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Production Techniques, IRE Transactions on

Issue 1 • Date September 1959

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Displaying Results 1 - 7 of 7
  • Message from the Editor; Scanning the Issue

    Publication Year: 1959 , Page(s): 0
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    Freely Available from IEEE
  • The Semiautomatic Circuit Component Tester

    Publication Year: 1959 , Page(s): 12 - 18
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  • Management Views Automation

    Publication Year: 1959 , Page(s): 35 - 38
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  • Some Aspects of the Thermal Design of Electronic Equipment Operating at 300-500°C Environmental Temperature

    Publication Year: 1959 , Page(s): 25 - 29
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    Summary--Aspects of electronic part-cooling techniques applicable to 300-500°C equipments are presented. Contrary to some beliefs, the minimization of thermal resistance at these temperatures is as important as at lower temperatures. The significant shifts in the natural modes of heat transfer which occur with high-temperature electronic parts are outlined, together with some recommended methods of cooling high-temperature parts and assemblies. View full abstract»

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  • Technique for Automatic Testing Electronic Components

    Publication Year: 1959 , Page(s): 1 - 11
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    The technique for automatic testing of electronic components must be adapted to the requirements for each individual test program. This paper describes the methods employed in instrumenting two test programs. The first involves approximately 75,000 components of four types - resistors, diodes, transistors and capacitors - all being tested for an extended period under environmental and electrical load conditions. The second program, in contrast, describes the parameter measurements which have to be made on small quantities of semiconductor devices under nuclear radiation con- ditions. View full abstract»

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  • Reliable Design and Development Techniques

    Publication Year: 1959 , Page(s): 30 - 34
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    Mechanical concepts must be applied to modify electronic circuit design in order that large scale computer equipment can attain practical levels of reliability. This paper cites some specific mechanical design problems with regard to the reliability of a particular computer system, the AN/FSQ-7. View full abstract»

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  • Minimizing Production Costs Through Modular Automatic Test Equipment

    Publication Year: 1959 , Page(s): 19 - 24
    Cited by:  Papers (1)
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    Summary- The dominant consideration influencing tine trend toward automatic test and checkout techniques for production-line test stations is cost reduction. Testing costs include the costs of test equipment and spares, of operating and maintaining personnel, of floor space, and of down time. As test cost per unit produced is the basis for comparison, the test rate achieved per station is a major factor. An analysis of test station requirements for a mass-produced missile is used as an example. This analysis shows major reductions in test cost per unit as a result of automation for subassemblies which have fairly complex test requirements; whereas for simple subassemblies, there are no cost improvements and manual testing is quite satisfactory. The necessity for maintaining high test rates with fewer, less skilled operators and with the corresponding reduction in test stations imposes high reliability requirements on automated equipment in order to preserve this economic advantage. Therefore, such features as self-checking fail-safe design, and printed-out test results are essential. The construction of automatic test sets from functional universal modules reduces first cost of equipment, permits rapid and economic servicing, and reduces obsolescence of equipment. Another advantage of the modular approach to production-line test set design is that test sets using only a low order of automation may utilize modules identical to those of the fully automated equipment. This extends the "break-even" point in the choice between automated and manual equipment towards increased application of the more sophisticated techniques. View full abstract»

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Aims & Scope

This Transaction ceased production in 1959. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope