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The available manufacturing options for 3D integration have different impact on the cost of a 3D-stacked system. Using the 3D cost model developed at imec, the cost of different technology integration options is analyzed and the cost effectiveness of different technology solutions is compared. The cost model is based on imec's 3D integration process flows and includes the cost of manufacturing equipment, fabrication facilities, personnel, and materials. A breakdown of different 3D processing steps into these costs is presented. Furthermore, the effect of different TSV geometries on system manufacturability and cost is investigated. The effectiveness of different TSV redundancy and repair approaches is evaluated and their impact on system cost is also discussed.