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Advanced Interconnect Technology for 32 NM and Beyond

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1 Author(s)

This tutorial will provide an overview of advanced interconnect technologies, including dielectric materials, patterning, metallization, CMP, and packaging. New processes will be discussed, such as ultra-low K dielectrics, air-gap structures, low-damage patterning methods, thin barrier and seed layers, refractory metal capping layers, and novel CMP techniques. The effect of these processes on performance and reliability will be briefly described.

Persistent Link: http://ieeexplore.ieee.org/servlet/opac?mdnumber=EW1079

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Publication Date :

2008