24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)

5-9 May 2001

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  • 24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)

    Publication Year: 2001
    Request permission for commercial reuse | PDF file iconPDF (342 KB)
    Freely Available from IEEE
  • Ink jet print head producing simulation and methods

    Publication Year: 2001
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (49 KB)

    Summary form only given. The process for manufacturing a thin film resistor substrate is useful in fabricating an ink jet print head, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. Thermal ink jet print heads play a dominant role in drop-on-demand print head technology. Improvements of efficiency and lifetime are an ongoing challeng... View full abstract»

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  • List of authors

    Publication Year: 2001, Page(s):0_12 - 0_11
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    Freely Available from IEEE
  • Ions impurities and their influence on exploitation parameters of conductive adhesive joints

    Publication Year: 2001, Page(s):47 - 50
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (284 KB) | HTML iconHTML

    Electrically conductive adhesives have been identified as an environmentally friendly alternative to tin/lead solders in electronic packaging applications. Unstable contact resistance on nonnoble metals and poor impact performance are the main limitations of this new technology. One reason for unstable contact resistance can be electrochemical migration. This problem is particularly important for ... View full abstract»

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  • Relationships among properties of sputtered thin films and sputtering process parameters

    Publication Year: 2001, Page(s):42 - 46
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB) | HTML iconHTML

    This paper focuses on the investigation of the influence of process parameters (pressure, applied power, sputtering time) during the radio frequency magnetron sputtering of nickel, aluminum and combined aluminum-silicon on properties of thin films. The experiments were carried out on the BALZERS PLS 160 radio frequency magnetron sputtering unit, using an argon atmosphere. The sheet resistance and ... View full abstract»

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  • Influence of plasma treatment on the improvement of surface energy [packaging]

    Publication Year: 2001, Page(s):37 - 41
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (332 KB) | HTML iconHTML

    Surface treatment is increasingly important in electronic packaging. Reasons for this development are increasing demands on the reliability of component packaging and the application of different materials with either high-energy or low-energy surfaces. High-energy materials include metals, metal oxides and inorganic compounds. Low-energy materials include organic materials and water. The surface ... View full abstract»

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  • An investigation of thick-film resistor, fired at different temperatures, for strain sensors

    Publication Year: 2001, Page(s):32 - 36
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (508 KB) | HTML iconHTML

    Some commercial 10 kΩ/sq. thick-film resistors based on RuO 2, ruthenates or a mixture of RuO2 and ruthenates, were evaluated for strain gauge applications. The resistors were fired at different temperatures to determine the influence of firing temperature on the electrical characteristics. The conductive phase in the resistors was determined with X-ray powder-diffracti... View full abstract»

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  • Machine and process capability coefficient of solder paste printers

    Publication Year: 2001, Page(s):26 - 31
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (348 KB) | HTML iconHTML

    For manufacturers of assembled boards seeking ISO 9000 certification, a number of requirements are placed on measurement instruments and tooling. This standard requires a system to document and maintain calibration and machine capabilities. One of these problems is the measurement of printing accuracies of solder paste printers. The paper presents: short theoretical overview of machine capabilitie... View full abstract»

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  • Conductive adhesive-an alternative to solder in SMT

    Publication Year: 2001, Page(s):20 - 25
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB) | HTML iconHTML

    Isotropic conductive adhesives (ICAs) provide an environmentally friendly alternative to solders for interconnections in electronic applications with advantages of low processing temperature and an improved fine pitch capability. However, unstable electrical conductivity under elevated temperature and humidity conditions, and low interconnect impact resistance were major obstacles preventing ICAs ... View full abstract»

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  • Embedded passive components for MCM

    Publication Year: 2001, Page(s):73 - 77
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB) | HTML iconHTML

    MCMs often have a large number of passive components connected to a small number of active devices. Integration of passive components into the MCM substrate improves electrical properties and reliability, and also reduces the cost, size and weight of electronic systems. The embedded components are mostly used in MCM-D (thin film) and MCM-C (thick film) modules. The use of embedded elements for MCM... View full abstract»

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  • New flip-chip assembly system for prototyping and process investigations

    Publication Year: 2001, Page(s):68 - 72
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB) | HTML iconHTML

    The flip-chip assembly technology and a new laboratory stand for investigation of FC bonding processes are presented. The prototype system was developed by Division of Precision and Electronic Product Technology in Institute of Precision and Biomedical Engineering of Warsaw University of Technology, in cooperation with Tele and Radio Research Institute in Warsaw. The new ideas of the system consis... View full abstract»

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  • Pilot implementation of a web-based microelectronics laboratory within EDIT Distance Learning Network

    Publication Year: 2001, Page(s):18 - 19
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB) | HTML iconHTML

    The paper describes the way of implementing online laboratory work using a web-based approach. This pilot implementation was done within the EDIT Distance Learning Network using the asynchronous and synchronous facilities of the LOTUS learning space 4.01 distance learning environment View full abstract»

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  • Data acquisition system for noise measurement on magnetic sensors

    Publication Year: 2001, Page(s):258 - 262
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB) | HTML iconHTML

    In this paper, we describe a principle of noise induction by varying the amplitude of a magnetic field in which we operate four magnetoresistors (sensors). In accordance with this principle, we achieve an acquisition system used to collect all necessary information for noise measurement on magnetic sensors. The magnetic field used in measurements can be modified by varying both its orientation and... View full abstract»

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  • Optimization of inspection strategies by use of quality cost models and SPC

    Publication Year: 2001, Page(s):293 - 297
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB) | HTML iconHTML

    The main goals of quality management are customer satisfaction by delivery of defect free products, and radical reduction of defect rates and quality costs in production. Controlled processes are the most important way to reach these goals. In electronics production, the processes are complex and are subject to many strong environmental influences, especially for production of small batches of ass... View full abstract»

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  • The computer aided design concept in the concurrent engineering context

    Publication Year: 2001, Page(s):97 - 101
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (384 KB) | HTML iconHTML

    Modern design concepts are focused on the product life-cycle, such that all the aspects of designed systems and their corresponding dependencies are considered. These conditions are fulfilled by the concurrent engineering (CE) approach, which creates a new context for design and management according to which the life-cycle design is performed by functional and disciplinary heterogeneous teams. Thi... View full abstract»

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  • Potentiality of LTCC for sensor applications

    Publication Year: 2001, Page(s):112 - 116
    Cited by:  Papers (2)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB) | HTML iconHTML

    The potential of low temperature cofired ceramic (LTCC) multilayer technology allows realization of different structures for sensor applications. Examples of sensors realised at the Department of Hybrid Microelectronics in the Faculty of Electrical Engineering and Informatics at the Technical University in Kosice have shown the potential and development possibilities of LTCC for a wide field of th... View full abstract»

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  • Methodology of estimate reliability of highly reliable components by monitoring performance degradation

    Publication Year: 2001, Page(s):125 - 128
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (236 KB) | HTML iconHTML

    Degradation analysis is an important method of assessing the reliability of highly reliable components and especially microsystems. Its application constantly increases due to the continuous efforts to produce increasingly reliable electronic products. The presented methodology is an effective way to estimate the component's reliability by monitoring performance degradation. The main advantage is ... View full abstract»

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  • An analogue behavioral macromodel construction

    Publication Year: 2001, Page(s):146 - 149
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (284 KB) | HTML iconHTML

    An analogue network macromodeling technique oriented towards functional-level simulation of analogue networks is presented. A class of nonlinear building blocks is introduced for macromodeling. The proposed macromodeling technique is accurate in terms of timing behavior and computationally efficient. An explicit algorithm to obtain the waveforms is used based on controlled sources and analog behav... View full abstract»

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  • Rework of flip-chip populated PCBs by laser desoldering

    Publication Year: 2001, Page(s):63 - 67
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB) | HTML iconHTML

    New packaging concepts for electronic components and assemblies are an essential base for continuing miniaturization. The successful use of flip-chip, chip scale packages and microball grid arrays depends on the availability of suitable rework techniques to minimize refuse by replacing defective components. Laser desoldering of flip chips is a promising precisely controllable alternative to standa... View full abstract»

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  • Advanced team work education within the concurrent engineering paradigm

    Publication Year: 2001, Page(s):13 - 17
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (444 KB) | HTML iconHTML

    Development of a large perspective for the e-global economy requires a new approach for learning and training processes. Corporate and governmental organizations are significantly shifting their strategies from hierarchical work structures, creating departmental layers, toward team-based flat organizations. These human centered holons may cut across responsibilities. Large transnational companies ... View full abstract»

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  • Laser via formation in flexible substrates for high density electronic assembly

    Publication Year: 2001, Page(s):163 - 166
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (404 KB) | HTML iconHTML

    This paper deals with the technology of double sided, high density printed circuit boards, based on advanced flexible materials, created especially for the interposer (the substrate element) of chip scale packages. The new technology requires new methods for the realization of via holes. These via holes are realized by laser drilling. The required laser drilling process and technology is under dev... View full abstract»

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  • Electronic module for small hydroelectric power plant

    Publication Year: 2001, Page(s):183 - 185
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (220 KB) | HTML iconHTML

    Modern automation control systems of small hydroelectric power plants provide a constant frequency on the network. This regularization is achieved through positioning of the hydraulic director device that controls both water flow and electric machine speed. In order to control positioning of the director device, a high performance electro-hydraulic system is used. It contains a hydraulic cylinder,... View full abstract»

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  • Education of the computer aided design

    Publication Year: 2001, Page(s):220 - 224
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB) | HTML iconHTML

    Circuit module design is one of the most important topics in electronic education. During their study, students have to design, simulate, realize and document a functional circuit. The education includes lectures and laboratory exercises. On the lectures, the students are acquainted with the design rules and the use of OrCAD software. The lecturer uses a PC-projector for the PowerPoint show and fo... View full abstract»

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  • DC and AC electrical properties and long-term stability of LTCC resistors

    Publication Year: 2001, Page(s):137 - 141
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB) | HTML iconHTML

    Interesting problems occur due to mutual dependencies between various DC and AC electrical properties as well as with correlation between electrical characteristics and long-term stability of electronic components. This paper presents wide and systematic investigations of electrical and stability properties of buried and surface low temperature co-fired ceramics (LTCC) resistors. Various resistors... View full abstract»

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  • A method of noise reduction in data acquisition systems from sensors

    Publication Year: 2001, Page(s):253 - 257
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB) | HTML iconHTML

    In this paper, we descibe a noise reduction technique for noise which appears at an instrumentation amplifier input. We use a square-wave signal with frequency fc=5 kHz modulated with the signal from the sensor (input signal). The modulated signal is applied at the instrumentation amplifier and then the amplified signal is modulated again with the same signal type (square-wave signal wi... View full abstract»

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