2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

29 May-1 June 2018

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  • [Front cover]

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 [Title page]

    Publication Year: 2018, Page(s): 1
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  • [Copyright notice]

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Welcome Letter

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Conference Organization Committee

    Publication Year: 2018, Page(s):1 - 3
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  • ITherm 2018 Conference Schedule

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Keynotes [3 abstracts]

    Publication Year: 2018, Page(s):1 - 2
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (981 KB)

    Provides an abstract for each of the keynote presentations and may include a brief professional biography of each presenter. The complete presentations were not made available for publication as part of the conference proceedings. View full abstract»

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  • ITherm 2018 ECTC/ITHERM Joint Women's Panel: How to enhance women’s participation in engineering – A view around the globe

    Publication Year: 2018, Page(s): 1
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1145 KB)

    Summary form only given, as follows. The complete presentation was not made available for publication as part of the conference proceedings. The Executive Committees of ECTC and ITHERM cordially invite all ITherm attendees to our fourth annual Women's Panel and Reception jointly organized by ITherm and ECTC and sponsored by EPS. The four panelists will speak on their experiences and achievements i... View full abstract»

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  • ITherm 2018 Professional Development Courses

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Conference Technical Program

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Technology-Talk Sessions

    Publication Year: 2018, Page(s): 1
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  • ITherm 2018 Sponsors & Vendor Exhibits

    Publication Year: 2018, Page(s): 1
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  • [Front matter]

    Publication Year: 2018, Page(s):1 - 10
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  • Table of contents

    Publication Year: 2018, Page(s):1 - 15
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  • Boiling Heat Transfer Performance of Three-dimensionally Ordered Microporous Copper with Modulated Pore Diameters

    Publication Year: 2018, Page(s):1 - 6
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2093 KB) | HTML iconHTML

    There are significant interests in leveraging microporous surface for enhanced two phase cooling performance contributed by the entrapped vapor in pores and higher nucleation sites. However, the potentials for such porous media have yet to be realized due to the irregularity of the pore distributions and arrangement that are often used in boiling measurements. The lack of periodicity in pore packi... View full abstract»

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  • Physics of Transition to Annular Flow in Microchannel Flow Boiling Process

    Publication Year: 2018, Page(s):7 - 11
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (4349 KB) | HTML iconHTML

    Transition to annular flow regime in microchannels is arguably one of the most complex phenomena in the flow boiling process. The instability of the vapor-liquid interface in this interstitial regime presents an intricate situation in which the interface pattern rapidly changes with the mass flow rate and surface heat flux. Although a few past studies have reported observing this regime, thermohyd... View full abstract»

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  • Two-Level Copper Oxide Nanostructured Surfaces for Condensation Heat Transfer

    Publication Year: 2018, Page(s):12 - 18
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2405 KB) | HTML iconHTML

    Condensation has been widely explored because of its importance in numerous applications including water desalination, water harvesting, and power generation. Previous studies have shown that the enhancement in condensation heat transfer can be achieved by the design of structured surfaces with desired surface chemistry. Especially, nanostructured surfaces have enhanced thermal transport performan... View full abstract»

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  • Kapton RS Flexible Heaters – Design and Applications

    Publication Year: 2018, Page(s):19 - 25
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1245 KB) | HTML iconHTML

    DuPont™Kapton®RS is a two-layer polyimide film consisting of a $25\mu \mathrm {m}$ thick, 100 Ω/□ resistor layer on one side, and a $25\mu \mathrm {m}$ thick dielectric layer on the other side. This engineered, electrically resistive film is utilized to fabricate flexible heaters that are rated for up to 240 °C continuous operation. Flexible high performance heaters are fabri... View full abstract»

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  • Thermo-mechanical Deformation in Flexible-Board Assemblies During Reflow and Post-Assembly Usage

    Publication Year: 2018, Page(s):26 - 31
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (11125 KB) | HTML iconHTML

    Flexible printed circuit boards lack the structural stiffness of the rigid printed circuit counterparts. Thermo-mechanical deformation in flexible printed circuit assemblies may be very different from that in rigid board assemblies. The double-sided board used for the experiment is of BGA 256-144 combination with dummy components, A-PBGA256-1.0mm-17mm and ACABGA144-1.0mm-13mm. The three-dimensiona... View full abstract»

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  • Highly Stretchable Metal Films on Polymer Substrates: Mechanics and Mechanisms

    Publication Year: 2018, Page(s):32 - 36
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    Stretchable interconnects are required for flexible electronic devices where a typical system comprising metallic interconnect and elastomer substrate needs to undergo large deformation while maintaining its mechanical and electrical integrity. This paper reports on a highly stretchable interconnect system consisting of indium metal periodically bonded to a compliant polydimethylsiloxane (PDMS) su... View full abstract»

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  • Novel Flexible Bioelectronics Device and Software Application for Prevention of Sudden Causes of Death

    Publication Year: 2018, Page(s):37 - 45
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2553 KB) | HTML iconHTML

    ExtendeReducing paramedic response times to five minutes could nearly double survival rates of patients experiencing life-threatening medical conditions. Maintenance of an independent lifestyle with a comparable level of monitoring requires the development of devices, which can provide continuous monitoring and timely medical intervention when needed, without the tie-down constraints of a hospital... View full abstract»

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  • Uncertainty Analysis of Near-Field Thermal Energy Transfer within Nanoparticle Packing

    Publication Year: 2018, Page(s):46 - 50
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2465 KB) | HTML iconHTML

    Laser heating of nanoparticles leads to significant near-field thermal effects between the nanoparticles. Due to the interaction between the laser and nanoparticle packings, some laser energy is scattered or absorbed, resulting in attenuation of the laser energy. The absorbed energy within the nanoparticles affects the near-field thermal energy transport. We have analyzed these effects by combinin... View full abstract»

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  • Thermal Transport Analysis of Heterostructured Nanowires With Metal-Semiconductor Interfaces

    Publication Year: 2018, Page(s):51 - 58
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (809 KB) | HTML iconHTML

    Recent advances in materials sciences and nanotechnology have enabled novel nanostructure designs that selectively suppress heat transport by several orders of magnitude with respect to the bulk material, while maintaining its bulk electrical properties, thereby allowing for an increase in the thermoelectric figure of merit ZT[1]. This work investigates thermal transport in heterostruct... View full abstract»

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  • Optical Pump-Probe Thermoreflectance Imaging for Anisotropic Heat Diffusion

    Publication Year: 2018, Page(s):59 - 66
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1060 KB) | HTML iconHTML

    Thermal diffusion in anisotropic and inhomogeneous materials are investigated by full-field thermal imaging using optical pump-probe thermoreflectance microscopy. Target sample material is a composite of nickel clusters, approximately 10 microns in size, distributed inhomogeneously within polydimethylsiloxane (silicone) resin. Such a material presents special challenges when characterizing thermal... View full abstract»

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  • Thermal Boundary Conductance Mapping at Metal-MoSe2Interface

    Publication Year: 2018, Page(s):67 - 72
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1340 KB) | HTML iconHTML

    Increasing power density in the microelectronic devices has led to thermal management concerns to ensure efficient, reliable, and long-term operation. As device dimensions continue to decrease, the interfaces of dissimilar materials (e.g., metal-semiconductor) may limit heat removal from the device active region. Improving the thermal transport across interfaces is a necessary consideration during... View full abstract»

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