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This paper proposes a feed-forward type of SiP (System-in-Package) design environment to improve SiP products design. The proposed environment enables accurate performance prediction including signal integrity and thermal dispersion at initial design stages. This design environment is contributes to finding design constraints from initial package layout at early design stages. By feeding these constraints forward to later detailed design stages, extra design iterations can be removed. As the results, we can reduce the whole SiP design period by half with keeping sufficient quality.