Tools for Fan‐Out Wafer‐Level Package Processing

This chapter discusses three critical processes for fan‐out wafer‐level packaging (FO‐WLP) technology. They are die placement, large format encapsulation, and handling of finished packages after singulation. Enabled by thin film‐based interconnects, various FO‐WLP packaging technologies such as embedded wafer‐level ball grid array, integrated fan‐out, and fan‐out chip on substrate have emerged and evolved to potentially replace many current packaging technologies from low and high density 2D packages. Large format encapsulation refers to compression molding onto a substrate that can be either 200 or 300 mm in diameter or rectangular shaped. The compression molding equipment that is currently available in the market is able to handle both of these substrate formats. The chapter outlines the advantages of using compression molding for FO‐WLP. Final packing is an important process that requires good quality output before conducting SMT placement onto a printed circuit board.