2005 International Symposium on Electronics Materials and Packaging

11-14 Dec. 2005

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Displaying Results 1 - 25 of 62
  • [Cover]

    Publication Year: 2005, Page(s): C1
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  • [Title page]

    Publication Year: 2005, Page(s): 1
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  • Copyright page

    Publication Year: 2005, Page(s): 1
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  • Preface

    Publication Year: 2005, Page(s): i
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  • Table of contents

    Publication Year: 2005, Page(s):iii - vi
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  • [Breaker page]

    Publication Year: 2005, Page(s): 1
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  • The story behind the red phosphorus mold compound device failures

    Publication Year: 2005, Page(s):1 - 5
    Cited by:  Papers (1)
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  • Semiconductor integrated circuit packaging technology challenges - next five years

    Publication Year: 2005, Page(s):6 - 9
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  • Gbps signal transmission on Si CMOS ULSI

    Publication Year: 2005, Page(s):10 - 14
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  • A study of hygro-thermal deformations and stresses in FCPBGA

    Publication Year: 2005, Page(s):15 - 20
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3335 KB) | HTML iconHTML

    In this paper, hygro-thermally induced deformations and stresses in a flip chip ball grid array (FCPBGA) package are evaluated. Comprehensive warpage and stress analyses are performed on the FCPBGA package by means of experimental warpage measurement using a 3D optical testing system, characterization of hygrothermal expansion and viscoelastic properties of mold compounds, and inelastic finite ele... View full abstract»

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  • [Breaker page]

    Publication Year: 2005, Page(s): 1
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  • Development of an automated X-ray inspection method for microsolder bumps

    Publication Year: 2005, Page(s):21 - 26
    Cited by:  Papers (1)  |  Patents (3)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3497 KB) | HTML iconHTML

    BGA, CSP, and flip-chip packages are widely used in printed circuit boards. These packages use an array of solder bumps as the electrical junction. To reduce the failures in manufacturing and after long-term use, solder bump inspection is strongly required for quality control. In this paper, we propose an automated inspection method for microsolder bumps using an X-ray image. The thickness, area, ... View full abstract»

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  • Reliability assessments of BGA solder joints under cyclic bending loads

    Publication Year: 2005, Page(s):27 - 32
    Cited by:  Papers (1)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3233 KB) | HTML iconHTML

    Mobile products, such as cellular phones, PDA and notebook, are subjected to many different mechanical loads, which include bending, twisting, impact shock and vibration. In this study, a cyclic bending test of the BGA package was performed to evaluate the fatigue life. Special bending tester, which was suitable for electronic package, was developed using an electromagnetic actuator. A nonlinear f... View full abstract»

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  • Case studies of reliability analysis by stochastic methodology in BGA creep analysis

    Publication Year: 2005, Page(s):33 - 36
    Cited by:  Papers (2)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2762 KB) | HTML iconHTML

    Today, structural analysis has been essential at the design stage. Most of the analyses done at the design stage are so simple that the designers find certain results under certain condition, with a simple material constant, at a certain loading conditions, although the material constants have scatters from lot to lot, the dimensions of the part are acceptable with some amount of tolerance in real... View full abstract»

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  • Fatigue crack propagation analysis for microsolder joints with void

    Publication Year: 2005, Page(s):37 - 42
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2771 KB) | HTML iconHTML

    Voids in a solder joint can reduce their fatigue life. Voids are caused by the presence of flux in solder paste during reflow soldering, and they are difficult to remove completely. From numerical analysis, we aimed to obtain criteria for evaluating the effect of voids on fatigue life in a solder joint. We investigated crack propagation in the microsolder joints of a semiconductor and developed a ... View full abstract»

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  • Reliability analysis of embedded chip technique with design of experiment methods

    Publication Year: 2005, Page(s):43 - 49
    Cited by:  Papers (2)  |  Patents (2)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3330 KB) | HTML iconHTML

    This paper presents reliability and failure analysis of embedded components on the liquid crystalline substrate. First, a demonstration module for embedded technology is fabricated. Then it is put into thermal cycling to find out the most obvious failure. 3D FEM analysis is employed to investigate the failure mode. A design of experiment method is conducted to obtain the optimal structure of embed... View full abstract»

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  • A role of Ti-Sn diffusion layer formed at the interface between Pb free solder and TiNiAu multilayer

    Publication Year: 2005, Page(s):50 - 54
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2686 KB) | HTML iconHTML

    The intermetallic compounds such as a nickel-tin (Ni-Sn) layer are formed at the interface between a solder and a backside electrode composed of a titanium/nickel/gold (Ti/Ni/Au) multilayer for power devices. In this study, a Pb-free solder was compared with a Pb-based solder and investigated the adhesion properties and the interfacial microstructures between the solders and the Ti/Ni/Au multilaye... View full abstract»

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  • In situ observation of interfacial fracture in low-dimensional nanostructures

    Publication Year: 2005, Page(s):55 - 60
    Cited by:  Papers (1)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3549 KB) | HTML iconHTML

    In order to quantitatively evaluate the interface strength of low-dimensional nanoscale components, a fracture test has been performed in a TEM (transmission electron microscope) using a special holder equipped with a small loading apparatus. The loading apparatus, which involves a 3D piezoelectric tube and a special load sensor placed behind the loading tip, allows precise control of the loading ... View full abstract»

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  • Effect of frequency on fatigue crack growth along interface between copper film and silicon substrate

    Publication Year: 2005, Page(s):61 - 66
    Cited by:  Papers (1)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2568 KB) | HTML iconHTML

    The mechanical crack growth along the interface between a submicron film (Cu) and a substrate (Si) under fatigue is experimentally investigated under two cyclic frequencies of 0.1 Hz and 1 Hz in a laboratory air (45 /spl plusmn/ 5% R.H.). A modified four-point bend specimen, which has only one interface crack to facilitate the control of crack growth, is proposed for the tests. The results reveal ... View full abstract»

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  • Effect of lead and cadmium free glasses on reliability of the silver end termination for MLCC application

    Publication Year: 2005, Page(s):67 - 73
    Cited by:  Papers (1)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2143 KB) | HTML iconHTML

    New regulations to control and manage waste disposal European Union come out with regulation like WEES (Waste from Electrical and Electronics Equipment) and RoHS (regulation of hazardous substance) use in European Union. RoHS eliminate use of hazardous elements like lead, cadmium, chromium and others form electronic equipments used and manufactured in European countries. Metech Electronic a divisi... View full abstract»

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  • The study of silicon dies stress in stacked die packages

    Publication Year: 2005, Page(s):74 - 77
    Cited by:  Patents (2)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2299 KB) | HTML iconHTML

    The purpose of the present study is to understand the overhang size effect of stacked die package on a chip. The deflection and stress in the chip as during wire bonding is evaluated using finite element model. It is considered that stresses in the part of top die over the spacer edge, and effect of the thickness on the chip is discussed. Also, this study provides stresses of the structure around ... View full abstract»

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  • A multifunctional test chip for microelectronic packaging and its application on RF property measurements

    Publication Year: 2005, Page(s):78 - 82
    Cited by:  Papers (3)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2075 KB) | HTML iconHTML

    In this paper, we developed a multifunctional test chip for property extractions on packaging design. Components in this test chip include diodes as the temperature sensor; polysilicon units as the heater; piezoresistors as the stress sensor; and pads as well as the related metal connector designs for electrical parameter extractions. To save sensor numbers and connecting wires, sensors on the tes... View full abstract»

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  • Strain measurement in the microstructure of advanced electronic packages using digital image correlation

    Publication Year: 2005, Page(s):83 - 87
    Cited by:  Papers (2)
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (2765 KB) | HTML iconHTML

    Recently, the sizes of electronic products have been decreasing rapidly, with many electronic devices embedded in print circuit boards (PCBs), a phenomenon known as system in package (SiP). In the near future, not only passive devices but also active devices are embedded in the PCBs. It is thought that stress and strain around embedded devices affects the functions of embedded devices. A measureme... View full abstract»

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  • Effects of Au and Ni layer thicknesses on the reliability of BGA solder joints

    Publication Year: 2005, Page(s):88 - 94
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (5291 KB) | HTML iconHTML

    A systematic experimental work has been carried out to understand the mechanism of Au diffusion to the solder interface as well as to investigate the effect of Au and Ni layer thickness on the reliability of BGA solder joint. BGA solder balls of Sn-37wt%Pb has been bonded on BGA solder bond pads of Au/electrolytic Ni/Cu by reflowing at 225/spl deg/C for 0.5 minutes. The thickness of the Ni layer w... View full abstract»

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  • Studies on double-layered metal bumps for fine pitch flip chip applications

    Publication Year: 2005, Page(s):95 - 100
    Request permission for reuse | Click to expandAbstract | PDF file iconPDF (3490 KB) | HTML iconHTML

    In this paper, Cu/SnAg double-layered bumps structure was proposed and investigated for the fine pitch flip chip applications. Test chip was designed considering the recent high speed memory device and its pad size and pitch was 60/spl mu/m and 100/spl mu/m, respectively. Cu and SnAg bumps were fabricated as a 60/spl mu/m and 20/spl mu/m thickness on SiO/sub 2//Ti/TiN/Al/TiW/Cu on Si wafer using t... View full abstract»

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