Embedded Die in Substrate (Panel‐Level) Packaging Technology

With square or rectangular panels instead of circular wafers, panel‐level packaging has more die per panel than an equivalent size round wafer with its edge and missing die losses, potentially providing significant cost savings. This chapter discusses the construction, manufacturing process, design features, system integration capability, package performance, diversities in technology, and applications of embedded die in substrate (EDS). The fan‐out panel‐level package reported in this chapter has good reliability and very low warpage. The thickness of the die can be from 35 to 100 μm, and the resin thickness can be selected from several options. The base plate for EDS consists of a metal layer and resin layers. EDS needs trace layers under the die to have pads on both sides of package, so the layers are assembled onto the base plate before die mount. The chapter also highlights three key challenges in EDS process technology.