[1991 Proceedings] Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium

16-18 Sept. 1991

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  • Eleventh IEEE/CHMT International Electronics Manufacturing Technology Symposium (Cat. No.91CH3043-7)

    Publication Year: 1991
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    Freely Available from IEEE
  • Optimization of the gull wing lead

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (24 KB)

    Summary form only given. The long-term reliability of fine-pitch gull wing leads was investigated in a temperature cycling environment of -40 degrees C to 125 degrees C. The test vehicle was a 208-lead fine pitch quad flat pack (FQFP) plastic package, with lead pitch of 0.5 mm. The leads were specially prepared in the following configuration: two different foot lengths, 0.5 mm and 0.8 mm; two diff... View full abstract»

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  • Leverages and bottlenecks of MCMs

    Publication Year: 1991
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    Summary form only given. The authors discuss the fundamental issues confronting designers and manufacturers of the multichip modules (MCMs). All of them ultimately determine the product cost, be it the in-process and final test yields, the engineering effort in design and manufacturing support, or the MCM quality and reliability. Challenges are compounded in a situation where MCMs are assembled wi... View full abstract»

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  • Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

    Publication Year: 1991
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (67 KB)

    Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat tr... View full abstract»

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  • Introduction of BiCMOS into a production CMOS facility

    Publication Year: 1991, Page(s):58 - 60
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    A unique set of circumstances is required for the rapid introduction of a 1-μm BiCMOS capability from R&D into a CMOS production facility. Not only was the lead time very short, but the wafer size and equipment sets were not compatible and the main thrust/experience of the personnel was different. The authors review the proposed novel solution, organizational details, technical approach, an... View full abstract»

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  • A pilot line for multichip modules substrates

    Publication Year: 1991, Page(s):420 - 423
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (236 KB)

    In 1990 Thomson Hybrides started design and installation of a pilot production line for high density thin film substrates. Copper/polyimide multilayer structures are processed on alumina substrates. Vacuum metallization, electroplating, and photolithography processes will be progressively transferred to new automatic equipment. Starting with standard square plates (4"×4"), the pilot line has... View full abstract»

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  • A manufacturing vision for the year 2001 (what's new in CIM)

    Publication Year: 1991, Page(s):55 - 57
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (176 KB)

    An attempt is made to explore the state of the art in intelligent manufacturing systems and where the emerging research efforts are dedicated. What embodies the intelligence and with what embodiment intelligent manufacturing systems should be implemented are discussed. Examples of formative work in the computer integrated manufacturing (CIM) field are presented along with learning what has already... View full abstract»

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  • Design for manufacturability for electronic design: a system for evaluating printed circuit design tradeoffs

    Publication Year: 1991, Page(s):315 - 319
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB)

    A system for evaluating printed circuit design (PCD) tradeoffs during the electronic design process has been developed. The system consists of a stand-alone PC-based software tool and support documentation which describes system operation, content, methodology, optimization processes, and printed circuit technology selection criteria. At any stage of the PCD process, the system can be used to eval... View full abstract»

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  • Demountable TAB: improving manufacturability of TAB

    Publication Year: 1991, Page(s):1 - 5
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (496 KB)

    Area array demountable tape automated bonding (DTAB), a novel demountable, high-performance TAB package, is discussed. Special features of this package, its advantages compared to pin grid arrays (PGA), and its performance characteristics are presented. The basic concept for the package is introduced, and the advantages of this package in the manufacturing of printed circuit assemblies are discuss... View full abstract»

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  • Partnering for total quality: an industry's blueprint to regain and retain competitiveness

    Publication Year: 1991, Page(s):48 - 54
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    The author describes a step-by-step process of implementing total quality as a way of life within the semiconductor industry supply-chain. While this process utilizes the Malcolm Baldridge National Quality Award criteria as a foundation, the application of these criteria has been tailored to this industry. In doing so it adds additional dimensions to these criteria by bringing them to the level of... View full abstract»

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  • Bridge-gap buried digit-line for high density stacked DRAMs

    Publication Year: 1991, Page(s):310 - 314
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB)

    Explores the interaction of design and process to achieve a manufacturable low digit-line resistance-a key element to DRAM (dynamic random access memory) speed and to minimizing overall process complexity. They propose an interaction between stacked DRAM design and process called the bridge-gap process for achieving low digit-line resistance while minimizing overall process complexity. A study of ... View full abstract»

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  • Semi-conductor integrated technical data manager

    Publication Year: 1991, Page(s):222 - 225
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (336 KB)

    The author describes the architecture of the Semi-Conductor Integrated Technical Data Manager (SCIM) system. SCIM is a design automation system that integrates data and controls the processes that are required for the release of the masterslice to manufacturing. The two key components of the system are the relational database and its functional controller. As the data are generated by the design c... View full abstract»

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  • Testability challenges to achieve zero defect goal in MCM manufacturing

    Publication Year: 1991, Page(s):417 - 418
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (160 KB)

    Discusses some approaches to chip test and MCM (multi-chip module) assembly, and describes a module designed for CMOS logic, including details of its chip attach technology, test, and burn-in strategy. It is concluded that test procedures can be more easily implemented if the chips are designed for an MCM environment. Two significant challenges are the use on an MCM of chips whose design did not c... View full abstract»

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  • Laser created silicon vias for stacking dies in MCMs

    Publication Year: 1991, Page(s):262 - 265
    Cited by:  Papers (6)  |  Patents (41)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    The stacking of silicon devices is gaining some interest as it will allow even greater densities over current multichip module (MCM) approaches. One type of approach being tried in the industry is interconnecting stacked dies by routing their metal lines to the edge of the die and then strapping the appropriate lines from each die together. An approach being pursued by the Center for Microelectron... View full abstract»

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  • Concurrent engineering for consumer, industrial products, and government systems

    Publication Year: 1991, Page(s):44 - 47
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB)

    Recent Institute for Defense Analysis reports, National Science Foundation workshop results, and other current efforts and publications addressing concurrent engineering (CE) are discussed. It is noted that CE has yielded benefits involving reduction in change orders, development time, development costs, inventories, scrap, rework, defects, and production costs View full abstract»

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  • Closing the engineering to manufacturing information loop

    Publication Year: 1991, Page(s):307 - 309
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (272 KB)

    It is pointed out that, as printed circuit boards (PCBs) grow more complex and development time shrinks, the need for accurate and timely transfer of information from engineering to manufacturing has increased. This increased need has forced manufacturing to define information requirements, standardize data, improve data transfer capabilities, and verify engineering information. NCR E&M Columb... View full abstract»

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  • A software tool for technology tradeoff evaluation in multichip packaging

    Publication Year: 1991, Page(s):337 - 341
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (628 KB)

    A software tool for evaluating performance tradeoffs in multichip packaging is described. The tool enhances the manufacturability and decreases the design risk associated with the selection of packaging technologies for integrated circuits. Geometric, electrical, thermal, and manufacturing metrics can be estimated using the tool. The tool allows technologies to be changed and design rules to be mo... View full abstract»

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  • Hermetic plastic packages with applications to ruggedized boards

    Publication Year: 1991, Page(s):356 - 360
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (476 KB)

    The feasibility of organic and inorganic deposition providing hermetic circuit boards has been demonstrated . The diffusion barrier is set up by depositing under plasma an inorganic layer instead of an organic layer. SiO2 was chosen because it is easy to deposit and its properties are well-known. Three layers are necessary: conventional varnish (epoxy or acrylic) as a leveling-off agent... View full abstract»

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  • An integrated methodology for electronic assembly planning

    Publication Year: 1991, Page(s):218 - 221
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (348 KB)

    The authors discuss an integrated planning, scheduling, and control methodology for electronic assembly. The activities of a placement workstation for electronic assembly are addressed. Placement sequence planning, vision analysis, inspection, and control issues of the developed methodology are discussed. The placement workstation is hierarchically controlled by the electronic manufacturing cell c... View full abstract»

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  • A tin based TAB assembly process

    Publication Year: 1991, Page(s):31 - 35
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    The feasibility of using a TinCap TAB (tape automated bonding) ILB (inner lead bond) structure to provide a strong ILB connection has been demonstrated. The project investigated placing a pad of tin on top of a gold TAB bump as part of the wafer fabrication process. The tin is then used to form a reflowed ILB joint with a gold-plated tape lead. This gold/tin bond should provide a strong joint whil... View full abstract»

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  • Cost saving opportunities with multi-chip modules

    Publication Year: 1991, Page(s):413 - 416
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (292 KB)

    The author describes an MCM (multi-chip module) application that was driven by cost. A study of MCM technologies focused on the MCM assembly and interconnect to the motherboard. Models were developed to calculate the assembly and test costs for MCMs using wirebond and tape automated bonding technologies. Another model was used to evaluate interconnect options, both separable and nonseparable (e.g.... View full abstract»

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  • Environmentally conscious products

    Publication Year: 1991, Page(s):278 - 279
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (92 KB)

    IBM's environmental policy and IBM's initial criteria for environmentally conscious products are discussed. The main concept considered is that of a manufacturing loop in which products are made of recyclable materials and designed to be easily taken apart to be reused or recycled again. The tighter that loop, the less worrisome is the waste that will be generated View full abstract»

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  • Electronic assembly solvent substitutes

    Publication Year: 1991, Page(s):294 - 297
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (240 KB)

    Ways being considered at Hughes Aircraft Company to replace ozone depleting chemicals in the manufacture of electronics hardware are discussed. Organic solvents, saponifier cleaning, the use of terpene solvent cleaning, the reacting aqueous defluxing system, water-soluble fluxes, and tin/lead base solder alloys that will not require fluxes for joining of aerospace electronics are some of the areas... View full abstract»

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  • Multi-chip-module substrate decreasing signal delay and improving thermal conductivity

    Publication Year: 1991, Page(s):255 - 261
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (324 KB)

    An MCM (multi-chip-module) substrate which has less parasitic capacitance and less thermal stress displacement than the conventional type of substrate has been developed. A low-ε fluorocarbon resin for interlayer insulator underneath the multi-wiring layers in the substrate on which LSI chips should be mounted was used. The remaining portion of the substrate was filled with insulating materia... View full abstract»

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  • Fundamental study on solder paste for fine pitch soldering

    Publication Year: 1991, Page(s):163 - 165
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (320 KB)

    For fine pitch QFP soldering, solder amount and locations applied on pad must be precisely controlled. Solder paste has been printed individually on each pad for most card assemblies, but this printing method is confronted with process control difficulties. As a solution of these potential problems, a new type of printing method, in which many pads are covered with one bar (or belt) shaped paste p... View full abstract»

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