# IEEE Transactions on Components, Packaging and Manufacturing Technology

## Issue 2 • Feb. 2019

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## Filter Results

Displaying Results 1 - 25 of 27
• ### [Front cover]

Publication Year: 2019, Page(s): C1
| PDF (342 KB)
• ### IEEE Transactions on Components, Packaging and Manufacturing Technology publication information

Publication Year: 2019, Page(s): C2
| PDF (83 KB)

Publication Year: 2019, Page(s):191 - 192
| PDF (413 KB)
• ### An Investigation of Silver-Nanoparticle-Laden Lubricants for Electrical Contacts

Publication Year: 2019, Page(s):193 - 200
| | PDF (2473 KB) | HTML

Electrical contacts are critically important for a wide variety of applications, including computing, automotive, manufacturing, and renewable energy technologies. Due to a combination of vibrations and environmental conditions, these contacts are often susceptible to fretting corrosion and other wear mechanisms. In many cases, it is not possible to design a stable dry contact system that is also ... View full abstract»

• ### Composite Glass-Silicon Substrates Embedded With Microcomponents for MEMS System Integration

Publication Year: 2019, Page(s):201 - 208
| | PDF (5012 KB) | HTML

This paper reports a novel composite glass-silicon substrate (CGSiS) embedded with microcomponents by a glass reflow process. Microcomponents including vias, electrodes, capacitors, inductors, and filters are designed. Highly doped silicon is taken as the conductive material of microcomponents. Glass reflow process is investigated to fabricate the CGSiS. Results show that the total thickness varia... View full abstract»

• ### A Study on the Conductive Particle Movements in Polyvinylidene Fluoride Anchoring Polymer Layer Anisotropic Conductive Films for 20- $\mu$ m Fine-Pitch Interconnection

Publication Year: 2019, Page(s):209 - 215
| | PDF (2470 KB) | HTML

Fine-pitch interconnection technology in electronic packaging has become very important because of electrical interconnection issues such as high contact resistance and open-/short-circuit failure. Nanofiber anisotropic conductive films (ACFs) and nanofiber sheet ACFs (NS ACFs) have been developed and reported by our research group to address the challenges for fine-pitch interconnection problems.... View full abstract»

• ### Novel Electronic Packaging Method for Functional Electronic Textiles

Publication Year: 2019, Page(s):216 - 225
| | PDF (3706 KB) | HTML

A novel packaging method that enables the reliable mounting and protection of bare die within a textile yarn has been investigated. The reliability of electronic textiles is highly challenging given the flexibility of the fabric and the rigors of typical applications. Achieving reliable operation requires novel packaging approaches. In order to maximize the reliability and to minimize stresses in ... View full abstract»

• ### Integration of Jet Impingement Cooling With Direct Bonded Copper Substrates for Power Electronics Thermal Management

Publication Year: 2019, Page(s):226 - 234
| | PDF (2235 KB) | HTML

The ability of packaging solutions to meet the high heat flux dissipation of power electronics relies heavily on effective thermal management strategies. During operation, power electronic devices generate high temperatures that can cause device degradation. To remove this heat from the devices, heat spreaders and cold plates are often used. However, the multiple layers that compose the module oft... View full abstract»

• ### Investigation of Simultaneous Effects of Surface Roughness, Porosity, and Magnetic Field of Rough Porous Microfin Under a Convective–Radiative Heat Transfer for Improved Microprocessor Cooling of Consumer Electronics

Publication Year: 2019, Page(s):235 - 246
| | PDF (2277 KB) | HTML

The ever-increasing demand for high-processing compact electronic systems has unequivocally called for improved microprocessor performance. However, increasing microprocessor performance requires increasing power and on-chip power density, both of which are associated with increased heat dissipation. Electronic cooling using fin has been identified as a reliable cooling approach in miniaturized el... View full abstract»

• ### Mitigation of Flow Maldistribution in Parallel Microchannel Heat Sink

Publication Year: 2019, Page(s):247 - 261
| | PDF (3448 KB) | HTML

Flow rate nonuniformities (termed as maldistribution) among a stack of microchannels connected with each other through the inlet/outlet plenums of a microchannel heat sink (MCHS) are one of the major hindrances associated with effective and efficient operations. That induces many undesirable effects, including accentuation of lateral and flow direction nonuniformities in surface temperatures (for ... View full abstract»

• ### Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module

Publication Year: 2019, Page(s):262 - 268
| | PDF (4142 KB) | HTML

In this paper, fatigue life of solder joints of the power module and the printed circuit board in a power inverter under directional random vibration using the finite element method (FEM) was evaluated. Five angles of 0°, 30°, 45°, 60°, and 90° were selected for direction of vibration loading. The simulation results showed that the outermost corner of the solder layer undergoes the maximum stress ... View full abstract»

• ### Embedded Microjets for Thermal Management of High Power-Density Electronic Devices

Publication Year: 2019, Page(s):269 - 278
| | PDF (3244 KB) | HTML

With current trends toward increased power in smaller devices and packages, the search continues for high-performance thermal management solutions for MOSFETs, high-electron mobility transistors, and other power electronics. Microjet impingement cooling has been shown to produce high heat transfer capabilities for electronics cooling. In this paper, microjets based on well-studied geometries were ... View full abstract»

• ### A Novel Contact Temperature Calculation Algorithm in Distribution Switchgears for Condition Assessment

Publication Year: 2019, Page(s):279 - 287
| | PDF (2497 KB) | HTML

The abnormal rise in contact temperature in switchgear may lead to overheating or even explosion. It is necessary to monitor the rise in real contact temperature to ensure the safety and stability of switchgear. The accurate measurement of real contact temperature is still a problem, and the continuous state of switchgear cannot be assessed accurately by the temperature monitor. In this paper, a p... View full abstract»

• ### Optimization of Metalized Film Capacitor Connection to Reduce Stray Inductance

Publication Year: 2019, Page(s):288 - 295
| | PDF (4837 KB) | HTML

In power electronic applications, due to switching components, the inverter dc-bus generates current pulses at low frequencies and high frequencies (HFs). Usually, a dc-bus capacitor is sized to absorb the current peaks at the switching frequency and to stabilize the dc voltage. For decoupling the HF harmonics, an additional capacitor is required. This decoupling capacitor needs to have a low impe... View full abstract»

• ### A Scalable Model of On-Chip Inductor Including Tunable Dummy Metal Density Factor

Publication Year: 2019, Page(s):296 - 305
| | PDF (3050 KB) | HTML

Because of the metal density requirement in the advanced CMOS processes, dummy metal fills (DMFs) are unavoidable. The DMFs degrade the performance of the on-chip inductors, especially for the ones in the microwave and millimeter-wave circuits. This paper analyzes the impact of the floating DMFs and proposes a scalable double- $\pi$ View full abstract»

• ### Balanced-to-Balanced and Balanced-to-Unbalanced Power Dividers With Ultra-Wideband Common-Mode Rejection and Absorption Based on Mode-Conversion Approach

Publication Year: 2019, Page(s):306 - 316
| | PDF (3142 KB) | HTML

In this paper, for the first time, a balanced-to-balanced (B–B) power divider (PD) and a balanced-to-unbalanced (B–UB) PD with ultra-wideband common-mode (CM) rejection and absorption characteristics are introduced based on a new design approach. The design of B–B and B–UB PD structures is using one core circuit to provide power dividing/combining and differential-mode-to-common-mode (DM–CM) conve... View full abstract»

• ### Design and Measurement of a Novel On-Interposer Active Power Distribution Network for Efficient Simultaneous Switching Noise Suppression in 2.5-D/3-D IC

Publication Year: 2019, Page(s):317 - 328
Cited by:  Papers (1)
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In this paper, we first propose and demonstrate a novel on-interposer active power distribution network (PDN) scheme to efficiently suppress simultaneous switching noise (SSN) in a 2.5-D/3-D integrated circuit (IC). The on-interposer active PDN can change the PDN impedance by controlling on-interposer decoupling capacitors. The SSN in a 2.5-D/3-D IC is suppressed by optimal control of the on-inter... View full abstract»

• ### Near-Field Radiation Estimation and Its Reduction Using a Novel EBG for PCB

Publication Year: 2019, Page(s):329 - 335
| | PDF (1530 KB) | HTML

To investigate and quantify the radiation emission of an electronic package model, the partial element equivalent circuit method combined with the field equivalence principle is developed in this paper and used for the near-field radiation prediction. Furthermore, this paper presents a novel electromagnetic bandgap (EBG) design to suppress the electromagnetic radiation. The simulation results obta... View full abstract»

• ### Parallel Branching of Two 2-DIMM Sections With Write-Direction Impedance Matching for an 8-Drop 6.4-Gb/s SDRAM Interface

Publication Year: 2019, Page(s):336 - 342
| | PDF (2082 KB) | HTML

A parallel branching synchronous dynamic random access memory (SDRAM) channel with write-direction impedance matching (parallel branching with write-direction impedance matching (PBIM)) is proposed for an 8-drop 6.4-Gb/s SDRAM interface. The 8-drop PBIM channel consists of two parallel branches; each branch consists of a series connection of two dual in-line memory modules for a 4-drop configurati... View full abstract»

• ### An Electrohydrodynamic Jet Printing System With Metal Nanoparticle-Based Ink: Experimental Evaluation

Publication Year: 2019, Page(s):343 - 352
| | PDF (2934 KB) | HTML

This paper proposes a new inkjet printing system based on the electrohydrodynamic (EHD) method, and its performances are experimentally evaluated using the copper nano-sized particles ink. After briefly explaining the working principle of the proposed printing system, both static and dynamic characteristics of the frame structures are investigated to ensure structural stability. Then, principal co... View full abstract»

• ### Implementation of an Automatic Optical Inspection System for Solder Quality Classification of THT Solder Joints

Publication Year: 2019, Page(s):353 - 366
| | PDF (4177 KB) | HTML

Machine vision has been widely deployed in many industrial applications. However, the accuracy and maturity level for the inspection of through-hole technology (THT) solder joints have yet to reach its ultimate goal. In this paper, we have presented a detailed explanation on a set of novel algorithms that can be effectively used to implement an automatic vision system that is capable of classifyin... View full abstract»

• ### A Simple Low-Cost Electric-Contact-Assisted Alignment Method for Die Stacking on an Interposer or a Printed Circuit Board

Publication Year: 2019, Page(s):367 - 374
| | PDF (2576 KB) | HTML

We propose a new simple and low-cost alignment method utilizing electric contact for die stacking on an interposer or a printed circuit board. Without any expensive aligning/bonding equipment assisted by microscopy, we successfully stacked and bonded two silicon dies on a printed circuit board achieving alignment accuracy of $20~\mu \text{m}$ ... View full abstract»

• ### Study of Complex Looping With Five Kinks in Thermosonic Wire Bonding by Using Variable-Length Link-Spring Model

Publication Year: 2019, Page(s):375 - 379
| | PDF (2579 KB) | HTML

Complex looping with five kinks has been commonly used in the stacked die 3-D packaging and simulation models were desired to help control the loop profile in modern thermosonic wire bonding. The traditional finite-element model was time consuming and cost intensive, and the simple link-spring analysis model cannot provide precision simulation of the complex looping as it ignores the stage when th... View full abstract»

• ### The Measurement of Optical Interconnect Module Postsoldering Alignment Offsets and the Study of Its Influence on Optical Coupling Efficiency

Publication Year: 2019, Page(s):380 - 387
| | PDF (2764 KB) | HTML

In the process of the optical interconnection module soldering assembly, the mismatch of the thermal expansion coefficient between the substrate and printed circuit board would result in the production of alignment offset between light source devices and light-coupled devices, which would lead to light power loss. It is of great significance to study the optical interconnect module alignment offse... View full abstract»

• ### IEEE Open Access Publishing

Publication Year: 2019, Page(s): 388
| PDF (1294 KB)

## Aims & Scope

IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging.

Full Aims & Scope

Managing Editor
Ravi Mahajan
Intel