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3D ICs and pixel sensors: The Italian VIPIX project and the European AIDA WP3 project

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1 Author(s)
Re, V. ; INFN, Univ. of Bergamo, Bergamo, Italy

Presents a collection of slides covering the following topics: 3D integrated circuits; pixel sensors; Tezzaron vertical integration technology; microelectronics; and interconnection technology.

Published in:

3D Systems Integration Conference (3DIC), 2010 IEEE International

Date of Conference:

16-18 Nov. 2010