Electronic packaging in the 1990s: the perspective from Europe

Electronics packaging and interconnection technologies for mainframe computers are reviewed and predictions about the development of packaging systems beyond 1995 are made. Types of packages, their assembly, wiring board technology, microwiring substrates, polyimide-copper substrates, thin-film technologies, multilayer ceramic technology, printed circuit boards, cooling technology, packaging systems, and European activities are reviewed. These include the RISH project, ESPRIT program, the national microelectronics program (NMP), the APACHIP project, the JESSI program, and the packaging project.<
>