Electronic packaging in the 1990s-a perspective from Asia

The present status and future trends in electronic packaging technologies are reviewed. Advanced modules packaged with these technologies are shown in three major applications: switching systems, transmission systems, and computer systems. Outlined are VLSI chip interconnection by the tape automated bonding (TAB) method; bump bonding; fine-pitch ceramic flat package suitable for single-chip packaging; multichip packaging using a copper-polyimide substrate for high-speed signal transmission; high-density multilayer printed circuit boards and glass ceramic boards for second-level packaging; and advanced cooling systems.<
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