Electrical, Mechanical, and Thermal Co‐Design

As antenna element size and pitch are in the order of millimeters, i.e. comparable to wavelength at millimeter‐wave (mmWave) frequencies, antenna‐in‐package (AiP) solutions are more feasible for design and manufacturing than at other frequencies. This chapter first discusses the needs and challenges of performing electrical, mechanical, and thermal co‐design for AiP modules with a particular focus on mmWave front‐end module implementation in 28‐GHz high‐speed wireless data transmission applications. Furthermore, it reviews the thermal management considerations for next‐generation heterogeneous integrated systems that are also applicable to phased array front‐end modules. Different cooling methodologies are discussed for future communication devices under various power dissipation conditions. During the design iterations, simulation and measurement of key aspects such as antenna performance (bandwidth, gain, radiation patterns), cooling solutions, and warpage conditions need to be evaluated and optimized to ensure that performance meets the overall system specifications.