A Piezoresistive Silicon Accelerometer Using Porous Silicon Micromachining And Flip Chip Bonding

Recently, the development of many kinds of silicon accelerometers, based on piezoresistive, capacitive, and other sensing principles, have been reported [1-3]. These sensors are mainly fabricated using either bulk or surface micromachining techniques. In this study, porous silicon micromachining technique[4], which have many of the advantages of both bulk and surface micromacining, was used for fabrication of micromechanical structure of an accelerometer.