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A tileable switch module architecture for homogeneous 3D FPGAs

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3 Author(s)
Razavi, S.A. ; Amirkabir Univ. of Technol., Tehran, Iran ; Zamani, M.S. ; Bazargan, K.

3D technology is an attractive solution for reducing wirelength in a field programmable gate array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we propose a tilable switch module architecture based on the 3D disjoint switch module for 3D FPGAs. Experimental results over 20 MCNC benchmarks show 62% reduction in the number of TSVs on average and small improvements in horizontal channel width and delay compared to the original 3D disjoint SM.

Published in:

3D System Integration, 2009. 3DIC 2009. IEEE International Conference on

Date of Conference:

28-30 Sept. 2009