Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium,

25-27 Sept. 1989

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  • Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium. Proceedings 1989 (Cat. No.89CH2720-1)

    Publication Year: 1989
    Request permission for commercial reuse | PDF file iconPDF (107 KB)
    Freely Available from IEEE
  • Managing manufacturing performance

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (33 KB)

    Summary form only given. Participative and performance management, employee involvement, educational upgrades, and organizational redesign are several strategies being employed by Harris Semiconductor to address the 'humanware' side of the equation. Manufacturing technology, with emphasis on tools such as statistics, just-in-time, and computer-aided manufacturing, is equally applied on the 'hardwa... View full abstract»

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  • Fluoropolymer composite multichip modules

    Publication Year: 1989
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (199 KB)

    Summary form only given. Consideration is given to an additive copper/polyimide process for manufacture of multichip modules and other advanced circuitry. This process allows efficient routing of most MCM (multichip module) designs, low-resistance copper conductors, and solid copper thermal vias for heat removal. It also allows large substrates (4*4 in. and greater) to be manufactured. Fluoropolym... View full abstract»

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  • Mass production back-grinding/wafer-thinning technology for GaAs devices

    Publication Year: 1989, Page(s):209 - 213
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (543 KB)

    A mass-production back-grinding technology that is applicable to a fully automatic wafer-thinning process in GaAs device manufacturing is described. Excellent productivity has been realized because the brittleness of GaAs has been overcome. A mirrorlike, stress-free surface was obtained by utilizing the wafer-rotating downfeed grinding method with slight chemical etching. The thickness of the defo... View full abstract»

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  • Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

    Publication Year: 1989
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (124 KB)

    Summary form only given. A number of plastic encapsulated devices in the as-received condition were screened and documented using SLAM (scanning laser acoustic microscopy). Those parts containing flaws were then examined using a C-SAM (C-mode scanning acoustic microscope) to characterize the type of flaw and depth of the defect. Several of the defect-free parts were also evaluated on the C-SAM to ... View full abstract»

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  • Enhanced high speed performance from HDI thin film multichip modules

    Publication Year: 1989
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (114 KB)

    Summary form only given. A novel packaging technology, ideal for CMOS multichip modules, is described. Thin-film metal and polymer dielectric are used to fabricate five aluminum metal layer structures with 25- mu m-wide, 5- mu m-thick traces, and 11- mu m-thick dielectric layers. The polyimide has a dielectric constant of 3.4 and a dissipation factor of 0.003. A proprietary process is used to gene... View full abstract»

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  • Electronic system packaging: the search for manufacturing the optimum in a sea of constraints

    Publication Year: 1989, Page(s):149 - 164
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1068 KB)

    The author details some of the constraints on electronic system design and manufacturing that affect system performance, reliability, materials selection, and the assembly of the product. The electronic constraints include chip crossing delay, fanout (number of receivers on a driven net), crosstalk (unwanted electromagnetic coupling between independent signal lines and power supplies), DC voltage ... View full abstract»

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  • Academia linking with industry-the RPI model

    Publication Year: 1989, Page(s):207 - 208
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (200 KB)

    Rensselaer Polytechnic Institute's efforts to forge links with industry are discussed. These links include industrially sponsored research and development projects, as well as encouraging new start-up companies through an Incubator program and the development of the Rensselaer Technology Park for more mature companies. Companies wishing to support R&D programs do so primarily through the activ... View full abstract»

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  • Maglev microrobotics: an approach toward highly integrated small-scale manufacturing systems

    Publication Year: 1989, Page(s):273 - 276
    Cited by:  Papers (8)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    It is noted that current industrial robots are poorly suited to many of the payload, precision, and integration requirements of the semiconductor industry. A general mechanical technology, based on magnetically levitated microrobots, that may be better matched to semiconductor manufacturing needs is described. Magnetic levitation has favorable downward scaling laws and can be used to build multipl... View full abstract»

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  • A study of the roles of consultants in facilitating theassembly manufacturing flow among segments of the US semiconductor and electronics industries

    Publication Year: 1989, Page(s):133 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1040 KB)

    Three separate research approaches were utilized to study technology, markets, and business factors underlying current and future demand for consulting services in packaging and assembly. This research included a literature search, an expert opinion survey, and a series of case studies of consulting practices. Findings of the individual studies were compared and combined to develop conclusions abo... View full abstract»

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  • IMSEI: a graduate education, research, and technology transfer program in integrated manufacturing systems supported by a university/industry consortium

    Publication Year: 1989, Page(s):203 - 206
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    A cooperative industry/university graduate education research, and technology transfer program in computer integrated manufacturing systems at North Carolina State University is described. Administrated through the Integrated Manufacturing Systems Engineering Institute (IMSEI), the program draws its resources from six academic departments in the College of Engineering and a consortium of industria... View full abstract»

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  • Knowledge based control of adhesive dispensing for surface mount device assembly

    Publication Year: 1989, Page(s):267 - 272
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    The results to date of a project using knowledge-based control techniques to resolve the problems encountered in the dispensing of the very viscous adhesives used to secure mounted components to mixed technology circuit boards before wave soldering are given. The work has two major thrusts, the accommodation of process variability with a rule-based system that controls a manufacturing cell and the... View full abstract»

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  • Using process dissection to achieve design for manufacturability for electronic assemblies

    Publication Year: 1989, Page(s):126 - 128
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (164 KB)

    A DFM (design for manufacturability) concept called PPM dissection that uses the assembly defect rates in p.p.m.'s from measurements of variables controllable in the design phase is described. The material presented is on a most basic level, i.e. without the extensive equations and algorithms that make it work. A simple example is presented View full abstract»

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  • Evolution of integrated manufacturing in the 1980s

    Publication Year: 1989, Page(s):251 - 256
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (640 KB)

    The ways in which electronic manufacturing businesses have used specific elements of CIM (computer-integrated manufacturing) to their competitive advantage are described. Three GE operations are used as examples of modernization projects that utilized CIM technologies that were appropriate for the situation and the time. In all of these cases, a phased approach to CIM implementation was employed. ... View full abstract»

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  • Analyzing the mechanical strength of SMT attached solder joints

    Publication Year: 1989, Page(s):61 - 69
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (468 KB)

    Analytic approaches to the pull strength and shear strength of SMT (surface mount technology) attached solder joints have been studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages correlated with the experimentally measured data quite well. Lead/pad design is shown to have the most significant impact on the solder joint strength. The design rules for bu... View full abstract»

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  • Teaching, research and service in manufacturing at NJIT

    Publication Year: 1989, Page(s):188 - 202
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (948 KB)

    Manufacturing and engineering education activities at the New Jersey Institute of Technology (NJIT) are described. The primary objective of these activities is to prepare students to meet the challenge of the development and effective utilization of integrated information-driven manufacturing systems. Thus, the core of the program curricula consists of courses dealing with problems and methods of ... View full abstract»

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  • Using coarse/fine manipulation with vision to place fine pitch SMD components

    Publication Year: 1989, Page(s):262 - 266
    Cited by:  Papers (3)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (428 KB)

    An experimental system that can accurately align and place SMDs (surface mount devices) on a printed circuit board is described. Features of the system are fine positioning and endpoint sensing after an IBM 7576 robot coarsely aligns the SMD to its target. Fine positioning is done using a customer-designed micropositioning device. The endpoint sensor is a single camera vision system that by image ... View full abstract»

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  • Nondestructive evaluation of TAB bonds by acoustic microscopy

    Publication Year: 1989, Page(s):330 - 331
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (96 KB)

    A matrix of TAB (tape automated bonding) inner and outer lead devices with a built-in range of quality was investigated. Each bond interface was documented acoustically and then pull-tested to develop a database upon which to formulate a specific test method. Data demonstrate excellent correlation between the degree of bonding and correlative pull tests (destructive) when artifacts of the pull tes... View full abstract»

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  • Heat seal connectors: a new high density SMT interconnection system

    Publication Year: 1989, Page(s):121 - 125
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (364 KB)

    Most conventional electronic products use liquid-crystal displays (LCDs) to display information. The introduction of the heat seal connector, which uses a conductive adhesive system as the bridge to connect the board substrate and the LCD, has been shown to result in an order of magnitude reduction in size with a corresponding increase in reliability while reducing overall product cost as compared... View full abstract»

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  • Dynamic behavior of SMT chip capacitors during solder reflow

    Publication Year: 1989, Page(s):23 - 29
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (604 KB)

    A dynamic model of a SMT (surface mount technology) type 1206 chip capacitor is developed. The model is used to determine the effects of pad geometry, chip metallization and dimensions, amount of solder, and chip displacement on the ability of the chip to lift (tombstone) and to self-align itself during solder reflow. Both static and dynamic characterizations are shown. The model simulations show ... View full abstract»

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  • Recent developments in silicon hybrid multi-chip modules

    Publication Year: 1989, Page(s):111 - 117
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (548 KB)

    The author describes the Research Initiative Silicon Hybrids (RISH) programme, established in September, 1986, to investigate all aspects of silicon in multichip module applications. A series of test vehicles has been fabricated to demonstrate the merits for real circuit applications. The author summarizes the merits of silicon as a multichip module substrate and considers, in detail, the specific... View full abstract»

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  • Electron beam direct writing technology for printed wiring board

    Publication Year: 1989, Page(s):246 - 250
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    An electron-beam lithography system has been developed which can write electric circuit patterns directly on printed wiring boards from computer-aided design data without making the master and working film masks which are necessary for conventional photolithography. The electron beam is focused to 34 μm in diameter at an accelerating voltage of 60 kV. The sensitivity of an electrodeposited phot... View full abstract»

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  • Effect of heat and moisture on thick positive photoresist

    Publication Year: 1989, Page(s):310 - 313
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (828 KB)

    A Novolac resin AZ 4903 for lithographic evaluation is discussed from the standpoint of moisture and heat effects. Differential gravimetric and thermogravimetric analyses (DTG and TGA) were used for investigating the chemical changes of the photoresist associated with heat. The variations of moisture (humidity levels) were used to evaluate the hydrolyzation of the photoresist. The hydrolyzation wa... View full abstract»

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  • Kinetic interactions of copper, lead and tin on solder coated PC boards studied using X-ray diffraction

    Publication Year: 1989, Page(s):294 - 299
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (388 KB)

    X-ray diffraction has been used to monitor the growth and decay of the constituent phases existing in solder (60% Sn-40% Pb) coated Cu printed circuit boards. Samples were aged from 145°C to 175°C for times sufficient to allow the Cu3Sn intermetallic phase X-ray peak count rate to exceed that for the Cu6Sn5 phase. Activation energies have been determined fo... View full abstract»

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  • A real time data acquisition and monitor system for integrated circuit visual inspection

    Publication Year: 1989, Page(s):88 - 95
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (636 KB)

    The design and implementation of a system used for real-time acquisition and monitoring of data collected at an IC manufacturing process are described. How it is used for process improvement and control is discussed. The approach taken to solve this problem can be divided into three functional areas: acquisition, monitor, and integration. The data acquisition task utilizes a touch screen terminal ... View full abstract»

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