Radio Frequency and Microwave Packaging

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2 Author(s)

This chapter contains sections titled:

  • Introduction and Background

  • Transmission Lines

  • High-Frequency Circuit Implementation

  • Lumped-Element Components

  • Distributed Components

  • Simulation and Circuit Layout

  • Measurement and Testing

  • Frequency-Domain Measurements

  • Time-Domain Measurements

  • Design Example

  • Summary

This chapter contains sections titled:

  • References

  • Exercises