Packaging for Integrated Communication Microsystems

This chapter contains sections titled:

• Introduction

• Background

• Elements of a Package

• Current Chip Packaging Technologies

• Driving Forces for RF Packaging Technology

• MCM Definitions and Classifications

• RF-SOP Modules

• Package Modeling and Optimization

• Future Packaging Trends

• Chip-Package Codesign

• Package Models and Transmission Lines

• Calculations for Package Elements

• Crosstalk

• Grounding

• Practical Issues in Packaging

• Chip-Package Codesign Examples

• Wafer Scale Package

• Filters Using Bondwire

• Packaging Limitation

• Conclusion

• References

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