip chip BGAs and wafer level CSPs (WLCSP), all are required to have reliability tests conducted before being launched into mass production. Among the mechanical stress tests for electronic components, the most commonly seen are vibration tests, bend tests and shock tests. Rarely seen is the shear test for an electronic component with solder b... View full abstract»

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders (Sn-3.5 wt.% Ag and pure Sn) in terms of solder deposition method (electroplating, solder paste and solder preform) and P content in Ni-P layer (4.6, 9, and 13 wt.% P). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2min reflow at 250 °C while IMCs adhered to the N... View full abstract»

Transferring life cycle thinking into business practice requires applicable assessment tools and management approaches. Different methods from screening eco design tools to full Life Cycle Assessment have been developed for fostering environmentally compatible electronics design. Life Cycle Assessment still deals with many obstacles, limiting its integration into electronics design workflows. The ... View full abstract»

We demonstrated the applicability of dry film photoresists (DFR) in photolithography process for fine pitch bumping on the polytetrafluoroethylene (PTFE/Teflon®) printed circuit board (PCB). The copper lines were formed with 100μm width and 18μm thickness on the PTFE test board, and varying the gaps between two copper lines in a range of 100-200μm. The DFRs of 15μm thickness were l... View full abstract»

Many electrical appliances are required to operate in standby or 'ready' mode when not in use. This allows instant availability for the end user often activated by a remotely controlled device. Recently, the environmental impact of energy consumed by electrical devices in the standby mode has attracted the attention of governments and environmentalists alike. This paper discusses the environmental... View full abstract»

At first a short outline is given on how certain technology and product developments in the electronics industry are influencing social life, markets and the environment simultaneously in a positive and negative way, depending on the perspective we take. It will be shown for instance that an increase in efficiency (energy or resources) of a single product is misleading and that efficiency has to b... View full abstract»

During the 1990s electronics has assumed the role of providing a forceful leverage to the socio-economic and technological growth of developing society. The initial thinking that the IT & electronics manufacturing activities, involving high technologies would be clean and free from pollution problems, is no more valid today. As the electronics industry rapidly expanded it became evident that the d... View full abstract»

At HP, we believe that environmentally sustainable development is not an option, but an imperative. HP works toward a sustainable future by developing programs that reduce our environmental footprint, as well as those of our customers and partners. Our vision is to develop products and solutions, and operate our company in such a way, that we are able to lead global businesses toward a sustainable... View full abstract»

Pb-free solders will replace traditional Sn-Pb solders to correspond with the green-packaging strategy. In this paper, a 2D model was presented to study the electromigration (EM) in Pb-free solder joints (Sn-Ag-Cu). Some geometry patterns of Cu thin films were designed and interconnected with Pb-free solder joints. The current density distribution in the special geometry pattern interconnect was a... View full abstract»

In this paper, the effects of the solder reflow process on the reliability of anisotropic conductive film (ACF) interconnections for flip chip on flex (FCOF) applications are investigated. Experiments as well as computer modeling methods have been used. In the experiments, it was found that the contact resistance of ACF joints increased after the subsequent reflow process, and the magnitude of thi... View full abstract»

The direct writing of conductive copper lines on alumina substrates by means of a Nd/YAG-laser was investigated as an alternative to established thick-film and thin-film hybrid technology. Copper powder in the low micrometer range was sprayed as an aqueous dispersion on the surface of alumina substrates normally used for thick-film hybrids. With proper setting of the laser parameters, conductor li... View full abstract»

For the End-of-Life treatment of electronic products the option of reusing electronic parts and boards are of high interest. Among the reasons for doing this are not only legal regulations, but also economical and environmentally motivated reasons. The economic point of view covers advantages as well as limits which are in most cases related to the quality of the worked-off parts. This paper prese... View full abstract»

Alloys of lead-tin system are the most common solder alloys used today. However, there are environmental and health issues concerning the toxicity of lead present in these lead-tin solder alloys. Also the flux residue removal is mandatory and leads to environment threats. More important, the use of flux may contaminate the optically active surface by organic residue leftover, and a conventional cl... View full abstract»

Continuous and rapid technological advancement has dramatically improved the way we live. It also means that electronic products are being discarded faster than ever before. The increasing amount of electronic trash is definitely a growing pollution problem as more electronics join the league of waste stream in coming years. With every printing products sold, many more ink cartridges are produced.... View full abstract»

As lead-free solders replace tin-lead solders in soldering, it is also expected that lead-free solder alloys will be used as contact finish materials for electrical contacts. In this study, the contact resistance and fretting corrosion of tin-silver-copper and tin-copper coatings were investigated and compared with tin-lead eutectic coating. The contact resistance before after different aging cond... View full abstract»