Integrated Fan‐Out (InFO) for High Performance Computing

3D wafer‐level system integration (WLSI) is enhanced with the introduction of system on integrated chip, a disruptive front‐end 3D integrated circuit. Under 3DFabric, all processes with chips embedding first before interconnection are called integrated fan‐out (InFO), as the fundamental manufacturing process started with chip embedding first, followed by creating fan out interconnection. InFO, chip on wafer on substrate (CoWoS), system on wafer and system‐on‐integrated‐substrate, form a universal WLSI technology family that will drive the industry to meet the future system scaling needs faced by increasingly more challenging and diversified computing requirements. Like in chip‐last CoWoS, InFO‐L uses local silicon interconnection, and InFO‐R uses redistribution layer (RDL). In the future, for logic‐to‐logic and logic‐to‐memory integration, novel ultra‐high‐density InFO (InFO_UHD) technology with submicron RDL is being developed to provide high interconnect density and bandwidth for logic‐to‐logic systems.