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Advanced Semiconductor Manufacturing Conference and Workshop, 1992. ASMC 92 Proceedings. IEEE/SEMI 1992

Date Sept. 30 1992-Oct. 1 1992

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  • IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC '92 Proceedings (Cat. No.92CH3182-3)

    Publication Year: 1992
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    Freely Available from IEEE
  • Plasma-etching induced damage in thin oxide

    Publication Year: 1992 , Page(s): 79 - 83
    Cited by:  Papers (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (324 KB)  

    It is pointed out that plasma Al etching and resist ashing processes cause Fowler-Nordheim current to flow through the oxide and that plasma-induced damage can be simulated and modeled as damage produced by constant current electrical stress. The current produced by the plasma process increases with the antenna size of the device structure. C-V measurement is a more sensitive tec... View full abstract»

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  • Using a statistical experimental design to optimize a phosphorus deposition process in a high volume production facility

    Publication Year: 1992 , Page(s): 136 - 142
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (680 KB)  

    In this study a statistically designed experiment was first used to improve the uniformity of an existing reactor. Three factors were examined in combination in an 8×8 resolution V experiment. Uniformity was noticeably improved on a batch size that was increased from 50 to the minimum goal of 75 wafers. The result of this first experiment did not achieve the process goal, since the uniformit... View full abstract»

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  • A large-scale SPC implementation using the IBM multimedia SPC program

    Publication Year: 1992 , Page(s): 153 - 158
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (424 KB)  

    The implementation of statistical process control (SPC) in the chemical vapor deposition (CVD) process area of a semiconductor wafer fabricator is described. Advanced self-study interactive video/computer training and a series of cross-functional meetings were used for problem solving. The training that production employees received enabled them to enhance their basic statistical knowledge and ski... View full abstract»

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  • Key issues for the unplanned transfer of VLSI technology

    Publication Year: 1992 , Page(s): 189 - 193
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (336 KB)  

    The authors point out that in unplanned transfers i.e. capacity overload of technology license, etc., many manufacturing issues must be resolved on an aggressive schedule and at the lowest possible cost. The key issues which exist under various conditions are covered. The balance between technology requirements and minimized impact is discussed in terms of processing tools and recipes. Critical is... View full abstract»

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  • Self-learning fuzzy modeling of semiconductor processing equipment

    Publication Year: 1992 , Page(s): 100 - 106
    Cited by:  Papers (6)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (468 KB)  

    A qualitative equipment model for a low pressure chemical vapor deposition (LPCVD) process is presented. The model is based on fuzzy representation of input-output relationships and utilizes self-tuning membership functions. To demonstrate this concept a fuzzy inference system has been built for polysilicon grain size prediction based on deposition and annealing temperatures. After the system is t... View full abstract»

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  • A novel design for the construction and startup of an eight inch pilot line

    Publication Year: 1992 , Page(s): 60 - 65
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (412 KB)  

    An 8-in wafer line with 0.5-μm CMOS process technology for DRAM and SRAM pilot production is discussed. The pilot line is expected to achieve: (1) speedy construction and startup with overall duration of 16 months; (2) a class-0.1 clean environment at 0.3-μm particle testing level; (3) the flexibility to advance to 0.2-μm process technology when needed; (4) the flexibility to enlarge the ... View full abstract»

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  • Progress toward host tool integration of in situ particle monitors

    Publication Year: 1992 , Page(s): 16 - 17
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (196 KB)  

    The authors point out that in situ particle monitoring has gained substantial acceptance as a manufacturing process control technique, with the capability of providing automated 100% inspection during process. This is significant for several reasons, including faster detection of out of control events and higher baseline count rates as a consequence of the ability to monitor continuously, the dete... View full abstract»

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  • Why even successful teams sometimes fail-self-directed team catalysts

    Publication Year: 1992 , Page(s): 174 - 179
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (548 KB)  

    The author points out that by systematically creating an environment in which team catalysts can flourish, organizations can move away from the task force approach toward self-directed teams. These teams can accurately predict future issues and work to resolve them before they adversely affect the business by reaching a crisis state. Focusing on long-term investment in such a catalytic environment... View full abstract»

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  • MOS device technology trend and future direction

    Publication Year: 1992
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (36 KB)  

    Summary form only given. It is pointed out that IC speed improvements slowed down after achieving 1-μm geometry and will be very slight after 0.5 μm. Scaling down the IC circuit in the depth direction is reaching the limit of existing technology. The real estate for isolation of CMOS SRAM structures occupies more than 80% of the total chip area and the possibility of any great improvement is... View full abstract»

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  • Managing safety for results

    Publication Year: 1992
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (84 KB)  

    Summary form only given. The Du Pont Company's safety and occupational health program is described and the continuous improvement process employed throughout the corporation is outlined. A commitment to preventing all injuries and high priority attention by line management to the task of integrating safety into the total management function is described. A comprehensive reporting system and suppor... View full abstract»

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  • Profile control in isotropic plasma etching

    Publication Year: 1992 , Page(s): 116 - 119
    Cited by:  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (320 KB)  

    The possibility of controlling the lateral-to-vertical etch ratio of undoped dielectric material is tested. The Lam Research Rainbow 4500i, configured with a downstream isotropic plasma etch chamber, was used for the study. The tetra-ethyl-ortho-silicate (TEOS) isotropic etch profile was examined as a function of process parameters in order to establish trends of isotropic etch profile. A fraction... View full abstract»

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  • Managing technology transfer: a matrix approach

    Publication Year: 1992 , Page(s): 186 - 188
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (248 KB)  

    The use of a multilevel matrix management approach to maximize the transfer of knowledge from the SEMATECH manufacturing research consortium to Harris Semiconductor is described. The technology transfer manager works through site coordinators to ensure transfer of technology in all areas, and on all levels. Harris management interacts with SEMATECH management to provide direction on major programs... View full abstract»

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  • Technology outreach

    Publication Year: 1992
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (84 KB)  

    Summary form only given. Technology transfer available at universities and federal laboratories, how to assess that technology, and why it is of vital importance to American global competitiveness have been examined View full abstract»

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  • The economic benefits of new stepper technology for manufacturing with 0.35 μm IC design rules

    Publication Year: 1992 , Page(s): 7 - 15
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (576 KB)  

    An analysis is made of the economic benefits of stepper technology for manufacturing ICs with 0.35-μm design rules. A table of design rules required for manufacturing 0.35-μm ICs is proposed. With reference to these design rules, three critical budgets, CD control, overlay, and particulate control, are analyzed with respect to cost per critical layer and impact on cumulative yield using the ... View full abstract»

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  • A market-driven methodology for improving servicability through an integrated customer/supplier partnership (CSP)

    Publication Year: 1992
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (44 KB)  

    Summary form only given. The customer/supply partnership (CSP), an innovative market-driven supply/commit process which integrates customer and supplier business operations, is discussed. CSP provides quick turn-around in a dynamic market, and produces accurate, detailed delivery projections which optimize customer production schedules and supplier servicability. CSP's all-encompassing approach to... View full abstract»

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  • Case-based hypermedia access of `lessons learned' to accomplish technology transfer

    Publication Year: 1992 , Page(s): 194 - 198
    Cited by:  Patents (3)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (464 KB)  

    The authors point out that the transfer of semiconductor process technology to daughter fabrication facilities is difficult due to multiple, decentralized, offline sources of expertise and documentation. the goal of the Knowledge Access project at Texas Instruments was to supply technologies to integrate and disseminate the wealth of process knowledge and lessons learned to multiple wafer fabricat... View full abstract»

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  • Application of real-time expert systems in semiconductor manufacturing

    Publication Year: 1992 , Page(s): 90 - 95
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (508 KB)  

    Some requirements of a real-time expert system and applications in process control, statistical process control, and scheduling are presented. Combining the expert system capability with object oriented modeling, one can build powerful applications in a relatively short time span, thus cutting down the time taken to implement a process control system. Also, when implemented, an expert-system-based... View full abstract»

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  • An automated system for loading Atmoscan process tubes using intrabay material handling technologies

    Publication Year: 1992
    Cited by:  Papers (1)  |  Patents (4)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (44 KB)  

    Summary form only given. The authors point out that a tracked robot (intrabay) system that uses adaptive hardware to reliably load conventional shovel-type cantilevers as well as the Atmoscan-type has been implemented into production. In addition, a networked VAX software package has been deployed that controls and gathers data from the furnace controller via its SECS-II interface, making the oper... View full abstract»

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  • True employee empowerment vs. one more job we have to do

    Publication Year: 1992 , Page(s): 171 - 173
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (268 KB)  

    The EFFORT (Employee Find and Fix Obvious Risk Teams) program in a semiconductor fabrication facility is discussed. The philosophy of the program is that employees, not managers, could see and find the problems causing a high risk of scrap. The employee teams would be expected to fix the problems they found, not assign them to another group. Results show that the increased output of improvements d... View full abstract»

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  • Chemical-mechanical planarization

    Publication Year: 1992 , Page(s): 206 - 210
    Cited by:  Papers (1)  |  Patents (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (324 KB)  

    The chemical-mechanical planarization (CMP) techniques applied to insulating layers in multilayered integrated circuits are discussed. Advantages and concerns of CMP are considered. Process developments are described View full abstract»

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  • Rapid thermal processing for reproducible formation of the self-aligned silicides of cobalt and platinum

    Publication Year: 1992 , Page(s): 211 - 215
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (336 KB)  

    The results of a continued investigation of the formation of self-aligned CoSi2 and PtSi are presented. In both cases it is found that simple surface cleaning methods and use of rapid thermal annealing in inert ambients lead to a method of forming these silicides that is reproducible and reliable. The effect of dopants in silicon or polysilicon on such process has also been investigated... View full abstract»

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  • Product defect reduction through the use of business process management

    Publication Year: 1992 , Page(s): 43 - 48
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (300 KB)  

    Points out that understanding the entire manufacturing process, across organizational boundaries, is a key element in improving shipped product quality level (SPQL). Employee participation in the understanding and improving of IBM's business processes improves product quality, business efficiency and employee morale. The impact of the business process teams on employee morale has been positive and... View full abstract»

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  • Rapid development, in a manufacturing environment, of a 1 μm triple-level metal CMOS process through the use of cross-functional teams

    Publication Year: 1992 , Page(s): 180 - 185
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (476 KB)  

    The development, in a manufacturing environment, of a 1 μm triple-level-metal, 5 V CMOS process in under 25 weeks is discussed. The manufacturing process engineering group developed cross-functional process integration teams that synthesized device engineering from R&D, manufacturing process engineering, production, yield engineering, product engineering, and reliability engineering. By dev... View full abstract»

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  • Resource sharing in capacity analysis

    Publication Year: 1992 , Page(s): 39 - 42
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (240 KB)  

    The problem of use of multiple resources by multiple task types in an environment where the resource-task assignments are constrained at various degrees of flexibility is investigated. The authors study this in the context of a partially flexible manufacturing flow shop and propose algorithms for predicting machine utilization by machine group (i.e., use of resources by job type). A general predic... View full abstract»

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