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Component Parts, IEEE Transactions on

Issue 1 • Date Mar 1965

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Displaying Results 1 - 7 of 7
  • Dielectric Properties of Thin Insulating Films of Photoresist Material

    Publication Year: 1965 , Page(s): 8 - 11
    Cited by:  Papers (3)  |  Patents (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (576 KB)  

    This paper discusses measurements of the dielectric properties of thin insulating films of AZ-171and KPR.2The properties include conductivity and dielectric constant as a function of frequency, voltage, and temperature. Also, films have been temperature cycled from 3° to 500° K to determine if structural defects appear. These measurements show that specially prepare... View full abstract»

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  • The Optimization of Square-Law Elements Based on Silicon Carbide Nonlinear Resistors

    Publication Year: 1965 , Page(s): 3 - 7
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (664 KB)  

    A segmental square-law circuit is described employing silicon carbide nonlinear resistors in a parallel configuration analogous to a conventional diode function generator, but having the advantage of requiring no bias supplies and giving an output noticeably free of discontinuities. An optimization procedure is described by which satisfactory values for the circuit elements were obtained. Using on... View full abstract»

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  • A New Approach to the Attainment of the Highest Possible Reliability in Tantalum Capacitors

    Publication Year: 1965 , Page(s): 21 - 29
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1488 KB)  

    The question of how to achieve the highest possible reliability for Tantalum capacitors is discussed from both the theoretical and practical point of view. A method of achieving reliabilities of the order 95 per cent at a confident level of 95 per cent or better is described which involves an analytical treatment of the physics of the main mode of failure, all accounting for over 90 per cent of a ... View full abstract»

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  • Magnetomechanical Applications Utilizing Silicon Iron

    Publication Year: 1965 , Page(s): 11 - 16
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1056 KB)  

    This paper discusses the processing and use of ironsilicon alloys [American Iron and Steel Institute (AISI) M27, M6, etc.] in electromechanical applications. These materials are more commonly used in electromagnetic applications such as transformer and motor laminations, relays, and solonoids. Resistance to mechanical stress is provided by applying hard carburized or carbonitrided cases to only th... View full abstract»

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  • Application of the Eyring Model to Capacitor Aging Data

    Publication Year: 1965 , Page(s): 34 - 41
    Cited by:  Papers (52)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1248 KB)  

    The Eyring Model has been used to derive the "power rule" for capacitors. Analytical models for evaluating progressive and step stress tests are presented. Various methods are discussed for determining the value of the exponent for the power rule. In particular, the relation between the exponent of the power rule and the beta of the Weibull distribution, for both progressive and constant stress te... View full abstract»

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  • Thin-Film Titanium Dioxide Capacitors for Microelectronic Applications

    Publication Year: 1965 , Page(s): 16 - 20
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (808 KB)  

    This paper discusses investigations of vacuum-deposited thin-film titanium dioxide capacitors applicable to microelectronic circuits. Included are sections covering evaporant materials and their purities, vacuum evaporation techniques, anodizing procedures, substrate materials, and electrical properties of thin-film TiO2capacitors. View full abstract»

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  • Surface Design Factors in the Evaporative Cooling of Electronic Components

    Publication Year: 1965 , Page(s): 29 - 33
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (736 KB)  

    Variations in the size and orientation of a surface cooled by evaporation of a liquid are reflected in the measured heat transfer characteristics. Nucleate boiling curves from tests of "Freon-113" in contact with two sizes of heated flat plates in different positions are used to demonstrate the comparative characteristics. For low levels of heat flux, the lowest surface temperatures are exhibited ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope