18th European Microelectronics & Packaging Conference

CEITEC - Central European Institute of Technology is a project to develop a European centre of scientific excellence in the fields of life sciences and advanced materials and technologies, which is aiming to set up a centre with state-of-the-art infrastructure and conditions for best scientific workers. It was prepared by four universities and two research institutes in Brno, Czech Republic. CEITE... View full abstract»

iNEMI released its 2011 Technology Roadmap to industry on March 29, 2011. The Roadmap covers six product segments and 21 technology areas pertinent to electronics manufacturing. Every two years iNEMI maps future manufacturing technology needs of the global electronics industry for the next ten years. It discusses the major business and technology issues, paradigm shifts, emerging technologies and ... View full abstract»

There is an increasing interest in Multi-Electrode Array (MEA) technology arising from a diversity of bio-scientific areas, which is especially strong in stem cell, drug discovery or safety pharmacology applications. There are limitations in the quantity of useful data captured during an MEA-based trial that can be attributed to reasons such as the time intensive nature of MEA application, the sub... View full abstract»

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under inv... View full abstract»

This work evaluated materials and process interactions in the development of a high density platinum / alumina feedthrough. Effect of Pt particle size, firing rates, firing temperature on the sintering, densification and secondary reactions are evaluated, as well as the effect of alumina additive to minimize the difference in expansion coefficient during cooling. View full abstract»

Further miniaturization of electronic packaging calls for integration of magnetic functional components into LTCC modules. For integration of magnetic function into LTCC, low fired MnZn- and NiCuZn-ferrites which can be fully densified at the standard LTCC sintering temperature of 900°C were developed. To co-fire these ferrite tapes with dielectric tapes the sintering shrinkage and the coefficient... View full abstract»

Radio Frequency Identification (RFID) is a powerful tool used in several application areas. In this paper a method to embed a passive Ultra High Frequency (UHF) RFID chip within Printed Circuit Boards (PCB) is presented, along with how this can be used to improve the quality and tracking of boards along the electronics supply chain. Embedding of the RFID tag at the very beginning of the supply cha... View full abstract»

This paper presents the feasibility of sculpting 3D microstructures in a single layer of unfired green tape ceramic. To achieve this result, a powder blasting machine was used to pattern the soft layer. This process is based on the abrasive power of micro particles propelled at high speed towards a substrate. To create 3D structures, the angle of incidence of those particles was varied. Using this... View full abstract»

3D through silicon via (TSV) and vertical stacking technologies have become key enablers in the move towards high density, high functionality 3D integrated circuits. The need to address strain, warpage, delamination, etc. in Systems on Chip or Systems in Package (SoC/SiP) is recognised in the International Technology Roadmap for Semiconductors (IRTS 2009). This paper describes the implementation o... View full abstract»

The paper deals with novel Micro-Electro-Mechanical System (MEMS) structure. The structure was designed to be utilized as capacitance pressure sensor. The most applicable topology of the MEMS structure was selected by means of electrostatic model analysis made by MatLAB software. There were proposed five structures and the best solution was selected as the “chessboard” structure, since it provides... View full abstract»

This paper presents computational fracture analysis of the button shear test. The specimen under consideration is commonly used for the assessment of adhesion strength between encapsulating mold compounds and metal leadframes. The finite element method is applied for stress strain analysis of the shear test and for the extraction of fracture parameters for various crack configurations in the mater... View full abstract»

Polymers are frequently used as the insulating material in printed circuit boards (PCBs). However, many polymers tend to absorb moisture and this may impair their electrical and mechanical properties. In this study three flexible PCB materials; polyimide (PI), fluorinated ethylene-propylene (FEP) and polyethylene terephthalate (PET) were aged in high humidity test in which a temperature of 85°C an... View full abstract»

In this paper the initial capacitances of pressure sensors consisting primarily of the capacitance of an air-gap capacitor and the parasitic capacitance of sensors realized with LTCC (low-temperature cofired ceramics) materials are described. The capacitances at different temperatures (from 10°C to 75°C) and different levels of humidity (from 20% to 80% relative humidity) were measured with an LCR... View full abstract»

The requirements for reduction of line and space dimensions in IC substrates are driving developments to improve both production yield and capability. In particular the production of substrates with line and space dimension at or below 10 μm is required for the next level of integration. However traditional production techniques using dry film image transfer are already reaching capability limits ... View full abstract»

In coming applications a further increase of diversity and higher complexity of electronic systems is expected. As a consequence it will be an increasingly challenging and time consuming task to design these systems. Although various new components are coming up, the problem of increasing cost for system design, debugging and verification is generally not addressed by conventional technology devel... View full abstract»

The global automotive electronics market is expected to be worth more the $240 billion by 2017 (according to research conducted by Strategy Analytics). Innovative IC (Integrated Circuit) and power devices for powertrain, lighting and body electronics are helping car manufacturers to reduce the emission levels, improve the fuel economy, and increase the safety of the vehicles they produce. The tota... View full abstract»

Surface Acoustic Wave (SAW) filters are key components of mobile phones. In SAW components mechanical waves propagate on the surface of the chip, so the package must provide a cavity. Solid materials on the chip would inhibit the propagation of the surface waves. Reduction of size and cost, improved reliability and electrical performance are the main trends of SAW component evolution. Therefore, a... View full abstract»

Silver/palladium resistor pastes on aluminium nitride (AlN) are presented. These resistor pastes are very interesting for power electronic and heater applications. Currently realised paste systems are a resistor paste based on AgPd as conductive phase, which has sheet resistivities up to 1 ohm/sq and a RuO2resistor paste system with a sheet resistance higher than 6 ohm/sq. However both ... View full abstract»

Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have high-reliability requirements. SMT (Surface Mount Technology) assembly consequently involves overcoming challenges that include- complex components such as sub-0.4mm CSPs, 01005s, LGAs; Area Ratios of 0.6 and below; Stenc... View full abstract»

Inkjet printing of planar and via (through-hole) electrical interconnections is developed to be incorporated into a roll-to-roll manufacturing line. The specific roll-to-roll machine uses rotary RMPD®technology, self-alignment of bare LED dies, and inkjet printing of the electrical connections to the LEDs dies. The key problem to be solved is the inkjet printing of electrical connection... View full abstract»

The rapid ramping of fine pitch copper wire bonding production is a perfect example of a market driven technology implementation. The explosive increase in gold commodity pricing has paved the road for this conversion. Several challenges known from thick copper wire bonding had to be overcome to make this technology viable technically and economically. Some fundamental studies of copper wire bondi... View full abstract»

Standard drop tests for portable electronics are not representative for the qualification of automotive electronics. High-frequency vibrations are more dominant than abrupt shocks during normal operation. In this work a high speed board bending (HSB) method is developed to mimic the constant cyclic solder joint loading (sinus wave load, 10-200 Hz, <;2 mm peak-to-peak). A series of test printed ... View full abstract»

Reliable hermetic MEMS chip-scale packaging has been developed and tested with gold-tin soldering on 2×1.5 mm2chips. The test vehicle configuration consists of a glass cap with AuSn solder ring bonded onto a silicon resonator dummy chip. Through careful chip layout, UBM layer improvements and soldering process optimization, the shear tests yielded forces above 5 kg on a bonding ring are... View full abstract»