4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)

18-21 June 2000

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  • 4/sub th/ International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing [front matter]

    Publication Year: 2000, Page(s):i - ix
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    Freely Available from IEEE
  • Conference Author Index

    Publication Year: 2000, Page(s):x - xii
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    Freely Available from IEEE
  • Development of high-density interconnection techniques for contactless smart cards

    Publication Year: 2000
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (53 KB)

    Summary form only given. This paper deals with techniques that are used for fabricating high density and thin assemblies with emphasis on materials, implementation and reliability. Moreover, a new potential interconnection and packaging technique being particularly suitable for contacting ultra-thin chips is also introduced. In the production tests electroless fine-pitch Ni/Au bumped chips were bo... View full abstract»

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  • Modeling of branched crosslinked composites, using the statistical polymer method

    Publication Year: 2000
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (61 KB)

    Summary form only given. The problem of modeling of branched cross-linked structures is one of most complicated in composite science. Most existing composite materials have branched cross-linked structure, and their theoretical study is indispensable for their optimal application in practical needs. Conventional methods of description of branched cross-linked structures are numerical and do not al... View full abstract»

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  • The evaluation of anisotropically conductive film for use in portable electronic products

    Publication Year: 2000
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (49 KB)

    Summary form only given, as follows. The use of anisotropically conductive film as an interconnect method for direct flip chip attach and for flex to glass offers many benefits to both product designers and SMT assembly engineers. However, as the technology in is relatively new, data on both processing conditions and field performance is limited. This paper is divided into two sections. Firstly, t... View full abstract»

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  • Mechanics of polymer/metal interfaces in microelectronic packaging

    Publication Year: 2000
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (39 KB)

    Summary form only given, as follows. The loss of interfacial adhesion is mostly seen in the failure of adhesive joints. The interfacial adhesion strength is believed to highly depend on a number of parameters, such as surface topology and treatment, adhesive chemistry/structure, rheological properties of the solids, and elastic mismatch across the interface. Thermal mismatch between polymer adhesi... View full abstract»

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  • Processing and performance of high density interconnect (HDI) PWB with laser microvias

    Publication Year: 2000, Page(s):274 - 279
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (773 KB)

    Why do we need to supply microvias? New components, such as thin small outline packages (TSOPs), chip size packages (CSPs) and direct chip attachment (DCA) are forcing designers to create new layouts which challenge the fabricator to manufacture printed wiring boards (PWBs) with higher packaging densities, finer lines, smaller holes and blind vias to accommodate more functions on the interconnect ... View full abstract»

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  • A novel IMB technology for integrating active and passive components

    Publication Year: 2000, Page(s):269 - 273
    Cited by:  Papers (11)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (748 KB)

    In this study a novel integrated module board (IMB) technology which is used for integrating both active and passive components into ultra-high density printed wiring boards is presented. This non-vacuum and solderless technology is based on a photodefinable epoxy and fully additive electroless plating process. Conductive metals such as copper and nickel are chemically deposited onto photodefined ... View full abstract»

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  • One-part fast cure chipbonder epoxy adhesives for electronic applications

    Publication Year: 2000, Page(s):107 - 109
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (180 KB)

    One part epoxy adhesives are known for their versatility in applications including electronics. They generally give outstanding adhesion to a wider range of substrates, very high bond strength and have excellent electrical properties and resistance to soldering. At the same time, one-part epoxy adhesives still have several limitations for electronic applications related to the long-continued curin... View full abstract»

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  • Advanced substrates for wireless terminals

    Publication Year: 2000, Page(s):264 - 268
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    It has been estimated recently that within few years there will be more wireless terminals connected to the Internet and related services than there will be fixed equipment (desktop PCs, etc.). This means that the portable equipment needs high performance and high functionality combined with small size and low energy consumption, all this at low cost. Inevitably, very high packaging efficiency is ... View full abstract»

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  • Characterization of thin layers in microelectronic packaging using acoustic microscopy

    Publication Year: 2000, Page(s):225 - 231
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    Some of the transducer and image related issues involved in characterizing thin layers in microelectronic packaging are discussed here. Specifically, the cases of Parylene N on stainless steel and thinned silicon wafers are described. For the case of the Parylene coating, it is shown how a thin layer can distort the pulse reflected from the interface to the extent that a well bonded coating appear... View full abstract»

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  • Reliability of ACF in flip-chip with various bump heights

    Publication Year: 2000, Page(s):101 - 106
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    Anisotropic Conductive Film (ACF) is being widely used in flip-chip (FC) technology because of its fine pitch characteristic and can also serve as an environmentally friendly joining material. The bumps of the FC are usually made from nickel. Since pressure is applied to force the conductive particles to make a contact between the nickel bumps and the copper pads in printed circuit boards (PCB) or... View full abstract»

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  • Thematic network adhesives in electronics-smart card roadmap

    Publication Year: 2000, Page(s):310 - 319
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (740 KB)

    Discusses interconnection technologies for standard IC and additional components: used adhesives for mechanical and electrical interconnection. The aim of this roadmap survey is to find the important technology issues. It is planned to define future material needs upon the results of the roadmap View full abstract»

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  • Effect of cure temperature on impact resistance of conductive adhesives

    Publication Year: 2000, Page(s):221 - 224
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (436 KB)

    The experiments described look at the impact resistance of conductive adhesives. A standard drop test from 5 feet was used to test the adhesives. The goal of the experiments was to determine whether the adhesives successfully passed these tests. The effects of cure temperature on the mechanical bond of the adhesive are discussed as well. The focus of the results is on the effect of cure temperatur... View full abstract»

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  • Reliability of flip chip die attach in multichip mechatronic power module

    Publication Year: 2000, Page(s):93 - 100
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    Motorola's Interconnect Systems Laboratory in Munich has developed the assembly technology for a mechatronic multichip power module, a new intelligent connector for automotive applications. Product's requirements for simultaneous high power dissipation, current carrying and device interconnecting capability lead to selection of insulated metal substrate (IMS) as a substrate technology and electrop... View full abstract»

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  • A build-up substrate utilizing a new via fill technology by electroplating

    Publication Year: 2000, Page(s):280 - 288
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    A build-up substrate consisting of PPE resin (poly-phenylene ether) was developed to mount high pin count flip chips. It is essential to achieve high density patterns with controlled characteristic impedance for MPU packages and telecommunication devices. Via fill technology by electroplating incorporated with new via designs is effective for this application. Stacked via design and the technology... View full abstract»

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  • Advanced environmental friendly materials for HDI applications

    Publication Year: 2000, Page(s):296 - 303
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (492 KB)

    In reflection of increased environmental consciousness the world over, consideration toward the environment is becoming essential even in the case of electric/electronic equipment. In printed wiring board (PWB) materials brominated flame-retardants are used, and as a result there is concern that dioxin may be generated during combustion. We tackled the development of new flame-retarding method, an... View full abstract»

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  • Roadmap “Adhesives Technologies in Automotive and Harsh Environment Applications”

    Publication Year: 2000, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB)

    Within the European Thematic Network “Adhesives in Electronics” a Roadmap has been prepared to establish the present status of adhesive use in automotive electronics and to find out the most important requirements for the future. Presently non and isotropically conductive adhesives are used for die bonding and underfills for solder flip chip processes. The biggest challenge for automot... View full abstract»

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  • Industrial approach of a flip-chip method using the stud-bumps with a non-conductive paste

    Publication Year: 2000, Page(s):205 - 211
    Cited by:  Papers (13)  |  Patents (21)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1340 KB)

    As the use of lead in electronics will not be possible any more in the coming years, research institutes and packaging industries are focusing on alternative materials for flip-chip assembly. Various conductive and non-conductive adhesives have been developed in recent years: today, they are mature enough and are excellent candidates to be implemented in a wide range of lead-free flip-chip applica... View full abstract»

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  • Assembly of ultra thin and flexible ICs

    Publication Year: 2000, Page(s):20 - 23
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    The Fraunhofer Institute for Reliability and Microintegration in Munich has developed a process for manufacturing ultra thin ICs with a thickness down to 10 μm. These very thin ICs offer several advantages like low package height, flexibility and low topography for interconnection. These properties make them an ideal candidate for their integration in flexible substrates like polymer foil or ev... View full abstract»

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  • Modelling of ICA creep properties

    Publication Year: 2000, Page(s):194 - 198
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (372 KB)

    Flip chip bonding with isotropically conducting adhesives is gaining in popularity since it can simplify and reduce the cost of the interconnecting process. To effectively estimate the reliability of ICA flip chip joints, one needs to model the viscoelastic behaviour of the adhesives. Creep is an important property because it enables stress relaxation through non-recoverable strain. Ignoring ICA c... View full abstract»

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  • Correlation of single lap joint strength, and deformation with joint resistance, surface, and cure conditions

    Publication Year: 2000, Page(s):254 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (828 KB)

    For achieving a reliable adhesive bond, the adhesive must properly wet the surface asperities on the adherend before any other physical or chemical phenomena can take place. The physical phenomenon of mechanical interlocking is related to the surface morphology of the adherend. Generally, a rough surface increases adhesive joint strength, by enhancing the surface area and the extent of mechanical ... View full abstract»

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  • Performance of the stud bump bonding (SBB) process in comparison to solder flip chip technology

    Publication Year: 2000, Page(s):136 - 140
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    In flip chip on board, a flip chip packaging technology, a number of assembly techniques have been proposed using different bump materials, different techniques for the bump application and various methods for the electrical interconnection. Among these, the Stud Bump Bonding (SBB) process, which is widely used in Japan also for high volume production, is very interesting for several reasons and t... View full abstract»

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  • Guidelines to select underfills for flip chip on board assemblies

    Publication Year: 2000, Page(s):86 - 92
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB)

    The effect of thermo-mechanical properties of underfill, such as coefficient of thermal expansion (CTE) and stiffness (Young's modulus), on reliability of flip chip on board (FCOB) under thermal cycling stresses is investigated in this study. 3-D and quasi three-dimensional viscoplastic stress analysis using finite element modeling (FEM) is combined with an energy partitioning (EP) model for creep... View full abstract»

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  • Role of adhesion and its reliability implications in electronic assemblies

    Publication Year: 2000, Page(s):28 - 34
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1952 KB)

    An important aspect in the fabrication of electronic packages and assemblies is the joining of similar as well dissimilar pairs of materials with a range of physicochemical characteristics. Metal-metal, metal-polymer, and polymer-polymer interface are encountered. It is important to ensure adequate interfacial bonding, namely, adhesion strength between the material pairs for product performance in... View full abstract»

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